Growth of copper on diatom silica by electroless deposition technique

• Autorzy: Dalagan J. Q. , Enriquez E. P. , Li L. J. , Lin C. T.
• Języki publikacji: EN

Abstrakty

EN

In this study, the growth of copper on porous diatom silica by electroless deposition method has been demonstrated for the first time. Raman peaks of copper (145, 213, and 640 cm<-1/sup>) appeared in the copper-coated, Amphora sp. and Skeletonema sp. diatom samples, confirming the successful deposition of copper. Scanning electron microscopy (SEM) indicated the presence of copper on the diatom silica surface. The 3D intricate structure of diatom was still evident by optical and scanning electron microscopy analyses when the diatom samples were immersed in the copper bath for only 5 hours. Incubating the diatom samples in the copper bath for 24 h produced a dense coating on the diatom surface and covered the intricate 3D structure of the diatom silica. These results present possibilities of the fabrication of hierarchically organized copper with 3D diatom replica structures.

Słowa kluczowe

EN

electroless deposition; porous diatom; Raman spectroscopy; diatom silica

• Wydawca: De Gruyter
• Czasopismo: Materials Science Poland
• Rocznik: 2013
• Tom: Vol. 31, No. 2
• Strony: 226--231
• Opis fizyczny: Bibliogr. 20 poz., rys., wykr.

Twórcy

autor

Dalagan J. Q.

• Chemistry Department, Xavier University-Ateneo de Cagayan, Corrales Avenue, Cagayan de Oro City, Philippines, 9000
• Department of Chemistry, Ateneo de Manila University, Loyola Heights, Quezon City, Philippines, 1108

autor

Enriquez E. P.

• Department of Chemistry, Ateneo de Manila University, Loyola Heights, Quezon City, Philippines, 1108

autor

Li L. J.

• Research Center for Applied Sciences, Academia Sinica, Taiwan, ROC, 300

autor

Lin C. T.

• Research Center for Applied Sciences, Academia Sinica, Taiwan, ROC, 300

Bibliografia

• [1] GORDON R., STERRENBURG F. A. S., SANDHAGE K. H. J., Nanosci. Nanotechnol. 5 (2005), 1.
• [2] GORDON R., LOSIC D., TIFFANY M. A., NAGY S. S., STERRENBURG F. A. S., Trends Biotechnol. 27 (2009), 116.
• [3] LOPEZ P. J., DESCLES J., ALEEN A. E., BOWLER C., Curr. Opin. Biotechnol. 16 (2005), 180.
• [4] LOSIC D., MITCHELL J. G., VOELCKER N. H., Adv.Mater. 21 (2009), 2947.
• [5] LOSIC D., ROSENGARTEN G., MITCHELL J. G., VOELCKER N. H. J., Nanosci. Nanotechnol. 6 (2006), 982.
• [6] LOSIC D., MITCHELL J. G., LAL R., VOELCKER N. H., Adv. Funct. Mater. 17 (2007), 2439.
• [7] GALE D. K., GUTU T., JIAO J., CHANG C. H., RORRER, G. L., Adv. Funct. Mater. 19 (2009), 926.
• [8] SETARO A., LETTIERI S., MADDALENA P., DE STEFANO L., Appl. Phys. Lett. 91 (2007), 051921.
• [9] LOSIC D., SHORT K., LAL R., MITCHELL J. G., VOELCKER N. H., Langmuir 23 (2007), 5014.
• [10] YU Y., MENSAH J., LOSIC D., 2010. Langmuir 26 (17), 14068.
• [11] LOSIC D., TRIANI G., EVANS P.J., ATANACIO A., MITCHELL J.G., VOELCKER N.H., J. Mater. Chem., 16 (2006), 4029
• [12] ZHU S.L., TANG L., CUI Z.D., WEI Q., YANG X.J., 2011. Surface & Coatings Technology 205, 2985.
• [13] BISMUTO A., SETARO A., MADDALENA P., DE STEFANO L., DE STEFANO M., Sensors and Actuators B, 130 (2008), 396.
• [14] LI Y., CHEN D., LU Q., QIAN X., ZHU Z., YIN J., Applied Surface Science, 241 (2005), 471.
• [15] JEFFRYES C., GUTU T., JIAO J., RORRER G., Mater Sci Eng C. 28 (2008), 1, 107.
• [16] KHRAISHEH M.A.M., AL-GHOUTI M.A., ALLEN S.J., AHMAD M.N., Water Research. 39 (2005), 922.
• [17] VRIELING E.G., BEELEN T.P.M., VAN SANTEN R.A., GIESKES W.W.C., Journal of Biotechnology 70 (1999), 39
• [18] LI N., LI X., YIN X., WANG W., QIU S., 2004. Solid State Communications 132, 841.
• [19] SATISHKUMAR G., TITELMAN L., LANDAU M.V., 2009. Journal of Solid State Chemistry 182, 2822.
• [20] XU J.F., JI W., SHEN Z.X., LI W.S., TANG S.H., YE X.R., JIA D.Z., XIN X.Q., 1999, J. Raman Spectrosc. 30, 413.