Millimeter-Wave Transmitter with LTCC Antenna and Silicon Lens

• Autorzy: Bajurko Paweł , Sobolewski Jakub , Bogdan Grzegorz , Godziszewski Konrad , Marczewski Jacek , Kulawik Jan , Widlok Michał , Yashchyshyn Yevhen

Identyfikatory

DOI

10.24425/ijet.2022.139877

• Języki publikacji: EN

Abstrakty

EN

Millimeter-wave (mm-wave) transmitters are often fabricated using advanced technology and require a sophisticated manufacturing facility. Access to such technologies is often very limited and difficult to gain particularly at the initial stage of research. Therefore, to increase the accessibility of mm-wave transmitters, this study proposes a design that can be assembled in a standard microwave laboratory from commercially available or externally ordered components. The transmitter demonstrated in this paper operates above 100 GHz and is based on a lowtemperature co-fired ceramic board in which the antenna array, microstrip lines, and power-supply lines are fabricated in a single process. Different technologies are used to assemble the module, e.g., wire-bonding, soldering, and wax adhesion. Advantages and disadvantages of the proposed design are given based on experimental evaluation of the prototype. Although the performance of the developed transmitter is not as good as that of the similar modules available in the recent literature, the results confirm the feasibility of a mm-wave transmitter that is assembled without employing advanced technologies and superior machinery.

Słowa kluczowe

EN

antenna-in-package; LTCC circuits and modules; millimeter-waves; RF modules; RFIC and MMIC packaging; silicon lenses

• Wydawca: Polish Academy of Sciences, Committee of Electronics and Telecommunication
• Czasopismo: International Journal of Electronics and Telecommunications
• Rocznik: 2022
• Tom: Vol. 68, No. 2
• Strony: 267--273
• Opis fizyczny: Bibliogr. 39 poz., rys., tab., fot.

Twórcy

autor

Bajurko Paweł

• Warsaw University of Technology, Institute of Radioelectronics and Multimedia Technology, Warsaw, Poland

autor

Sobolewski Jakub

• Warsaw University of Technology, Institute of Radioelectronics and Multimedia Technology, Warsaw, Poland

autor

Bogdan Grzegorz

• Warsaw University of Technology, Institute of Radioelectronics and Multimedia Technology, Warsaw, Poland

autor

Godziszewski Konrad

• Warsaw University of Technology, Institute of Radioelectronics and Multimedia Technology, Warsaw, Poland

autor

Marczewski Jacek

• Łukasiewicz Research Network, Institute of Microelectronics and Photonics, Warsaw, Poland

autor

Kulawik Jan

• Łukasiewicz Research Network, Institute of Microelectronics and Photonics, Warsaw, Poland

autor

Widlok Michał

• SIRC Sp. z o.o., Gdynia, Poland

autor

Yashchyshyn Yevhen

• Warsaw University of Technology, Institute of Radioelectronics and Multimedia Technology, Warsaw, Poland

