A hydrometallurgical process for the recovery of copper metal and nickel hydroxide from the aqua regia leaching solutions of printed circuit boards

• Autorzy: Nguyen Thi Nhan Hau , Wen Jiangxian , Lee Man Seung

Identyfikatory

DOI

10.37190/ppmp/191551

• Języki publikacji: EN

Abstrakty

EN

Leaching solutions of printed circuit boards (PCBs) contain noble and base metal ions. The precious metal ions present in the leaching solutions of PCBs could be separated by cementation with copper metal. After recovery of precious metal ions by cementation, the filtrate contains Cu(II) together with base metal ions like Al(III), Fe(III), Fe(II), Ni(II), Sn(II), and Zn(II). In this work, separation experiments were conducted to recover Cu(II) and Ni(II) from the filtrate. First, copper ions were completely separated from the filtrate by chemical reduction with hydrazine at the following conditions: a molar ratio of 8 for hydrazine to Cu(II), 20°C, 500 rpm, and 20 mins. By adding sodium oxalate to the solution after separation of Cu(II), most of the Ni(II) and 38% of the Zn(II) were co-precipitated at 20°C, 60 mins, 500 rpm, and a molar ratio of 20 for sodium oxalate to nickel. After dissolving the coprecipitates of Ni(II) and Zn(II) oxalates in a 0.5 M HCl solution, the Zn(II) was completely removed from the solution by a five-stage cross-current extraction with 2.5 M Cyanex 272. Nickel hydroxides were then recovered from the raffinate by precipitation with NaOH. The purity of the copper metal and nickel hydroxides was higher than 99%. A process was proposed to recover Au(III), Pd(II), Cu(II), and Ni(II) from the leaching solutions of PCBs.

Słowa kluczowe

EN

e-waste recycling; separation; recovery; copper metal; nickel hydroxide

• Wydawca: Oficyna Wydawnicza Politechniki Wrocławskiej
• Czasopismo: Physicochemical Problems of Mineral Processing
• Rocznik: 2024
• Tom: Vol. 60, iss. 4
• Strony: art. no. 191551
• Opis fizyczny: Bibliogr. 35 poz., rys., tab., wykr.

Twórcy

autor

Nguyen Thi Nhan Hau

• Department of Advanced Materials Science & Engineering, Mokpo National University, Chonnam 534-729, Korea

autor

Wen Jiangxian

• Department of Advanced Materials Science & Engineering, Mokpo National University, Chonnam 534-729, Korea

autor

Lee Man Seung

• Department of Advanced Materials Science & Engineering, Mokpo National University, Chonnam 534-729, Korea

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