Biodegradable shellac-based substrates of various types for transient printed electronics

• Autorzy: Cichocki-Łukasiewicz Radosław , Synkiewicz-Musialska Beata , Zachariasz Piotr , Kołaszczyński Grzegorz , Uppuluri Kiranmai , Kula Karolina , Skwarek-Łukasiewicz Agata

Identyfikatory

DOI

10.24425/ijet.2025.153551

• Języki publikacji: EN

Abstrakty

EN

This work reports on the synthesis and properties of various shellac-based substrates for microelectronics applications. The analysis of the materials included temperature resistance and water solubility inspection. Low dielectric constant and dissipation factor as same as good integration of screen printed electrodes observed during SEM analysis, confirmed potential of shellac-based materials as substrates for transient, environmentally friendly electronic devices.

Słowa kluczowe

EN

biodegradable electronics; shellac; dielectric substrates; printed electronics

• Wydawca: Polish Academy of Sciences, Committee of Electronics and Telecommunication
• Czasopismo: International Journal of Electronics and Telecommunications
• Rocznik: 2025
• Tom: Vol. 71, No. 1
• Strony: 107--112
• Opis fizyczny: Bibliogr. 9 poz., fot., rys.

Twórcy

autor

Cichocki-Łukasiewicz Radosław

• Łukasiewicz Research Network – the Institute of Microelectronics and Photonics

• https://orcid.org/0000-0002-4667-8445

autor

Synkiewicz-Musialska Beata

• Cracow University of Technology

• https://orcid.org/0000-0001-5772-8383

autor

Zachariasz Piotr

• Łukasiewicz Research Network – the Institute of Microelectronics and Photonics

• https://orcid.org/0000-0002-7776-4418

autor

Kołaszczyński Grzegorz

• Łukasiewicz Research Network – the Institute of Microelectronics and Photonics

autor

Uppuluri Kiranmai

• Łukasiewicz Research Network – the Institute of Microelectronics and Photonics

autor

Kula Karolina

• Cracow University of Technology

• https://orcid.org/0000-0001-9991-3077

autor

Skwarek-Łukasiewicz Agata

• Łukasiewicz Research Network – the Institute of Microelectronics and Photonics

Bibliografia

• [1] M. Irimia-Vladu, E. D. Głowacki, G. Voss, S. Bauer, N.S. Sariciftci, “Green and biodegradable electronics”, Materials Today, vol. 15, no.7-8, pp. 340-346, 2012. https://doi.org/10.1016/S1369-7021(12)70139-6
• [2] Y. Cao, K. E. Uhrich, “Biodegradable and biocompatible polymers for electronic applications: A review”, Journal of Bioactive and Compatible Polymers, vol. 34, no.1, pp. 3-15, 2018. https://doi.org/10.1177/0883911518818075
• [3] H. Liu, R. Jian, H. Chen, X. Tian, C. Sun, J. Zhu, C. Wang, “Application of biodegradable and biocompatible nanocomposites in electronics: current status and future directions”, Nanomaterials, vol. 9, no.7, pp. 950, 2019. https://doi.org/10.3390/nano9070950
• [4] J. Li, J. Liu, W. Huo, J. Yu, X. Liu, M. J. Haslinger, X. Huang, “Micro and nano materials and processing techniques for printed biodegradable electronics”, Materials Today Nano, vol. 18, pp. 100201, 2022. https://doi.org/10.1016/j.mtnano.2022.100201
• [5] M. Irimia-Vladu, E. D. Głowacki, G. Schwabegger, L. Leonat, H. Z. Akpinar, H. Sitter, N.S. Sariciftci, “Natural resin shellac as a substrate and a dielectric layer for organic field-effect transistors”, Green Chemistry, vol. 15, no.6, pp. 1473-1476, 2013. https://doi.org/10.1039/C3GC40388B
• [6] K. Y. Mitra, A. Willert, R. Chandru, R.R. Baumann, R. Zichner, “Inkjet printing of bioresorbable materials for manufacturing transient microelectronic devices”, Advanced Engineering Materials, vol. 22, no.12, pp. 2000547, 2020. https://doi.org/10.1002/adem.202000547
• [7] M. Irimia-Vladu, “Green electronics: biodegradable and biocompatible materials and devices for sustainable future”, Chemical Society Reviews, vol. 43, no.2, pp. 588-610, 2014. https://doi.org/10.1039/C3CS60235D
• [8] M. Baumgartner, F. Hartmann, M. Drack, D. Preninger, D. Wirthl, R. Gerstmayr, M. Kaltenbrunner, “Resilient yet entirely degradable gelatin-based biogels for soft robots and electronics”, Nature Materials, vol. 19, no.10, pp. 1102-1109, 2020. https://doi.org/10.1038/s41563-020-0699-3
• [9] A. Poulin, X. Aeby, G. Siqueira, G. Nyström, “Versatile carbon-loaded shellac ink for disposable printed electronics”, Scientific Reports, vol. 11, no.1, pp. 23784, 2021. https://doi.org/10.1038/s41598-021-03075-4

Uwagi

1. Opracowanie rekordu ze środków MNiSW, umowa nr POPUL/SP/0154/2024/02 w ramach programu "Społeczna odpowiedzialność nauki II" - moduł: Popularyzacja nauki (2025).

2. This work was supported by the National Science Centre Poland financed the work under project CHIST-ERA IV Programme (EU Horizon 2020 Research and Innovation Programme, under Grant Agreement no. 857925, UMO-2021/03/Y/ST7/00016). The work was also financed by the statutory funds at Łukasiewicz–Institute of Microelectronics and Photonics in 2024 (project No. 500-44200177).