Development of Crack Detection Method with 2 Dimensionally Generated 3 Dimensionally Reconstructed Images in THT Solder Joints

• Autorzy: Gergely G. , Koncz-Horváth D. , Weltsch Z. , Gacsi Z.

Identyfikatory

DOI

10.1515/amm-2017-0148

• Języki publikacji: EN

Abstrakty

EN

This work represents an interesting development in the detection and interpretation of crack evolution in through hole technology (THT) solder joints, which based on the development of general and common method. Serial sectioning is a useful method because it overcomes the problems associated with traditional two-dimensional metallographic techniques by providing information about (micro)structures in three-dimensions. In our work, serials sectioning with reconstruction method was utilized to visualize the 3D nature of cracks in through hole solder joint. Accurate quantitive analysis of the cracks, such as crack length, position and extension are presented with a help of the developed method: newly defined parameter and serial-cross sectioning method.

Słowa kluczowe

EN

serial sectioning; reconstruction; total crack length; TCL; through hole technology; THT

• Wydawca: Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences
• Czasopismo: Archives of Metallurgy and Materials
• Rocznik: 2017
• Tom: Vol. 62, iss. 2B
• Strony: 1033--1038
• Opis fizyczny: Bibliogr. 21 poz., rys., tab., wzory

Twórcy

autor

Gergely G.

• Institute of Physical Metallurgy, Metal Forming and Nanotechnology, University of Miskolc, H-3515 Miskolc-Egyetemváros, Hungary

autor

Koncz-Horváth D.

• Institute of Physical Metallurgy, Metal Forming and Nanotechnology, University of Miskolc, H-3515 Miskolc-Egyetemváros, Hungary

autor

Weltsch Z.

• Pallasz Athéné University, Faculty of Gamf Technical and It, Kecskemét, Hungary

autor

Gacsi Z.

• Institute of Physical Metallurgy, Metal Forming and Nanotechnology, University of Miskolc, H-3515 Miskolc-Egyetemváros, Hungary

Bibliografia

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Uwagi

PL

Opracowanie ze środków MNiSW w ramach umowy 812/P-DUN/2016 na działalność upowszechniającą naukę (zadania 2017)