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Effect of Pd-P Layer on the Bonding Strength of Bi-Te Thermoelectric Elements

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Języki publikacji
EN
Abstrakty
EN
In this study, the effect of electroless Pd-P plating on the bonding strength of the Bi-Te thermoelectric elements was investigated. The bonding strength was approximately doubled by electroless Pd-P plating. Brittle Sn-Te intermetallic compounds were formed on the bonding interface of the thermoelectric elements without electroless Pd-P plating, and the fracture of the bond originated from these intermetallic compounds. A Pd-Sn solder reaction layer with a thickness of approximately 20 μm was formed under the Pd-P plating layer in the case of the electroless Pd-P plating, and prevented the diffusion of Bi and Te. In addition, the fracture did not occur on the bonding interface but in the thermoelectric elements for the electroless Pd-P plating because the bonding strength of the Pd-Sn reaction layer was higher than the shear strength of the thermoelectric elements.
Twórcy
autor
  • Kyungpook National University, Department of Materials Science and Metallurgical Engineeringdaegu 41566, Republic of Korea
autor
  • Kyungpook National University, Department of Materials Science and Metallurgical Engineeringdaegu 41566, Republic of Korea
autor
  • Kyungpook National University, Department of Materials Science and Metallurgical Engineeringdaegu 41566, Republic of Korea
  • Korea Institute of Materials Science, Powder & Ceramic Materials Division, , Gyeongnam 51508, Republic of Korea
Bibliografia
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Uwagi
EN
1. This work was supported by the National Research Foundation of Korea (NRF) grant funded by the Korea government (MOE) (NRF-2017R1D-1A1B03030792).
PL
2. Opracowanie rekordu w ramach umowy 509/P-DUN/2018 ze środków MNiSW przeznaczonych na działalność upowszechniającą naukę (2019).
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-7d881a99-2704-4856-90c0-4c3e3b0ec92e
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