Role of layer thickness on the damage mechanism in the LPBFed copper alloy

• Autorzy: Kumar M. Saravana , Jeyaprakash N. , Yang Che-Hua

Identyfikatory

DOI

10.1007/s43452-024-00983-w

• Języki publikacji: EN

Abstrakty

EN

Parts with interior voids created by the LPBF process are known to have the potential to cause fracture when subjected to mechanical loading. In this research, the key process parameters such as laser thickness (LT), scanning speed (SS), and laser power (LP) were taken into consideration to avoid the void formations which was the major reason for affecting the structural integrity. So, void formations (V), ultimate tensile strength (UTS) and reduced modulus (RM) were considered as the response parameters in this study. The entropy-associated weighted aggregated sum product assessment (WASPAS) approach was implemented to examine the favorable conditions which substantiated that the LT is the most influential parameter in nucleation of voids. The verification experiments prove that the void formation was reduced by 98.6% and the UTS and RM were enhanced by 52.17 and 31.7%.

Słowa kluczowe

EN

layer thickness; laser; voids; optimization; tensile

PL

laser; optymalizacja; rozciąganie

• Wydawca: Springer ; Wrocław University of Science and Technology
• Czasopismo: Archives of Civil and Mechanical Engineering
• Rocznik: 2024
• Tom: Vol. 24, no. 3
• Strony: art. no. e171, 2024
• Opis fizyczny: Bibliogr. 36 poz., rys., tab., wykr.

Twórcy

autor

Kumar M. Saravana

• Graduate Institute of Manufacturing Technology, National Taipei University of Technology, Taipei 10608, Taiwan

• https://orcid.org/0000-0001-8564-5905

autor

Jeyaprakash N.

• School of Mechanical and Electrical Engineering, China University of Mining and Technology, Xuzhou 221116, China

autor

Yang Che-Hua

• Graduate Institute of Manufacturing Technology, National Taipei University of Technology, Taipei 10608, Taiwan

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Uwagi

Opracowanie rekordu ze środków MNiSW, umowa nr POPUL/SP/0154/2024/02 w ramach programu "Społeczna odpowiedzialność nauki II" - moduł: Popularyzacja nauki (2025)