Investigation of heat transfer in integrated circuits

• Autorzy: Frankiewicz M. , Gołda A. , Kos A.

Identyfikatory

DOI

10.2478/mms-2014-0011

• Języki publikacji: EN

Abstrakty

EN

The paper analyzes the phenomenon of heat transfer and its inertia in solids. The influence of this effect on the operation of an integrated circuit is described. The phenomenon is explained using thermal analogy implemented in the Spice environment by an R-C thermal model. Results from the model are verified by some measurements with a chip designed in CMOS 0.7 μm (5 V) technology. The microcontroller-based measurement system structure and experiment results are described.

Słowa kluczowe

EN

temperature; heat transfer; VLSI; electric analogy

• Wydawca: Komitet Metrologii i Aparatury Naukowej PAN
• Czasopismo: Metrology and Measurement Systems
• Rocznik: 2014
• Tom: Vol. 21, nr 1
• Strony: 111--120
• Opis fizyczny: Bibliogr. 17 poz., rys., tab., wykr.

Twórcy

autor

Frankiewicz M.

• AGH University of Science and Technology, Department of Electronics, Mickiewicza 30, 30-059 Kraków, Poland

autor

Gołda A.

• AGH University of Science and Technology, Department of Electronics, Mickiewicza 30, 30-059 Kraków, Poland

autor

Kos A.

• AGH University of Science and Technology, Department of Electronics, Mickiewicza 30, 30-059 Kraków, Poland

Bibliografia

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• [3] Frankiewicz, M., Kos, A. (2012). Overheat Protection Circuit for High Frequency Processors. Bul. Pol. Ac. Sc. Techn. Ser. Vol. 60 No. 1, 55-59.
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• [5] Boroń, K., Kos, A. (2012). Thermal Model of Selected Parts of Human Hand and Thermal Touch Screen for the Blind. Metrol. and Meas. Syst., Vol. XIX No.3, 593-602.
• [6] Dziurdzia, P., Mirocha, A. (2009). From Constant to Temperature Dependent Parameters Based Electrothermal Models of TEG: Comparative Analysis. Proc. Int. Conf. Mixed Design of Integrated Circuits and Systems MIXDES, 555-559.
• [7] Blackburn, D.L., Oetinger, F.F. (1975). Transient Thermal Response Measurements of Power Transistors. IEEE Trans. Ind. El. And Contr. Instr., Vol. 22 No.2, 134-141.
• [8] Székely, V. (1998). Identification of RC Networks by Deconvolution: Chances and Limits. IEEE Trans. Cir. and Syst. I, Vol. 45 No.3, 244-258.
• [9] Székely, V., Rencz, M. (2000). Thermal Dynamics and the Time Constant Domain. IEEE Trans. Comp. and Pack. Techn., Vol. 23 No.3, 587-594.
• [10] Szábo, P.G., Székely, V. (2010). Investigation of Parallel Heat-flow Path in Electro-thermal Microsystems. Proc. Symp. Design Test Integration and Packaging of MEMS/MOEMS DITP, 215-220.
• [11] Napieralski, A., Grecki, M. (1994). Transient Temperature Evaluation During Switching Process in Static Induction Transistor. Proc. Conf. Power Electronics and Variable-Speed Drivers, 537-542.
• [12] Banaszczyk, J., Janicki, M., Vermeersch, B., De Mey, G., Napieralski, A. (2007). Application of Advanced Thermal Analysis Method for Investigation of Internal Package Structure. Proc. Int. Conf. Mixed Design of Integrated Circuits and Systems MIXDES, 553-558.
• [13] Meysenc, L., Jylhäkallio, M., Barbosa, P. (2005). Power Electronics Cooling Effectiveness Versus Thermal Inertia. IEEE Trans. Power El., Vol. 20 No.3, 687-693.
• [14] Bîrcă-Gălăţeanu, Ş. (2005). On the Thermal Inertia of the Semiconductor Components. Proc. Int. Symp. Signals, Circuits and Systems ISSCS, 589-592.
• [15] Więcek, B. De Mey, G. (2011). Thermovision in infrared. Basics and applications. (Termowizja w podczerwieni. Podstawy i zastosowania.). PAK.
• [16] Gołda, A., Kos, A. (2006). ASIC for Investigations into Thermal Aspects in CMOS Integrated Circuits. Proc. Int. Conf. IMAPS Poland Chapt., 485-488.
• [17] Frankiewicz, M., Gołda, A., Kos, A. (2013). Extraction of Integrated Circuit Thermal Parameters. Proc. Int. Interdisciplinary PhD Workshop IIPhDW, 132-136.

Uwagi

EN

The work was partially financed by polish National Science Centre (Narodowe Centrum Nauki), grant number NCN N N515 500340.