Vapordynamic thermosyphon – heat transfer two-phase device for wide applications

• Autorzy: Vasiliev L. , Vasiliev L. , Zhuravlyov A. , Shapovalov A. , Rodin A.

Identyfikatory

DOI

10.1515/aoter-2015-0033

• Języki publikacji: EN

Abstrakty

EN

Vapordynamic thermosyphon (VDT) is an efficient heat transfer device. The two-phase flow generation and dynamic interaction between the liquid slugs and vapor bubbles in the annular minichannel of the VDT condenser are the main features of such thermosyphon, which allowed to increase its thermodynamic efficiency. VDT can transfer heat in horizontal position over a long distance. The condenser is nearly isothermal with the length of tens of meters. The VDT evaporators may have different forms. Some practical applications of VDT are considered.

Słowa kluczowe

EN

thermosyphon; vapordynamic thermosyphon; long horizontal condenser; porous coating; heat transfer intensification

PL

termosyfon; powłoka porowata; intensyfikacja wymiany ciepła

• Wydawca: Wydawnictwo Instytutu Maszyn Przepływowych PAN ; Komitet Termodynamiki i Spalania PAN
• Czasopismo: Archives of Thermodynamics
• Rocznik: 2015
• Tom: Vol. 36, no. 4
• Strony: 65--76
• Opis fizyczny: Bibliogr. 12 poz., fot., rys.

Twórcy

autor

Vasiliev L.

• Porous Media Laboratory, Luikov Heat and Mass Transfer Institute of National Academy of Sciences of Belarus, P. Brovka Str. 15, 220072 Minsk, Belarus

autor

Vasiliev L.

• Porous Media Laboratory, Luikov Heat and Mass Transfer Institute of National Academy of Sciences of Belarus, P. Brovka Str. 15, 220072 Minsk, Belarus

autor

Zhuravlyov A.

• Porous Media Laboratory, Luikov Heat and Mass Transfer Institute of National Academy of Sciences of Belarus, P. Brovka Str. 15, 220072 Minsk, Belarus

autor

Shapovalov A.

• Department of Industrial Heat-Power Engineering and Ecology, P.O.Sukhoi State Technical University of Gomel, Octiabria Ave. 48, 246746 Gomel, Belarus

autor

Rodin A.

• Department of Industrial Heat-Power Engineering and Ecology, P.O.Sukhoi State Technical University of Gomel, Octiabria Ave. 48, 246746 Gomel, Belarus

Bibliografia

• [1] GARNER S., PATEL C.: Loop thermosyphons and their applications to high density electronics cooling. IPACK’01, The Pacific Rim/ASME Int. Electronic Packaging Techn. Conf. Exhib., Kauai, Hawaii. IPACK2001-15782, 2001.
• [2] KHRUSTALEV D.: Loop thermosyphons for cooling of electronics. In: Proc. 18th Semi-therm Symposium, 2002, 145–150.
• [3] KHODABANDEH R.: Pressure drop in riser and evaporator in an advanced two-phase thermosyphon loop. Int. J. Refrig. 28(2005), 5, 725–734.
• [4] SVIRIDENKO I., SHEVELOV D.: Autonomous thermosyphon system for WWER-1000 cooldown. Heat Pipe, Sci. Technol. 2(2011), 1–4, 145–159.
• [5] DUBE V., AKBARZADEH A., ANDREWS J.: The effects of non-condensable gases on the performance of loop thermosyphon heat exchangers. Appl. Therm. Eng. 24(2004), 2439–2451.
• [6] MILANEZ F. H., MANTELLI M.B.H.: Heat transfer limit due to pressure drop of a two-phase loop thermosyphon. Heat Pipe, Sci. Technol. 1(2010), 3, 237–250.
• [7] POSSAMAI F.C., SETTER I., VASILIEV L.L.: Miniature heat pipe as compressor cooling devices. Appl. Therm. Eng. 29(2009), 3218–3223.
• [8] ALIAKHNOVICH V.A., KIREICHIK D.G., VASILIEV L.L., KONEV S.V., ZIKMAN A.B.: Cooling system for hermetic compressor based on the loop thermosyphon. In: Proc. 9th Minsk Int. Sem. Heat Pipes, Heat Pumps, Refrigerators, Power Sources 2(2011), 101-110.
• [9] VASILIEV L., ZHURAVLYOV A., SHAPOVALOV A., LITVINENKO V.: Vaporization heat transfer in porous wicks of evaporators. Arch. Thermodyn. 25(2004), 3, 47–59.
• [10] VASILIEV L., ZHURAVLYOV A., SHAPOVALOV A.: Heat transfer enhancement in mini channels with micro/nano particles deposited on a heat-loaded wall. J. Enhanc. Heat Transf. 19(2012), 3, 13–24.
• [11] VASILIEV L.L., MISHKINIS D.A., ANTUKH A.A., VASILIEV L.L. Jr.: A solar-gas solid sorption refrigerator. Adsorption 7(2001), 149–161.
• [12] VASILIEV L. et. al.: Heat-transfer device. U.S. Patent No. 45 554 966, Nov. 26, 1985.