Bibliografia

• [1] Y. P. Zhang and D. Liu, “Antenna-on-Chip and Antenna-in-Package Solutions to Highly Integrated Millimeter-Wave Devices for Wireless Communications,” in IEEE Trans. Antennas Propag., vol. 57, no. 10, pp. 2830–2841, Oct. 2009. https://dx.doi.org/10.1109/TAP.2009.2029295
• [2] D. Liu and Y. P. Zhang, “Integration of Array Antennas in Chip Package for 60-GHz Radios,” Proc. IEEE, vol. 100, no. 7, pp. 2364–2371, Jul. 2012. https://dx.doi.org/10.1109/JPROC.2012.2186101
• [3] T. Zwick, F. Boes, B. Göttel, A. Bhutani and M. Pauli, “Pea-Sized mmW Transceivers: QFN-Based Packaging Concepts for Millimeter-Wave Transceivers,” in IEEE Microw. Mag., vol. 18, no. 6, pp. 79–89, Sept.-Oct. 2017. https://dx.doi.org/10.1109/MMM.2017.2712020
• [4] D. Dancila et al., “Differential microstrip patch antenna as feeder of a hyper-hemispherical lens for F-band MIMO radars,” Global Symposium on Millimeter Waves (GSMM) & ESA Workshop on Millimetre-Wave Technology and Applications, Espoo, Finland, 2016, pp. 1–4. https://dx.doi.org/10.1109/GSMM.2016.7500312
• [5] A. Bisognin et al., “Ball Grid Array Module With Integrated Shaped Lens for 5G Backhaul/Fronthaul Communications in F-Band,” in IEEE Trans. Antennas Propag., vol. 65, no. 12, pp. 6380–6394, Dec. 2017. https://dx.doi.org/10.1109/TAP.2017.2755439
• [6] B. Goettel, W. Winkler, A. Bhutani, F. Boes, M. Pauli and T. Zwick, “Packaging Solution for a Millimeter-Wave System-on-Chip Radar,” in IEEE Trans. Compon. Packag. Manuf. Technol., vol. 8, no. 1, pp. 73–81, Jan. 2018. https://dx.doi.org/10.1109/TCPMT.2017.2758725
• [7] M. Neshat, D. M. Hailu, M. Nezhad-Ahmadi, G. Z. Rafi and S. Safavi-Naeini, “Gain Measurement of Embedded On-Chip Antennas in mmW/THz Range,” in IEEE Trans. Antennas Propag., vol. 60, no. 5, pp. 2544–2549, May 2012. https://dx.doi.org/10.1109/TAP.2012.2189772
• [8] R. Jain et al., “A 64-Pixel 0.42-THz Source SoC With Spatial Modulation Diversity for Computational Imaging,” in IEEE Journal of Solid-State Circuits, vol. 55, no. 12, pp. 3281–3293, Dec. 2020. https://dx.doi.org/10.1109/JSSC.2020.3018819
• [9] Y. Zhang and J. Mao, “An Overview of the Development of Antenna-in-Package Technology for Highly Integrated Wireless Devices,” in Proceedings of the IEEE, vol. 107, no. 11, pp. 2265–2280, Nov. 2019. https://dx.doi.org/10.1109/JPROC.2019.2933267
• [10] P. Hallbjorner, Z. He, S. Bruce and S. Cheng, “Low-Profile 77-GHz Lens Antenna With Array Feeder,” in IEEE Antennas Wireless Propag. Lett., vol. 11, pp. 205–207, 2012. https://dx.doi.org/10.1109/LAWP.2012.2188265
• [11] S. Raman, N. S. Barker and G. M. Rebeiz, “A W-band dielectric-lens-based integrated monopulse radar receiver,” in IEEE Trans. Microw. Theory Techn., vol. 46, no. 12, pp. 2308–2316, Dec. 1998. https://dx.doi.org/10.1109/22.739216
• [12] A. Dyck et al., "A Transmitter System-in-Package at 300 GHz With an Off-Chip Antenna and GaAs-Based MMICs," in IEEE Transactions on Terahertz Science and Technology, vol. 9, no. 3, pp. 335–344, May 2019. https://dx.doi.org/10.1109/TTHZ.2019.2910511
• [13] Y. P. Zhang, M. Sun, and W. Lin, “Novel Antenna-in-Package Design in LTCC for Single-Chip RF Transceivers,” IEEE Trans. Antennas Propag., vol. 56, no. 7, pp. 2079–2088, Jul. 2008. https://dx.doi.org/10.1109/TAP.2008.924706
