Die Attachment Method on a Cu Finish by Pressure-Assisted Sinter Bonding in Air Using Cu Formate Paste

• Autorzy: Jo Kyeong Hwan , Lee Jong-Hyun

Identyfikatory

DOI

10.24425/amm.2020.133217

• Języki publikacji: EN

Abstrakty

EN

A paste containing Cu(II) formate rods was prepared, and characteristics of sinter bonding at 250°C under a pressure of 10 MPa were investigated to accomplish a high-speed die attachment for wide-bandgap power chips on Cu finish in air. Synthesisn of the plate-type Cu formate particles from CuO was accomplished through a wet reaction for 180 min. Cu, formed in situ in the bondline by pyrolysis of the formate during heating for the attachment, was sufficiently active to lead high-speed sintering within a carbon dioxide-hydrogen atmosphere derived from the pyrolysis, and the oxide layer on the Cu finish was reduced by the hydrogen. As a result, sinter bonding for 10 min formed a robust bonding with a shear strength approaching 27 MPa.

Słowa kluczowe

EN

die attach; Cu formate paste; sinter bonding; Cu finish; shear strength

• Wydawca: Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences
• Czasopismo: Archives of Metallurgy and Materials
• Rocznik: 2020
• Tom: Vol. 65, iss. 3
• Strony: 1057--1061
• Opis fizyczny: Bibliogr. 26 poz., fot., rys.

Twórcy

autor

Jo Kyeong Hwan

• Seoul National University of Science and Technology, Department of Materials Science and Engineering, 232 Gongneung-ro, Nowon-gu, Seoul 139-743, Republic of Korea

autor

Lee Jong-Hyun

• Seoul National University of Science and Technology, Department of Materials Science and Engineering, 232 Gongneung-ro, Nowon-gu, Seoul 139-743, Republic of Korea

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Uwagi

EN

1. This study was supported by the Research Program (U2019-0057) funded by the SeoulTech (Seoul National University of Science and Technology).

PL

2. Błędna numeracja bibliografii.

PL

3. Opracowanie rekordu ze środków MNiSW, umowa Nr 461252 w ramach programu "Społeczna odpowiedzialność nauki" - moduł: Popularyzacja nauki i promocja sportu (2020).