Design of Millimeter-Wave Six-Port Device for LTCC Technology

• Autorzy: Słojewska Barbara , Yashchyshyn Yevhen

Identyfikatory

DOI

10.24425/ijet.2019.130263

• Języki publikacji: EN

Abstrakty

EN

In this paper a design of millimeter-wave six-port device for LTCC (Low Temperature Cofired Ceramic) technology is presented. Furthermore, problems with implementation of the project taking into account requirements of LTCC technology are discussed.

Słowa kluczowe

EN

low temperature cofired ceramic; LTCC; microwave technology; millimeter wave; six-port network

• Wydawca: Polish Academy of Sciences, Committee of Electronics and Telecommunication
• Czasopismo: International Journal of Electronics and Telecommunications
• Rocznik: 2020
• Tom: Vol. 66, No. 1
• Strony: 37--43
• Opis fizyczny: Bibliogr. 10 poz., schem., wykr., tab.

Twórcy

autor

Słojewska Barbara

• Warsaw University of Technology, Institute of Radioelectronics and Multimedia Technology

autor

Yashchyshyn Yevhen

• Warsaw University of Technology, Institute of Radioelectronics and Multimedia Technology

Bibliografia

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• [2] J. Sobolewski and P. R. Bajurko, “Design of LTCC patch antenna for increased bandwidth and reduced susceptibility to fabrication process inaccuracies,” in 2018 22nd International Microwave and Radar Conference (MIKON), Poznan, 2018, pp. 218-221. DOI: 10.23919/MIKON.2018.8405182.
• [3] T. Jiang, “Six-port technology for millimeter-wave MIMO systems,” Masters thesis, École Polytechnique de Montréal, 2014.
• [4] A. Koelpin, et al., “Six-Port Based Interferometry for Precise Radar and Sensing Applications,” Sensors (Basel), vol. 16, no 10, Sep. 2016. DOI: 10.3390/s16101556
• [5] A. Koelpin, G. Vinci, B. Laemmle, D. Kissinger and R. Weigel, “The Six-Port in Modern Society,” in IEEE Microwave Magazine, vol. 11, no. 7, pp. 35-43, Dec. 2010. DOI: 10.1109/MMM.2010.938584.
• [6] В. И. Гвоздев, Е. И. Нефёдов, “Объемные интегральные схемы СВЧ,”, Москва, Наука, 1985.
• [7] P. R. Bajurko, “Millimeter wave permittivity and loss tangent measurements of LTCC materials,” 2016 21st International Conference on Microwave, Radar and Wireless Communications (MIKON), Krakow, 2016, pp. 1-4. DOI: 10.1109/MIKON.2016.7492104
• [8] H. W Johnson, M Graham, “High-Speed Digital Design, A Handbook of Black Magic,” 1st ed., Prentice Hall, 1993
• [9] X. Q. He, X. Ma and Y. Zhang, “Elimination of opens failure between via holes and traces in LTCC multilayer substrate by coherent shrinkage,” Proceedings of the 2001 8th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2001, Singapore, 2001, pp. 138-141. DOI: 10.1109/IPFA.2001.941472
• [10] Y. Yashchyshyn et al., “Experience in developing LTCC technologies for mm-Wave antennas,” 2017 11th European Conference on Antennas and Propagation (EUCAP), Paris, 2017, pp. 1306-1310. DOI: 10.23919/EuCAP.2017.7928083