A Novel EBG Structure with Embedded Meander Bridge and Its Applications on SI and PI

• Autorzy: Yan Z. , Yu W. , Cao J. , Wang W. , Han Y. , Rahman T.

Warianty tytułu

PL

Nowa struktura EBG z wbudowanym meandrem mostkowym i jej zastosowanie

• Języki publikacji: EN

Abstrakty

EN

This paper proposes an embedded meander bridge planar EBG structure, which can effectively suppress ultra-wideband (UWB) simultaneous switching noise (SSN) in power/ground plane pairs. This paper demonstrates that the valid -30 dB suppression bandwidth of the novel EBG structure is from 500 MHz to 14.5 GHz, covering a range of 14GHz. Furthermore, the effects of the EBG power plane on signal integrity (SI) is investigated. The design rules of the signal lines over the EBG power/ground plane pairs are also studied. The simulated and measured results are compared to verify the performance.

PL

W artykule opisano mostkową strukture EBG typu meander która umożliwia skuteczne tłumienie szumów szerokopasmowych. Układ umożliwia tłumienie o 30 dB sygnałów w paśmie 500 MHz – 14.5 GHz.

Słowa kluczowe

EN

EBG; embedded meander bridge planar; SSN; SI; PI

PL

EBG; tłumienie sygnału; elektrokompatybilność

• Wydawca: Wydawnictwo SIGMA-NOT
• Czasopismo: Przegląd Elektrotechniczny
• Rocznik: 2012
• Tom: R. 88, nr 7b
• Strony: 294--299
• Opis fizyczny: Bibliogr. 11 poz., il.,schem., wykr.

Twórcy

autor

Yan Z.

• School of Electronic and Information Engineering of Beihang University, Beijing, China, phone: [phone]; fax: [phone]

autor

Yu W.

• Beihang University

autor

Cao J.

• Beihang University

autor

Wang W.

• Beihang University

autor

Han Y.

• Beihang University

autor

Rahman T.

• Beihang University

Bibliografia

• [1] Tzong-Lin Wu and Hao-Hsiang Chuang, “Overview of Power Integrity Solutions on Package and PCB: Decoupling and EBG Isolation,” IEEE Trans. Electromagn. Compat., vol. 52, no.2, pp. 346–356, May 2010.
• [2] J. Fan, J. L. Drewniak, J. L. Knighten, N. W. Smith, A. Orlandi, and T. P. Van Doren “Quantifying SMT decoupling capacitor placement in DC power-bus design for multilayer PCBs,” IEEE Trans. Electromagn. Compat., vol. 43, no.4, pp. 588–599, Nov. 2001.
• [3] J. Fan, W. Cui, J. L. Drewniak, T. P. Van Doren, and J. L. Knighten, “Estimating the noise mitigation effect of local decoupling in printed circuit boards,” IEEE Trans. Adv. Packag., vol. 25, no.2, pp. 154–165, May 2002.
• [4] T. Kamgaing and O. M. Ramahi, “A novel power planes with integrated simultaneous switching noise mitigation capability using high impedance surface,” IEEE Microw. Wireless Compon. Lett. vol. 13, no.1, pp. 21–23, Jan. 2003.
• [5] T. L. Wu, Y. H. Lin, T. K. Wang, C. C. Wang, and S. T. Chen, “Electromagnetic bandgap power/ground planes for wideband suppression of ground bounce noise and radiated emission in high-speed circuits,” IEEE Trans. Microw. Theory Tech., vol. 53, no. 9, pp. 2935-2942, Sep. 2005.
• [6] L. Li, Q. Chen, Q. Yuan, and K. Sawaya, “Ultra-wideband suppression of ground bounce noise in multilayer PCB using locally embedded planar electromagnetic bandgap structures.” IEEE Antenna Wireless Propag. Lett. vol. 8, pp. 740–743, 2009.
• [7] International Technology Roadmap for Semiconductors. London, U.K. (2008). [Online]. Available: http: //www. itrs.net/.
• [8] S.Shahparnia and O.M.Ramahi,“Electromagnetic interference (EMI) reduction from printed circuit boards(PCB) using Electromagnetic bandgap structures,” IEEE Trans. Electrom., Compat., Vol.46, no.4, pp.580-586, Nov, 2006.
• [9] T.Kamgaing and O.M.Ramahi,“Design and modeling of highimpedance electromagnetic surface for switching noise suppression in power planes,” IEEE Trans.Electrom., compat., vol.47 no.3, pp.479-489. Aug, 2005.
• [10] K.C.Gupta, R. Garge, I. Bahl, and P. Bhartis, Microstrip Lines and Slotlines. Norwood, MA: Artech House, 1996.
• [11] Ramahi, O.M., Mohajer-Iravani, B., Qin, J.; Shahparnia, S., and Kamgaing, T., "EMI Suppression and Switching Noise Mitigation in Packages and Boards using Electromagnetic Band Gap Structures," Signals, Systems and Electronics, 2007. ISSSE '07. International Symposium on, vol., no., pp.271-274, July 30 2007-Aug, 2007.