Laser prototyping of printed circuit boards

• Autorzy: Nowak M. R. , Antończak A. J. , Kozioł P. E. , Abramski K. M.

Identyfikatory

DOI

10.2478/s11772-013-0096-4

• Języki publikacji: EN

Abstrakty

EN

This paper describes the application of laser micromachining to rapid prototyping of printed circuit boards (PCB) using nanosecond lasers: the solid-state Nd:YAG (532/1064 nm) laser and the Yb:glass fiber laser (1060 nm). Our investigations included tests for various mask types (synthetic lacquer, light-sensitive emulsion and tin). The purpose of these tests was to determine some of the basic parameters such as the resolution of PCB prototyping, speed of processing and quality of PCB mapping with commonly available laser systems. Optimization of process parameters and the proposed conversion algorithm have allowed us to produce circuit boards with a resolution similar to that of the Laser Direct Imaging (LDI) technology.

Słowa kluczowe

EN

printed circuit board; PCB; rapid prototyping; laser micromachining; Nd:YAG laser; Yb:glass fiber laser

• Wydawca: Stowarzyszenie Elektryków Polskich ; Polska Akademia Nauk ; Wojskowa Akademia Techniczna im. Jarosława Dąbrowskiego
• Czasopismo: Opto-Electronics Review
• Rocznik: 2013
• Tom: Vol. 21, No. 3
• Strony: 320--325
• Opis fizyczny: Bibliogr. 4 poz., il., tab.

Twórcy

autor

Nowak M. R.

• Faculty of Electronics, Wroclaw University of Technology, 27 Wybrzeze Wyspianskiego Str., 50-370 Wroclaw, Poland

autor

Antończak A. J.

• Faculty of Electronics, Wroclaw University of Technology, 27 Wybrzeze Wyspianskiego Str., 50-370 Wroclaw, Poland

autor

Kozioł P. E.

• Faculty of Electronics, Wroclaw University of Technology, 27 Wybrzeze Wyspianskiego Str., 50-370 Wroclaw, Poland

autor

Abramski K. M.

• Faculty of Electronics, Wroclaw University of Technology, 27 Wybrzeze Wyspianskiego Str., 50-370 Wroclaw, Poland

Bibliografia

• 1. G. Koziol and W. Steplewski, “Laser applications in high density interconnect PCB technology” - (in Polish), Elektronika - konstrukcje, technologie, zastosowania, 49, 43-47 (2008).
• 2. D. J. Meier and S. H. Schmidt “PCB laser technology for rigid and flex hdi - via formation, structuring, routing”, LPKF Laser & Electronics AG Garbsen, http://www.lpkfusa.com/articles/hdi/pcb_laser_technology.pdf.
• 3. R. Barbucha, M. Kocik, J. Mizeraczyk, G. Kozioł, and J. Borecki, “Laser Direct Imaging of tracks on PCB covered with laser photoresist”, Bulletin of the Polish Academy of Sciences Technical Sciences, 56, 17-20 (2008).
• 4. A. Süllau and A. Wiemers, Laser Direct Imaging, ILFA Publications, (1999), http://www.ilfa.de/blobs/Laser_Direct_Imaging.pdf.