• [14] T. Klein, M. Faassen, R. Kulke and C. Rusch, “A 77 GHz radar frontend in LTCC for small range, high precision industrial applications,” 2012 7th European Microwave Integrated Circuit Conference, Amsterdam, 2012, pp. 905–908.
• [15] F. Bauer, X. Wang, W. Menzel and A. Stelzer, "A 79-GHz Radar Sensor in LTCC Technology Using Grid Array Antennas," in IEEE Transactions on Microwave Theory and Techniques, vol. 61, no. 6, pp. 2514–2521, June 2013. https://dx.doi.org/10.1109/TMTT.2013.2260766
• [16] F. Sickinger et al., “Automotive Satellite Radar Sensor System based on an LTCC Miniature Frontend,” 2018 IEEE MTT-S International Conference on Microwaves for Intelligent Mobility (ICMIM), Munich, 2018, pp. 1–4. https://dx.doi.org/10.1109/ICMIM.2018.8443535
• [17] X. Wang and A. Stelzer, “A 79-GHz LTCC RF-frontend for short-range applications,” 2011 IEEE MTT-S International Microwave Symposium, Baltimore, MD, 2011, pp. 1–4. https://dx.doi.org/10.1109/MWSYM.2011.5972679
• [18] X. Wang, C. Yu, D. Qin and W. Lu, “W-Band High-Gain Substrate Integrated Cavity Antenna Array on LTCC,” in IEEE Transactions on Antennas and Propagation, vol. 67, no. 11, pp. 6883–6893, Nov. 2019. https://dx.doi.org/10.1109/TAP.2019.2927896
• [19] S. Beer, L. Pires, C. Rusch, J. Paaso and T. Zwick, “A 122 GHz Microstrip Slot Antenna with via-fence resonator in LTCC technology,” 6th Europ. Conf. Antennas Propag. (EUCAP), Prague, Czech Republic, 2012, pp. 1329–1332. https://dx.doi.org/10.1109/EuCAP.2012.6205894
• [20] P. Piasecki, Y. Yashchyshyn, “Study of D-band LTCC Leaky Wave Antenna Optimized for Broadside Radiation,” Radioengineering, vol. 27, no. 2, pp. 463-468, June 2018. https://dx.doi.org/10.13164/re.2018.0463
• [21] J. Xiao, X. Li, Z. Qi and H. Zhu, “140-GHz TE340-Mode Substrate Integrated Cavities-Fed Slot Antenna Array in LTCC,” in IEEE Access, vol. 7, pp. 26307–26313, 2019. https://dx.doi.org/10.1109/ACCESS.2019.2900989
• [22] M. Henry et al., “Integrated air-filled waveguide antennas in LTCC for G-band operation,” 2008 Asia-Pacific Microwave Conference, Macau, 2008, pp. 1–4. https://dx.doi.org/10.1109/APMC.2008.4957967
• [23] J. Xu, Z. N. Chen and X. Qing, "270-GHz LTCC-Integrated Strip-Loaded Linearly Polarized Radial Line Slot Array Antenna," in IEEE Transactions on Antennas and Propagation, vol. 61, no. 4, pp. 1794–1801, April 2013. https://dx.doi.org/10.1109/TAP.2012.2237007
• [24] T. Tajima, H. Song, K. Ajito, M. Yaita and N. Kukutsu, “300-GHz Step-Profiled Corrugated Horn Antennas Integrated in LTCC,” in IEEE Transactions on Antennas and Propagation, vol. 62, no. 11, pp. 5437–5444, Nov. 2014. https://dx.doi.org/10.1109/TAP.2014.2350520
• [25] M. Lahti, K. Kautio, M. Karppinen, K. Keränen, J. Ollila, and P. Karioja, “Review of LTCC Technology for Millimeter Waves and Photonics”, International Journal of Electronics and Telecommunications, 2020, vol. 66 no. 2, pp. 361-367. https://dx.doi.org/10.24425/ijet.2020.131886
• [26] S. Beer and T. Zwick, “122 GHz antenna-integration in a plastic package based on a flip chip interconnect,” 2011 IEEE MTT-S International Microwave Workshop Series on Millimeter Wave Integration Technologies, Sitges, 2011, pp. 37–40. https://dx.doi.org/10.1109/IMWS3.2011.6061881
• [27] R. Shireen, S. Shi, P. Yao and D. W. Prather, “Multi-Chip Module Packaging For W-Band LiNbO3 Modulator,” in IEEE Microwave and Wireless Components Letters, vol. 21, no. 3, pp. 145–147, March 2011. https://dx.doi.org/10.1109/LMWC.2010.2103375
