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On the design of an automated system for the characterization of the electromigration performance of advanced interconnects by means of low-frequency noise measurements

Treść / Zawartość
Identyfikatory
Warianty tytułu
Języki publikacji
EN
Abstrakty
EN
Low-frequency noise measurements have long been recognized as a valuable tool in the examination of quality and reliability of metallic interconnections in the microelectronic industry. While characterized by very high sensitivity, low-frequency noise measurements can be extremely time-consuming, especially when tests have to be carried out over an extended temperature range and with high temperature resolutionas it is required by some advanced characterization approaches recently proposed in the literature. In order to address this issue we designed a dedicated system for the characterization of the low-frequency noise produced by a metallic line vs temperature. The system combines high flexibility and automation with excellent background noise levels. Test temperatures range from ambient temperature up to 300°C. Measurements can be completely automated with temperature changing in pre-programmed steps. A ramp temperature mode is also possible that can be used, with proper caution, to virtually obtain a continuous plot of noise parameters vs temperature.
Rocznik
Strony
13--21
Opis fizyczny
Bibliogr. 11 poz., rys., wykr.
Twórcy
  • University of Messina, Department of Engineering, C. da di Dio, I-98166, Messina, Italy
autor
  • IMEC, Kapeldreef 75, B-3001 Leuven, Belgium
autor
  • University of Messina, Department of Engineering, C. da di Dio, I-98166, Messina, Italy
  • University of Messina, Department of Engineering, C. da di Dio, I-98166, Messina, Italy
Bibliografia
  • [1] Tan, C.M., Roy, A. (2007). Electromigration in ULSI interconnects. Material Science and Engineering R, 58, 1-75.
  • [2] De Orio, R.L., Ceric, H., Selberherr, S. (2010). Physically based models of electromigration: from Black’s equation to modern TCAD models. Microelectron. Reliab., 50, 775-789.
  • [3] Vandamme, L.K.J. (1994). Noise as a diagnostic tool for quality and reliability of electron devices. IEEE T. Electron Dev., 41, 2176-2187.
  • [4] Scorzoni, A., Neri, B., Candida, C., Fantini, F. (1991). Electromigration in thin-film interconnection lines: models methods and results. Material Science Reports, 7, 143-220.
  • [5] Ciofi, C., Neri, B. (2000). Low-frequency noise measurements as a characterization tool for degradation phenomena in solid-state devices. J. Phys. D Appl. Phys., 33, R199-R216.
  • [6] Giusi, G., Scandurra, G., Ciofi, C. (2013). Estimation errors in 1=f noise spectra when employing DFT spectrum analyzers. Fluct. Noise Lett., 12, 1350007.
  • [7] Ciofi, C., Giusi, G., Scandurra, G., Neri, B. (2004). Dedicated instrumentation for high sensitivity, low frequency noise measurement systems. Fluct. Noise Lett., 4, L385-L402.
  • [8] Neri, B., Ciofi, C., Dattilo, V. (1997). Noise and fluctuations in submicrometric Al-Si interconnect lines. IEEE T. Electron Dev., 44, 1454–1459.
  • [9] Beyne, S., Croes, K., De Wolf, I., Tőkey, Z. (2016). 1=f noise measurements for faster evaluation of electromigration in advanced microelectronic interconnections. J. Appl. Phys., 119, 184302.
  • [10] Scandurra, G., Cannatà, G., Ciofi, C. (2011). Differential ultra low noise amplifier for low frequency noise measurements. AIP Advances, 1, 022144.
  • [11] Scandurra, G., Cannatà, G., Giusi, G., Ciofi, C. (2014). Programmable, very low noise current source. Rev. Sci. Instr., 85, 125109.
Uwagi
EN
1. Journal version of the paper presented at the 8th International Conference on Unsolved Problems of Noise (UPoN-2018, chaired by Janusz Smulko), Gdańsk, Poland, 9-13 July 2018. The meeting was dedicated to the 70th birthday of Michael F. Shlesinger.
2. Opracowanie rekordu w ramach umowy 509/P-DUN/2018 ze środków MNiSW przeznaczonych na działalność upowszechniającą naukę (2019).
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-74665964-7fb3-4ce6-b7ea-d1b513b38faf
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