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Development of Crack Detection Method with 2 Dimensionally Generated 3 Dimensionally Reconstructed Images in THT Solder Joints

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Warianty tytułu
Języki publikacji
EN
Abstrakty
EN
This work represents an interesting development in the detection and interpretation of crack evolution in through hole technology (THT) solder joints, which based on the development of general and common method. Serial sectioning is a useful method because it overcomes the problems associated with traditional two-dimensional metallographic techniques by providing information about (micro)structures in three-dimensions. In our work, serials sectioning with reconstruction method was utilized to visualize the 3D nature of cracks in through hole solder joint. Accurate quantitive analysis of the cracks, such as crack length, position and extension are presented with a help of the developed method: newly defined parameter and serial-cross sectioning method.
Twórcy
autor
  • Institute of Physical Metallurgy, Metal Forming and Nanotechnology, University of Miskolc, H-3515 Miskolc-Egyetemváros, Hungary
  • Institute of Physical Metallurgy, Metal Forming and Nanotechnology, University of Miskolc, H-3515 Miskolc-Egyetemváros, Hungary
autor
  • Pallasz Athéné University, Faculty of Gamf Technical and It, Kecskemét, Hungary
autor
  • Institute of Physical Metallurgy, Metal Forming and Nanotechnology, University of Miskolc, H-3515 Miskolc-Egyetemváros, Hungary
Bibliografia
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Uwagi
PL
Opracowanie ze środków MNiSW w ramach umowy 812/P-DUN/2016 na działalność upowszechniającą naukę (zadania 2017)
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-a62e7d20-24af-44ce-a3dc-49ae9dc7f363
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