Surface forces in chemical mechanical planarization and semiconductor wafer cleaning systems

• Autorzy: Hupka Lukasz , Nalaskowski Jakub , Miller Jan D. , Hupka Jan

Identyfikatory

DOI

10.53584/wiadchem.2021.10.5

• Języki publikacji: EN

Abstrakty

EN

Superior uniformity and local planarity of semiconductor wafers in the chemical mechanical planarization (CMP) process as well as efficient post-CMP cleaning is controlled by surface chemistry phenomena. The AFM colloidal probe technique was used to demonstrate surface forces which are of special significance to CMP and post-CMP cleaning. Examples of ways to manipulate those interactions are provided, and the benefits to CMP processes and post-CMP cleaning are discussed.

Słowa kluczowe

EN

chemical mechanical planarization; CMP; surface chemistry phenomena; colloidal probe; atomic force microscopy; AFM

• Wydawca: Polskie Towarzystwo Chemiczne
• Czasopismo: Wiadomości Chemiczne
• Rocznik: 2021
• Tom: [Z] 75, 9-10
• Strony: 1229--1240
• Opis fizyczny: Bibliogr. 23 poz., rys., wykr.

Twórcy

autor

Hupka Lukasz

• Gdansk University of Technology

• https://orcid.org/0000-0003-1616-1944

autor

Nalaskowski Jakub

• SUNY Polytechnic Institute

• https://orcid.org/0000-0002-5819-750X

autor

Miller Jan D.

• University of Utah

• https://orcid.org/0000-0003-4889-1108

autor

Hupka Jan

• Gdansk University of Technology

• https://orcid.org/0000-0002-9713-6902

Bibliografia

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• [6] J. Nalaskowski, J. Drelich, J. Hupka, J.D. Miller, Langmuir, 2003, 19, 5311.
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• [20] J. Nalaskowski, 10th International Symposium on Wafer Cleaning and Surface Preparation, Boise, ID, 2006.
• [21] Nalaskowski J., Hupka L., Miller J.D., 9th International Symposium “Surface Preparation to the Forefront: Advanced Materials and Technologies for 65nm and Below,” Boise, ID, Jun. 2005.
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• [23] L. Hupka, Particle-wafer interactions in semiaqueous silicon cleaning systems, University of Utah, Salt Lake City, 2008.

Uwagi

Opracowanie rekordu ze środków MNiSW, umowa Nr 461252 w ramach programu "Społeczna odpowiedzialność nauki" - moduł: Popularyzacja nauki i promocja sportu (2021).