• [28] V. Valenta, T. Spreng, S. Yuan, W. Winkler, V. Ziegler, D. Dancila, A. Rydberg, and H. Schumacher, “Design and experimental evaluation of compensated bondwire interconnects above 100 GHz,” International Journal of Microwave and Wireless Technologies, vol. 7, no. 3-4, pp. 261–270, 2015. https://dx.doi.org/10.1017/S1759078715000070
• [29] A. Bhutani, B. Göttel, A. Lipp and T. Zwick, “Packaging Solution Based on Low-Temperature Cofired Ceramic Technology for Frequencies Beyond 100 GHz,” in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 9, no. 5, pp. 945–954, May 2019. https://dx.doi.org/10.1109/TCPMT.2018.2882062
• [30] L. Wu, S. Liao and Q. Xue, “A 312-GHz CMOS Injection-Locked Radiator With Chip-and-Package Distributed Antenna,” in IEEE Journal of Solid-State Circuits, vol. 52, no. 11, pp. 2920–2933, Nov. 2017. https://dx.doi.org/10.1109/JSSC.2017.2727046
• [31] Z. Tong, A. Fischer, A. Stelzer and L. Maurer, “Radiation Performance Enhancement of E-Band Antenna in Package,” in IEEE Trans. Compon. Packag. Manuf. Technol., vol. 3, no. 11, pp. 1953–1959, Nov. 2013. https://dx.doi.org/10.1109/TCPMT.2013.2272039
• [32] P. Bajurko et al., “A 110 GHz Hybrid Integrated Transmitter Design,” 2020 23rd International Microwave and Radar Conference (MIKON), Warsaw, Poland, 2020, pp. 367–370. https://dx.doi.org/10.23919/MIKON48703.2020.9253943
• [33] P. R. Bajurko, "Millimeter wave permittivity and loss tangent measurements of LTCC materials," 2016 21st International Conference on Microwave, Radar and Wireless Communications (MIKON), Krakow, 2016, pp. 1–4. https://dx.doi.org/10.1109/MIKON.2016.7492104
• [34] Y. Yashchyshyn et al. , “Experience in developing LTCC technologies for mm-Wave antennas,” 11th Eur. Conf. Antennas Propag. (EUCAP), Paris, France, 2017. https://dx.doi.org/10.23919/EuCAP.2017.792808
• [35] J. Sobolewski and P. R. Bajurko, “Design of LTCC patch antenna for increased bandwidth and reduced susceptibility to fabrication process inaccuracies,” 22nd Int. Microw. Radar Conf. (MIKON), Poznan, Poland, 2018, pp. 218–221. https://dx.doi.org/10.23919/MIKON.2018.8405182
• [36] C. A. Balanis, Antenna theory: analysis and design, John Wiley & Sons 2016, chapter 2, section 6 “Directivity”.
• [37] H. Y. Kim et al., “A 60 GHz LTCC antenna in package with low power CMOS radio,” Asia-Pacific Microw. Conf. Proc. (APMC), Seoul, Republic of Korea, 2013, pp. 155–157. https://dx.doi.org/10.1109/APMC.2013.6695222
• [38] P. Pursula et al., “60-GHz Millimeter-Wave Identification Reader on 90-nm CMOS and LTCC,” in IEEE Trans. Microw. Theory Techn., vol. 59, no. 4, pp. 1166–1173, April 2011. https://dx.doi.org/10.1109/TMTT.2011.2114200
• [39] A. Vahdati et al., “90 GHz CMOS Phased-Array Transmitter Integrated on LTCC,” in IEEE Trans. Antennas Propag., vol. 65, no. 12, pp. 6363–6371, Dec. 2017. https://dx.doi.org/10.1109/TAP.2017.2743009

Uwagi

1. Opracowanie rekordu ze środków MEiN, umowa nr SONP/SP/546092/2022 w ramach programu "Społeczna odpowiedzialność nauki" - moduł: Popularyzacja nauki i promocja sportu (2022-2023).

2. This work was supported by The National Center for Research and Development (NCBiR) in Poland, contracts no. PBS3/A3/18/2015 and PBS3/B3/30/2015.