Perspektywy i kierunki rozwoju bezołowiowych stopów lutowniczych nowej generacji oraz możliwość ich aplikacji w technologii bezołowiowego lutowania elektroniki użytkowej

Kudyba, A.

doi:10.7356/iod.2016.17

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Tytuł artykułu

Perspektywy i kierunki rozwoju bezołowiowych stopów lutowniczych nowej generacji oraz możliwość ich aplikacji w technologii bezołowiowego lutowania elektroniki użytkowej

Autorzy

Kudyba A.

Treść / Zawartość

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DOI

10.7356/iod.2016.17

Warianty tytułu

Perspectives and directions of the development of new generation lead-free soldering alloys and their application possibilities in the consumer electronics lead-free soldering technology

Języki publikacji

PL EN

Abstrakty

Nowe wyzwania technologiczne oraz duży potencjał ekonomiczny i komercyjny związany z opracowaniem nowej generacji stopów lutowniczych stosowanych w technologii lutowania bezołowiowego elektroniki użytkowej to temat, który zyskuje coraz szersze zainteresowanie zarówno w przemyśle elektronicznym, jak i w środowisku akademickim. Niniejsza praca stanowi przegląd oraz analizę literatury w zakresie badań nad zaawansowanymi bezołowiowymi stopami lutowniczymi nowej generacji, które potencjalnie mogłyby stanowić zamiennik dla obecnie stosowanych i drogich stopów bezołowiowych na bazie układu Sn-Ag-Cu (SAC). Na podstawie analizy literaturowej określono i scharakteryzowano główne grupy układów, które znajdują się w obszarze zainteresowania nowych materiałów – potencjalnych zamienników bezołowiowych lutowi typu SAC. Praca stanowi kompilację dotychczasowej wiedzy dotyczącej szerokiego spektrum właściwości obecnie stosowanych lutowi bezołowiowych typu SAC, jak również ich potencjalnych zamienników z układów: Sn-Zn, Bi-Sn. W pracy przedstawiono analizę porównawczą wpływu wybranych dodatków stopowych, topników i temperatury na lutowność oraz zwilżalność stopów lutowniczych w kontakcie z wybranymi typami podłoży, oraz na zmianę mikrostruktury, właściwości mechanicznych i niezawodności wytworzonych połączeń. Przegląd kończy się podsumowaniem określającym perspektywy oraz wytycza nowe kierunki rozwoju bezołowiowych stopów lutowniczych nowej generacji, które mogłyby zostać wdrożone w technologii lutowania bezołowiowego elektroniki użytkowej jako zamiennik obecnie stosowanych lutowi typu SAC.

The new technological challenges and the high economical and commercial potential connected with the development of new generation soldering alloys used in the consumer electronics lead-free soldering technology is a subject which is gaining increasing interest both on the side of the electronics industry and the academic community. This study constitutes a review and analysis of the literature in the scope of investigations of new generation advanced lead-free soldering alloys which could potentially replace the currently applied, expensive, lead-free solders based on the Sn-Ag-Cu (SAC) system. On the basis of the literature analysis, the authors determined and characterized the main system groups which are within the focus of interest as new potential replacements for the SAC-type lead-free solders. The study constitutes a compilation of the current knowledge of the broad spectrum of properties of the presently applied lead-free solders of the SAC type as well as their potential replacements from the Sn-Zn and Bi-Sn systems. The work presents a comparative analysis of the effect of selected alloy additions, fluxes and temperatures on the solderability and wettability of soldering alloys in contact with selected types of substrates, as well as change in the microstructure, mechanical properties and reliability of the produced joints. The review is summed up by the description of the perspectives and new trends in the development of new generation lead-free soldering alloys which could be implemented into the consumer electronics lead-free soldering technology as replacements for the currently applied SAC-type solders.

Słowa kluczowe

lutowia bezołowiowe lutowia typu SAC stop lutowniczy Sn-Zn stop lutowniczy Bi-Sn zwilżalność lutowność

lead-free solders SAC-type solders Sn-Zn soldering alloy Bi-Sn soldering alloy wettability solderability

Wydawca

Instytut Odlewnictwa

Czasopismo

Prace Instytutu Odlewnictwa

Rocznik

2016

Tom

Vol. 56, no. 3

Strony

233--260

Opis fizyczny

Bibliogr. 89 poz., rys., tab.

Twórcy

autor

Kudyba A.

artur.kudyba@iod.krakow.pl

Instytut Odlewnictwa, Centrum Badań Wysokotemperaturowych, ul. Zakopiańska 73, 30-418 Kraków

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