Processing of printed circuit boards using a 532 nm green laser

• Autorzy: Ciszewski Piotr , Sochacki Mariusz

Identyfikatory

DOI

10.24425/opelre.2020.135258

• Języki publikacji: EN

Abstrakty

EN

The paper describes a research on assessing the quality of edges resulting from the interaction of laser pulses with a material of rigid and flexible printed circuits. A modern Nd:YVO4 crystal diode-pumped solid-state laser generating a 532 nm wavelength radiation with a nanosecond pulse time was used for the research. Influence of laser parameters such as beam power and pulse repetition frequency on a heat affected zone and carbonization was investigated. Quality and morphology of laser-cut substrates were analyzed by optical microscopy. High quality laser cutting of printed circuit board substrates was obtained without delamination and surface damage, with a minimal carbonization and heat affected zone. The developed process was implemented on the printed circuit assembly line.

Słowa kluczowe

EN

laser cutting; flexible printed circuits; heat affected zone; HAZ

• Wydawca: Stowarzyszenie Elektryków Polskich ; Polska Akademia Nauk ; Wojskowa Akademia Techniczna im. Jarosława Dąbrowskiego
• Czasopismo: Opto-Electronics Review
• Rocznik: 2020
• Tom: Vol. 28, No. 4
• Strony: 197--202
• Opis fizyczny: Bibliogr. 15 poz., tab., rys.

Twórcy

autor

Ciszewski Piotr

• Institute of Microelectronics and Optoelectronics, Warsaw University of Technology, 75 Koszykowa St., 00-662 Warsaw, Poland.
• Semicon Sp. z o.o., 43/43A Zwolenska St., 04-761 Warsaw, Poland.

• https://orcid.org/0000-0002-1853-8082+

autor

Sochacki Mariusz

• Institute of Microelectronics and Optoelectronics, Warsaw University of Technology, 75 Koszykowa St., 00-662 Warsaw, Poland.
• Semicon Sp. z o.o., 43/43A Zwolenska St., 04-761 Warsaw, Poland.

• https://orcid.org/0000-0001-5389-8588

Bibliografia

• [1] Meier, D. J. & Schmidt, S. H. PCB Laser Technology for Rigid and Flex HDI: Via Formation, Structuring, Routing. in Proceedings of IPC Printed Circuits Expo, 22–26 (2002).
• [2] Hsu, H. C. et al. Cutting PCB with a 532nm DPSS green laser. in 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) 339–341 (2014). https://doi.org/10.1109/IMPACT.2014.7048428.
• [3] Hüske, M. Burr and Stress-Free Cutting of Flexible Printed Circuits. On Board Technology 6, 18-21 (2006).
• [4] Tamhankar, A. & Patel, R. Investigating PCB Processing Using Q Switched DPSS Nanosecond Green Laser. in 31st International Congress on Applications of Lasers and Electro-Optics (ICALEO 2012) (2012). https://doi.org/10.2351/1.5062386
• [5] Lawrence, J. Advances in Laser Materials Processing. (Elsevier Ltd., 2018). https://doi.org/10.1016/C2015-0-05718-5
• [6] Hahn, Ch. et al. Green Beats UV: New Solutions for Depaneling & Pcb Cutting. The Laser User 82, 22–23 (2016).
• [7] Oosterhof, A. & Gonzalez, J. Investigation of Cutting Quality and Mitigation Methods for Laser Depaneling of Printed Circuit Boards, (2019). Available at: https://smtnet.com/library/files/upload/pcb-laser-depaneling-quality.pdf
• [8] Patel, R., Bovatsek J. & Tamhankar, A. Pulse Control in High-Power UV Laser Enables New Micromachining Options. Laser Focus World 49, 49–53 (2013).
• [9] Illyefalvi-Vitéz, Z., Ruszinkó, M. & Pinkola, J. Laser Drilling and Pattern Processing for MCM-L Prototyping, The International Journal of Microcircuits and Electronic Packaging 21, 349354 (1998).
• [10] Bluebean Optical Tech Ltd.: Nd:YVO4 Crystal Properties and Applications. Available at http://www.bbotech.com/product. php?cid=93 (Accessed: 04th June 2020).
• [11] ITI Electro-Optics Corp.: High Purity Nd: YVO4 Laser Crystals. Available at: https://www.photonicsonline.com/doc/high-purity-ndyvo4-laser-crystals-0001. (Accessed: 04th June 2020).
• [12] Precision Micro-Optics Inc. Neodymium Doped Yttrium Orthvanadate (Nd:YVO4) (2016). Avalible at: http://www.pmoptics.com/neodymium_doped_yvo4.html. (Accessed: 04th June 2020).
• [13] Wang, X. C. & Zheng, H. Y. High quality laser cutting of electronic printed circuit board substrates, Circuit World 35, 46-55 (2009). https://doi.org/10.1108/03056120911002415
• [14] Henry, M., Harrison, P., Wendland, J. & Parsons-Karavassilis, D. Cutting flexible printed circuit board with a 532 nm Q-switched diode pumped solid state laser. in Proceedings of ICALEO, (2005)
• [15] InnoLas Photonics GmbH: Blizz, Avalible at: https://www.innolas-photonics.com/Products/Q-Switched/BLIZZ.html?s=269226BD85EE29914629B02E19CAE3C983BC3A26. (Accessed: 04th June 2020).

Uwagi

1. Opracowanie rekordu ze środków MNiSW, umowa Nr 461252 w ramach programu "Społeczna odpowiedzialność nauki" - moduł: Popularyzacja nauki i promocja sportu (2021). 2. The research leading to these results has received funding from the project: “Innovative technologies for assembling components on flexible substrates for critical applications, the Internet of Things and Industry 4.0”-POIR.01.01.01-00-1083/17-00.