An interface anticrack in a periodic two-layer piezoelectric space under vertically uniform heat flow

• Autorzy: Kaczyński A. , Kaczyński B.
• Języki publikacji: EN

Abstrakty

EN

This paper aims to investigate 3D static thermoelectroelastic problem of a uniform heat flow in a bi-material periodically layered space disturbed by a thermally and electrically-insulated rigid sheet-like inclusion (so-called anticrack) situated at one of the interfaces. An approximate analysis of the considered laminated composite is given in the framework of the homogenized model with microlocal parameters. Accurate results are obtained by constructing suitable potential solutions and reducing to the corresponding homogeneous thermoelectromechanical (or thermomechanical) anticrack problems. The governing boundary integral equation for a planar interface anticrack of arbitrary shape is derived in terms of a normal stress discontinuity. As an illustration, a complete solution for a rigid circular inclusion is obtained in terms of elementary functions and interpreter from the failure perspective. Unlike existing solutions for defects at the interface of materials, the solution obtained displays no oscillatory behavior.

Słowa kluczowe

EN

periodic two-layered composite; homogenized model; interface anticrack; thermoelectroelasticity; heat flow; thermal stress singularity

PL

periodyczny kompozyt dwuwarstwowy; model homogenizowany; interfejs; antyszczelina; termoelektrosprężystość; przepływ ciepła; naprężenia termiczne

• Wydawca: Wydawnictwo Politechniki Łódzkiej
• Czasopismo: Mechanics and Mechanical Engineering
• Rocznik: 2018
• Tom: Vol. 22, nr 3
• Strony: 667--681
• Opis fizyczny: Bibliogr. 16 poz., 1 rys.

Twórcy

autor

Kaczyński A.

• Faculty of Engineering and Economics, State Higher Vocational School in Ciechanow, Narutowicz 9, 06-400 Ciechanow, Poland

autor

Kaczyński B.

• Department of Medical Informatics and Telemedicine, Medical University of Warsaw, Banach 1a, 02-097 Warsaw, Poland

Bibliografia

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• [3] Kaczyński, A.: On 3D problems of thermoelastostatics for transversely isotropic solids with anticracks, Eur. J. Mech. A / Solids, 58, 102-111, 2016.
• [4] Kaczyński, A. and Matysiak, S.J.: Thermal stresses in a bimaterial periodically layered composites due to the presence of interface cracks or rigid inclusions, J. Theor. Appl. Mech., 36, 2, 183-186, 1998.
• [5] Kaczyński, A. and Matysiak, S.J.: On the three-dimensional problem of an interface crack under uniform heat flow in a bimaterial periodically-layered space, Int. J. Fract., 123, 127-138, 2003.
• [6] Kaczyński, A. and Monastyrskyy, B.: Thermal stresses in a periodic two-layer space with an interface rigid inclusion under uniform heat flow, Acta Mech., 203, 183-195, 2009.
• [7] Kaczyński, A. and Kaczyński, B.: On 3D problem of an anticrack under vertically uniform heat ow in a transversely isotropic electro-thermo-elastic space, Eur. J. Mech. A / Solids, 66, 15-25, 2017.
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• [10] Evtushenko, O.O., Matysiak, S.I. and Pauk, V.I.: On homogenized model of periodically layered piezoelectric composites, Mat. Sci., 32, 3, 359-367, 1996.
• [11] Kaczyński, A.: Three-dimensional thermoelastic problems of interface cracks in periodic two-layered composites, Eng. Fract. Mech., 48, 6, 783-800, 1994.
• [12] Chen, W.Q.: On the general solution for piezothermoelasticity for transversely isotropy with application, J. Appl. Mech., 67, 705-711, 2000.
• [13] Kellogg, O.D.: Foundation of potential theory, Dover, New York, 1953.
• [14] Fabrikant, V.I.: Mixed boundary value problems of potential theory and their applications in engineering, Kluwer Academic Publishers, Dordrecht, 1991.
• [15] Sneddon, I.N.: Mixed boundary value problems in potential theory, North-Holland Publ. Co., Amsterdam, 1966.
• [16] Li, X.F. and Fan, T.Y.: The asymptotic stress field for a rigid circular inclusion at the interface of two bonded dissimilar elastic half-space materials, Int. J. Solids Struct., 38, 8019-8035, 2001.

Uwagi

Opracowanie rekordu w ramach umowy 509/P-DUN/2018 ze środków MNiSW przeznaczonych na działalność upowszechniającą naukę (2018).