Copper deposition on stainless steel sheets in copper nitrate solution

• Autorzy: Kekki A. , Aromaa J. , Forsen O.

Identyfikatory

DOI

10.5277/ppmp150122

• Języki publikacji: EN

Abstrakty

EN

The aim of this study was to examine factors that influence copper nitrate based electrorefining of copper and to search the best process parameters for high-purity copper deposition on AISI 316L steel blanks. Considering impurities, the most important goal was to minimize sulfur content in a copper cathode. The effect of Cu2+ concentration, current density, temperature and pH were studied. The best parameters for the best copper purity were sorted out. The most important factors for quality copper deposition are sufficiently low Cu2+ concentration, low current density, right zone and careful control of pH. Active nitrate ion reduction reactions catalyzed by copper ions are suggested to affect detrimentally both copper deposition current efficiency and purity. Furthermore, nitrate ion reactions seem to elevate an electrolyte pH so that the deposition appears to be dark brow copper oxide. The 6N purity for copper was not reached with this cell construction and it felled behind about 7 ppm (99.9993% Cu). Both, sulfur and silver concentration were slightly above 1 - 2 ppm. To minimize the impurities, electrolyte circulation and filtration are needed. Also, either a separate silver cementation cell or cementation membrane is needed.

Słowa kluczowe

EN

copper nitrate; electrorefining; high purity copper; hydrometallurgy

• Wydawca: Oficyna Wydawnicza Politechniki Wrocławskiej
• Czasopismo: Physicochemical Problems of Mineral Processing
• Rocznik: 2015
• Tom: Vol. 51, iss. 1
• Strony: 247--256
• Opis fizyczny: Bibliogr. 24 poz., rys., tab.

Twórcy

autor

Kekki A.

• Aalto University, School of Chemical Technology, Department of Materials Science and Technology, P.O. Box 16200, FI-00076 Aalto, Espoo Finland

autor

Aromaa J.

• Aalto University, School of Chemical Technology, Department of Materials Science and Technology, P.O. Box 16200, FI-00076 Aalto, Espoo Finland

autor

Forsen O.

• Aalto University, School of Chemical Technology, Department of Materials Science and Technology, P.O. Box 16200, FI-00076 Aalto, Espoo Finland

Bibliografia

• 1. BOUZEK, K., PAIDAR, M., ROUSAR, I., 1999. Electrochemical removal of nitrate ions in waste solutions after regeneration of ion exchange columns. Journal of Applied Electrochemistry(29): 611-617.
• 2. BRÜNING, H., HERICY, J.L., LÜCKE, K., 1985. Production of Ultra High Purity Copper by Nitrate Electrolysis and Floating Zone Melting I - II. Ann. Chim. Fr., 10: 121-133 & 521-533.
• 3. CARREAU, V., MAITREJEAN, S., VERDIER, M., BRÉCHET, Y., 2007. Evolution of Cu microstructure and resistivity during thermal treatment of damascene line: influence of line width and temperature. Microelectronic Engineering, 84(11): 2723-2728.
• 4. EPRON, F., GAUTHARD, F., BARBIER, J., 2003. Palladium and platinum-based catalysts in the catalytic reduction of nitrate in water: effect of copper, silver, or gold addition. Journal of Catalysis, 220: 182-191.
• 5. FENG, H.P., LIN, J.Y., CHENG, M.Y., WANG, Y.Y., WAN, C.C., 2008. Behaviour of Copper Removal by CMP and Its Correlation to Deposit Structure and Impurity Content. Journal of The Electrochemical Society, 155(1): H21-H25.
• 6. FILIMONOV, E.V., SHCHERBAKOV, A.I., 2004. Catalytic Effect of Copper Ions on Nitrate Reduction. Protection of Metals, 40(3): 304-309.
• 7. GRENTHE, I., WANNER, H., ÖSTHOLS, E., 2000. Guidelines for the Extrapolation to Zero Ionic Strenght, TDB-2. OECD Nuclear Energy Agency.
• 8. KATO, M., 1991. High conductivity copper alloys with excellent workability and heat resistance. Nippon Mining Co. Ltd. Tokio, Japan.
• 9. KATO, M., 1995. The Production of Ultrahigh-Purity Copper for Advanced Applications. JOM Journal of the Minerals, Metals and Materials Society, 47(12): 44-46.
• 10. KIM, D.S., CHOI, J.Y., 2003. Production of ultrahigh purity copper using waste copper nitrate solution. Journal of Hazardous Materials(B 99): 147-158.
• 11. KIM, N.-H., KIM, S.-Y., LEE, W.-S., CHANG, E.-G., 2007. Electromigration charasteristics in dual-damascene copper interconnects by difference of via structures. Microelectronic Engineering, 84(11): 2663-2668.
• 12. KYRIACOU, G., POLATIDES, C., 2005. Electrochemical reduction of nitrate ion on various cathodes - reaction kinetics on bronze cathode. Journal of Applied Electrochemistry(35): 421-427.
• 13. LOBO, V.M.M., 1989. Handbook of electrolyte solutions; Part A. Elsevier Science, Amsterdam-Oxford-New York-Tokyo, 1168 pp.
• 14. MASAKI, M., MASAHARU, I., 2005. High-purity electrolytic copper and its production method. Mitsubishi Materials Corp., Japan.
• 15. MOCKRIN, I., HOBIN, M.A., 1977. Recovery of copper from waste nitrate liquors by electrolysis. Kawecki Beryico Industries, Inc., U.S.
• 16. MOREAU, S., MAITREJEAN, S., PASSEMARD, G., 2007. Fatigue of damascene copper lines under cyclic electrical loading. Microelectronic Engineering, 84(11): 2658-2662.
• 17. OGATA, T., KATO, M., KAWASUMI, Y., TOMINAGA, C., TANAKA, K., 1989. Method for producing high purity electrolytic copper. Nippon Mining Co. Ltd. Tokio, U.S.
• 18. OHMORI, T., EL-DEAB, M.S., OSAWA, M., 1998. Electroreduction of nitrate ion to nitrite and ammonia on a gold electrode in acidic and basic sodium and cesium nitrate solutions. Journal of Electroanalytical Chemistry, 470: 46-52.
• 19. OJEBUOBOH, F., MICHELS, H.T., 2004. High-Purity copper for semiconductor applications, Copper 2003 - Cobre 2003; Fifth International Conference Canadian Institute of Mining, Metallurgy and Petroleum, Santiago, Chile, pp. 517-530.
• 20. POLATIDES, C., DORTSIOU, M., KYRIACOU, G., 2005. Electrochemical removal of nitrate ion from aqueous solution by pulsing potential electrolysis. Electrochimica Acta(50): 5237-5241.
• 21. SHINDO, Y. , TAKEMOTO, K., 2005. Ultrahigh-purity copper and process for producing the same. Nippon mining & metals Co., Ltd. Tokyo, Japan.
• 22. SHRIVER, D.F., ATKINS, P.W., 1999. Inorganic Chemistry 3rd edition. Oxford University Press, Oxford, 763 pp.
• 23. TAKAHASHI, K., KANO, O., 2002. High-purity copper sputtering targets and thin films. Japan Energy Corporation, U.S.
• 24. VAZQUEZ-ARENAS, J., VAZQUEZ, G., MELENDEZ, A.M., GONZÁLES, I., 2007. The Effect of the Cu2+/Cu+ Step on Copper Electrocrystallization in Acid Noncomplexing Electrolytes. Journal of The Electrochemical Society, 154(9): D473-D481.