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Tytuł artykułu

Robust and automatic measurement of grinding-induced subsurface damage in optical glass K9 based on digital image processing

Wybrane pełne teksty z tego czasopisma
Identyfikatory
Warianty tytułu
Języki publikacji
EN
Abstrakty
EN
Optical glass K9 is a critical kind of optical materials, however experiments have indicated that the mechanical grinding of K9 easily led to subsurface damage (SSD). Although substantial SSD measurement methods have been suggested, the problems including the prior knowledge of SSD and slow measurement speed still impede the reported method applications. To this end, this paper has presented an image-process-based method that can identify and measure the grinding-induced SSD in K9 specimens. By performing grinding trials, the method has been found to be able to accurately (with biggest relative error of 3.13% in comparison with the manually measured results) and quickly (with the measurement speed of 1.68 s per image) measure SSD depths. Without any parameter presetting, the method enables automatic SSD measurements, allowing the users without SSD knowledge to be able to use the method. Moreover, the method has shown the good robustness to the input image size, illumination, tilted specimen placement, and material flaws. The method is therefore anticipated to be meaningful for the industrial manufacturing, design and application of optical glass.
Rocznik
Strony
320--330
Opis fizyczny
Bibliogr. 21 poz., fot., rys.
Twórcy
autor
  • School of Mechanical Engineering and Automation, Northeastern University, Shenyang 110819, China
autor
  • School of Mechanical Engineering and Automation, Northeastern University, Shenyang 110819, China
autor
  • School of Mechanical Engineering and Automation, Northeastern University, Shenyang 110819, China
autor
  • School of Mechanical Engineering and Automation, Northeastern University, Shenyang 110819, China
Bibliografia
  • [1] Z. Yao, W. Gu, K. Li, Relationship between surface roughness and subsurface crack depth during grinding of optical glass BK7, J. Mater. Process. Technol. 212 (4) (2012) 969–976.
  • [2] S. Li, Z. Wang, Y. Wu, Relationship between subsurface damage and surface roughness of optical materials in grinding and lapping processes, J. Mater. Process. Technol. 205 (1–3) (2008) 34–41.
  • [3] W. Gu, Z. Yao, H. Li, Investigation of grinding modes in horizontal surface grinding of optical glass BK7, J. Mater. Process. Technol. 211 (10) (2011) 1629–1636.
  • [4] D. Lv, Y. Huang, Y. Tang, H. Wang, Relationship between subsurface damage and surface roughness of glass BK7 in rotary ultrasonic machining and conventional grinding processes, Int. J. Adv. Manuf. Technol. 67 (1–4) (2013) 613–622.
  • [5] J. Li, Q. Fang, L. Zhang, Y. Liu, Subsurface damage mechanism of high speed grinding process in single crystal silicon revealed by atomistic simulations, Appl. Surf. Sci. 324 (2015) 464–474.
  • [6] H. Lundt, M. Kerstan, A. Huber, P. Hahn, Subsurface damage of abraded silicon wafers, in: Proceedings of the 7th International Symposium on Silicon Materials Science and Technology, Pennington, NJ, USA, (1994) 218–224.
  • [7] H. Aida, H. Takeda, S.W. Kim, N. Aota, K. Koyama, T. Yamazaki, T. Doi, Evaluation of subsurface damage in GaN substrate induced by mechanical polishing with diamond abrasives, Appl. Surf. Sci. 292 (2014) 531–536.
  • [8] J. Götze, M. Plötze, D. Habermann, Origin, spectral characteristics and practical applications of the cathodoluminescence (CL) of quartz – a review, Miner. Petrol. 71 (3) (2001) 225–250.
  • [9] H.N. Li, T.B. Yu, L. Da Zhu, W.S. Wang, Evaluation of grinding-induced subsurface damage in optical glass BK7, J. Mater. Process. Technol. 229 (2016) 785–794.
  • [10] T. Yu, H. Li, W. Wang, Experimental investigation on grinding characteristics of optical glass BK7: with special emphasis on the effects of machining parameters, Int. J. Adv. Manuf. Tech. 82 (5–8) (2016) 1405–1419.
  • [11] H.N. Li, T.B. Yu, L.D. Zhu, W.S. Wang, Analytical modeling of ground surface topography in monocrystalline silicon grinding considering the ductile-regime effect, Arch. Civil Mech. Eng. 17 (4) (2017) 880–893.
  • [12] H.K. Tonshoff, B. Karpuschewski, M. Hartmann, C. Spengler, Grinding-and-slicing technique as an advanced technology for silicon wafer slicing, Mach. Sci. Technol. 1 (1) (1997) 33–47.
  • [13] A. Esmaeilzare, A. Rahimi, S.M. Rezaei, Investigation of subsurface damages and surface roughness in grinding process of Zerodur® glass–ceramic, Appl. Surf. Sci. 313 (2014) 67–75.
  • [14] Z.J. Pei, S.R. Billingsley, S. Miura, Grinding induced subsurface cracks in silicon wafers, Int. J. Mach. Tool Manuf. 39 (7) (1999) 1103–1116.
  • [15] S. Malkin, C. Guo, Grinding Technology: Theory and Application of Machining with Abrasives, McGraw-Hill, USA, 2008.
  • [16] J. Canny, A computational approach to edge detection, in: Proceedings of the Readings in Computer Vision, San Francisco, USA, (1987) 184–203.
  • [17] R. Gonzales, R. Woods, Image Processing, Prentice Hall Press, USA, 2002.
  • [18] R. Achanta, S. Süsstrunk, Saliency detection using maximum symmetric surround, in: Proceedings of the IEEE International Conference on Image Processing, 2010, 2653–2656.
  • [19] I. Vaisman, Analytical Geometry, World Scientific, USA, 1997.
  • [20] I. Yasri, N. Hamid, V. Yap, Performance analysis of FPGA based Sobel edge detection operator, in: Proceedings of the International Conference of Electronic Design, 2008, 1–4.
  • [21] M. Putra, I.S. Suwardi, Structural off-line handwriting character recognition using approximate subgraph matching and levenshtein distance, Procedia Comput. Sci. 59 (2015) 340–349.
Uwagi
PL
Opracowanie rekordu w ramach umowy 509/P-DUN/2018 ze środków MNiSW przeznaczonych na działalność upowszechniającą naukę (2018)
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-6c03afcf-1ddc-4105-9fa1-7e7b1f5b33ce
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