Investigation of Two-Step Metallization Process of Plastic 3D Prints Fabricated by SLA Method

• Autorzy: Kołczyk K. , Zborowski W. , Kutyła D. , Kwiecińska A. , Kowalik R. , Żabiński P.

Identyfikatory

DOI

10.24425/122438

• Języki publikacji: EN

Abstrakty

EN

This paper presents the results of experiments on metallization of plastic elements produced using 3D printing technology from the light-hardened resins. The obtained coatings were bimetallic (Cu/Ni). The first step of metallization was the electroless deposition of copper. The second one was electrodeposition of nickel on the previously prepared copper substrate. The parameters of 3D prints preparation and metallization processes were deeply investigated. The etching of plastics substrates and duration of electroless metallization of 3D prints by copper were analyzed. In the next step the influence of nickel electrodeposition time was investigated. The coating were analyzed by XRD method and morphology of surface was analyzed by scanning electron microscopy (SEM). The thickness of coatings was calculated based on mass differences and measured by using optical microscopy method. The optimal parameters for both processes were specified.

Słowa kluczowe

EN

electroless deposition; electrodeposition; thin films; metallization; 3D printing

• Wydawca: Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences
• Czasopismo: Archives of Metallurgy and Materials
• Rocznik: 2018
• Tom: Vol. 63, iss. 2
• Strony: 1031--1036
• Opis fizyczny: Bibliogr. 11 poz., fot., rys., tab., wzory

Twórcy

autor

Kołczyk K.

• AGH University of Science and Technology in Krakow, Faculty of Non-Ferrous Metals, Al. Mickiewicza 30, 30-059 Kraków, Poland

autor

Zborowski W.

• AGH University of Science and Technology in Krakow, Faculty of Non-Ferrous Metals, Al. Mickiewicza 30, 30-059 Kraków, Poland

autor

Kutyła D.

• AGH University of Science and Technology in Krakow, Faculty of Non-Ferrous Metals, Al. Mickiewicza 30, 30-059 Kraków, Poland

autor

Kwiecińska A.

• AGH University of Science and Technology in Krakow, Faculty of Non-Ferrous Metals, Al. Mickiewicza 30, 30-059 Kraków, Poland

autor

Kowalik R.

• AGH University of Science and Technology in Krakow, Faculty of Non-Ferrous Metals, Al. Mickiewicza 30, 30-059 Kraków, Poland

autor

Żabiński P.

• AGH University of Science and Technology in Krakow, Faculty of Non-Ferrous Metals, Al. Mickiewicza 30, 30-059 Kraków, Poland

Bibliografia

• [1] Y. Shacham-Diamand, T. Osaka, Y. Okinaka, A. Sugiyama, V. Dubin. 30 Years of electroless plating for semiconductor and polymer micro-systems, Microelectronic Engineering 132, 35-45 (2015).
• [2] S. C. Domenech, E. Lima, V. Drago, J. C. De Lima, N. G. Borges, A. O.V. Avila, V. Soldi, Electroless plating of nickel-phosphorous on surface-modified poly(ethylene terephthalate) films, Applied Surface Science 220 (1-4), 238-250 (2003).
• [3] F. Fina, A. Goyanes, S. Gaisford, A. W. Basit, Selective laser sintering (SLS) 3D printing of medicines, International Journal of Pharmaceutics 529 (1-2), 285-293 (2017).
• [4] J. Kanzow, P. S. Horn, M. Kirschmann, V. Zaporojtchenko, K. Dolgner, F. Faupel, C. Wehlack, W. Possart, Formation of a metal/epoxy resin interface, Applied Surface Science 239 (2), 227-236 (2005).
• [5] D. Chen , Y. Zhang, T. Bessho, J. Sang, H. Hirahara, K. Mori, Z. Kang, Layer by layer electroless deposition: An efficient route for preparing adhesion-enhanced metallic coatings on plastic surfaces, Chemical Engineering Journal 303, 100-108 (2016).
• [6] W. Xu, M. Zhuang, Z. Cheng, Environmentally Friendly Copper Metallization of ABS by Cu-Catalysed Electroless Process, Rare Metal Materials and Engineering 45 (7), 1709-1713 (2016).
• [7] N. Kulyk, S. Cherevko, C. H. Chung, Copper electroless plating in weakly alkaline electrolytes using DMAB as a reducing agent for metallization on polymer films, Electrochimica Acta 59, 179-185 (2012).
• [8] M. Bazzaoui, J. I. Martins, E. A. Bazzaoui, A. Albourine, Environmentally friendly process for nickel electroplating of ABS, Applied Surface Science 258 (20),7968-7975 (2012).
• [9] M. Makdessi, A. Sari, P. Venet, Metallized polymer film capacitors ageing law based on capacitance degradation, Microelectronics Reliability 54 (9-10),1823-1827 (2014).
• [10] M. Godec, D. Mandrino, M. Gaberšček, Investigation of performance degradation in metallized film capacitors, Applied Surface Science 273, 465-471 (2013).
• [11] R. Bernasconi, F. Cuneo, C. Credi, M. Levi, A. Lucotti, P. L. Cavallotti, L. Magagnin, Low Temperature Electroless Deposition of Hard Magnetic Alloys for the Metallization of Additive Manufactured Functional Microstructures, ECS Transactions 75 (34), 43-60 (2017).

Uwagi

EN

1. The authors would like to thank Polish National Science Centre for the financial support provided by the grant: No UMO-2017/25/N/ST8/01721.

PL

2. Opracowanie rekordu w ramach umowy 509/P-DUN/2018 ze środków MNiSW przeznaczonych na działalność upowszechniającą naukę (2018).