Interconnect elements propagation quantities in PIC

• Autorzy: Kula S.
• Konferencja: Computer Applications in Electrical Engineering 2012 (23-24.04.2012; Poznań, Polska)
• Języki publikacji: EN

Abstrakty

EN

This paper describes methods to extract nominal values of propagation quantities for thin-film, straight interconnect elements. The propagation quantities like effective dielectric permittivity ɛ_eff, attenuation α, characteristic impedance Z_o are calculated with the use of analytical and approximated formulas. These expressions are obtained by transforming and by fitting formulas, typically used for calculation of per unit length transmission line parameters. Methods are verified for typical thin-film interconnect elements dimensions and for typical materials used in the Photonics Integrated Circuits (PIC). The novelty of the study is the parametrization with respect to the geometrical dimensions. The parametrization is based on the approximation expressions in the form of rational polynomials obtained by fitting.

Słowa kluczowe

EN

propagation quantities; PIC; photonics integrated circuits; IC; Integrated Circuits

• Wydawca: Wydawnictwo Politechniki Poznańskiej
• Czasopismo: Poznan University of Technology Academic Journals. Electrical Engineering
• Rocznik: 2012
• Tom: No. 70
• Strony: 83--89
• Opis fizyczny: Bibliogr. 7 poz., rys.

Twórcy

autor

Kula S.

• Kazimierz Wielki University in Bydgoszcz
• Chalmers University in Göteborg

Bibliografia

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• [3] Schnieder F., Heinrich W., Model of Thin-Film Microstrip Line for Circuit Design, IEEE Trans. Microwave Theory Tech., vol. 49, no. 1, January 2001.
• [4] Djordjevic A.R., Sarkar T.K., Closed-form formulas for frequency dependent resistance and inductance per unit length of microstrip and strip transmission lines, IEEE Trans. Microwave Theory Tech., vol. 42, pp. 241-248, Feb. 1994.
• [5] Heiliger H.M., Nagel M., Roskos H.G., Kurz H., Schnieder F., Heinrich W., Thin-film microstrip lines formm and sub-mm-wave on-chip interconnects, in IEEE MTT-S Int. Microwave Symp. Dig., 1997, pp. 421-424.
• [6] loan D., Ciuprina G., Kula S., Reduced Order Models for HF Interconnect over Lossy Semiconductor Substrate, Proc. of the 11th IEEE Workshop on Signal Propagation on Interconnects, pp. 233-236, 2007.
• [7] Nelatury S.R., Sadiku M.N.O., Devabhaktuni V.K., CAD Models for Estimating the Capacitance of a Microstrip Interconnect: Comparison and Improvisation, PIERS Proceedings, August 27-30, Prague, Czech Republic, 2007, pp. 18-23.