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Influence of point defects and grains size on the course of reversible martensite transformation in melt spun ribbons of the copper based alloys

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Języki publikacji
EN
Abstrakty
EN
Purpose: In the paper Cu-Al-Ni-(Mn, Ti) alloys exhibiting the shape memory effect were studied. For the investigated alloys the characteristic temperatures of the reversible martensitic transformation, the influence of grains size and vacancy concentration on the course of the transformation were examined. Design/methodology/approach: Using the resistometric method it was shown that the characteristic temperatures of the reversible martensite transformation strongly depend on the grains size. Findings: For Cu-Al-Ni alloy the activation energy of migration of monovacancies and the pre-exponential factor of the Arrhenius equation were determined as [wzór], respectively. Practical implications: The paper shows that the investigated alloys can be used as important functional or the so-called intelligent materials (actuators, sensors). Originality/value: The parameters of the electronic structure - i.e. the coefficient of conduction electron scattering at grain boundaries, the mean free path, the coefficient of reflection of conduction electrons at grain boundaries, and the electrical resistivity for Cu-Al-Ni in the martensite and parent phase were determined.
Rocznik
Strony
30--34
Opis fizyczny
Bibliogr. 15 poz., tab., wykr.
Twórcy
  • Institute of Material Science, University of Silesia, ul. Bankowa 12, 40-007 Katowice, Poland
  • Institute of Material Science, University of Silesia, ul. Bankowa 12, 40-007 Katowice, Poland
autor
  • Institute of Material Science, University of Silesia, ul. Bankowa 12, 40-007 Katowice, Poland
Bibliografia
  • [1] J. Dutkiewicz, J. Morgiel, Z. Czeppe, E. Cesari, J. Phys. IV 7, (1997) 167-169.
  • [2] J. Dutkiewicz, Z. Czeppe , J. Morgiel, Mater. Sci. Eng. A273-275 (1999) 703-707.
  • [3] L.A. Dobrzański, Metal Engineering Materials, WNT, Warszawa 2004 (in Polish).
  • [4] G. Lojen, I. Anzel, A. Kneissl, Akrizman, E. Unterweger, B. Kosec, M. Bizjak, J. Mater. Processing Technology 162-163 (2005) 220-229.
  • [5] H. Morawiec, J. Lelątko, D. Stróż, M. Gigla, Mat. Scien. Eng. A273-275 (1999) 708-712.
  • [6] S.M. Tang, C.Y. Chung, W.G. Liu, J. Mater. Processing Technology 63 (1997) 307-312.
  • [7] B. Kostrubiec, P. Kwapuliński, J. Rasek, Physics and Chemistry of Metals, 15 (1998) 22-43, Silesian University in Katowice.
  • [8] B. Kostrubiec, J. Rasek, R. Wiśniewski, H. Morawiec, Solid State Phenomena 89 (2003) 287-292.
  • [9] T. Górecki, M. Kostrzewa, Acustica 77 (1993) 293-296.
  • [10] K. Książek, T. Górecki, J. Mater. Sci. 20 (2001) 1623-1625.
  • [11] B. Kostrubiec, J. Rasek, A. Salamon, H. Morawiec, J. Mater. Sci. 37 (2002) 369-373.
  • [12] H. Asato, T. Hosino, J. Magn. Magn. Mater. 272-276 (2004) 1372-1373
  • [13] J. Rasek, Some diffusion phenomena in crystalline and amorphous metals (in Polish), Silesian University Katowice 2000.
  • [14] P.L. Rositer, The Electrical Resistivity of Metals and Alloys, Cambridge University Press, Cambridge 1987.
  • [15] J. Rasek, P. Kwapuliński, Z. Gierak, Europa Metali-LMI, Italy 1990, 1 (1990) 142-145.
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-83e5b57e-4f83-4d3a-a413-a023f6e46c58
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