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Recovery of metals from printed circuit boards by means of electrostatic separation

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Warianty tytułu
Języki publikacji
EN
Abstrakty
EN
Without the use of appropriate recycling technologies, the growing amount of electronic waste in the world can be a threat to the development of new technologies, and in the case of improper waste management, may have a negative impact on the environment. This is due to the fact that this waste contains large amounts of valuable metals and toxic polymers. Therefore, it should be recycled in accordance with the assumptions of the circular economy. The methods of mechanical recovery of metals from electronic waste, including printed circuits, may be widely used in the future by waste management companies as well as metal production and processing companies. That is why, a well-known and easily applicable electrostatic separation (ES) method was used to recover metals from printed circuit boards. The grain class of 0.32 - 0.10 mm, obtained after grinding the boards, was fed to a separator. Feed and separation products were analyzed by means of ICP-AES, SEM/EDS and XRD. The concentrate yield obtained after electrostatic separation amounted to 32.3% of the feed. Its density was 11.1 g/cc. Out of the 91.44% elements identified in the concentrate, over 90% were metals. XRD, SEM observations and EDS analysis confirmed the presence of non-metallic materials in the concentrate. This relatively high content of impurities indicates the need to grind printed circuit board into grain classes smaller than 0.32-0.10 mm.
Słowa kluczowe
Wydawca
Rocznik
Tom
Strony
213--219
Opis fizyczny
Bibliogr. 31 poz., rys., tab.
Twórcy
autor
  • Silesian University of Technology Faculty of Mining, Safety Engineering and Industrial Automation Akademicka Str., 44-100 Gliwice, Poland
  • Silesian University of Technology Faculty of Mining, Safety Engineering and Industrial Automation Akademicka Str., 44-100 Gliwice, Poland
  • Silesian University of Technology Faculty of Mechanical Engineering Department of Engineering Materials and Biomaterials 18A Konarskiego Str., 44-100 Gliwice, Poland
  • Silesian University of Technology Faculty of Mechanical Engineering Department of Engineering Materials and Biomaterials 18A Konarskiego Str., 44-100 Gliwice, Poland
autor
  • Silesian University of Technology Faculty of Mechanical Engineering Department of Engineering Materials and Biomaterials 18A Konarskiego Str., 44-100 Gliwice, Poland
Bibliografia
  • [1] A. Cieśla, W. Kraszewski, M. Skowron, A. Surowiak, P. Syrek. “Wykorzystanie bębnowego separatora elektrodynamicznego do separacji odpadów elektronicznych.” Mineral resources management, vol. 32(1), pp. 155-174, 2016.
  • [2] A. Kumar, M. E. Holuszko, T. Janke. “Characterization of the non-metal fraction of the processed waste printed circuit boards.” Waste Management, vol. 75, pp. 94-102, 2018.
  • [3] A. Tuncuk, V. Stazi, A. Akcil, E.Y. Yazici, H. Deveci. “Aqueous metal recovery techniques from e-scrap: Hydrometallurgy in recycling.” Minerals Engineering, vol. 25, pp. 28-37, 2012.
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  • [5] C.P. Baldé, V. Forti, V. Gray, R. Kuehr, P. Stegmann, 2017. “The Global E-waste Monitor–2017” United Nations University (UNU), International Telecommunication Union (ITU) & International Solid Waste Association (ISWA), Bonn/Geneva/Vienna.
  • [6] D. Franke, T. Suponik. “Metals recovery from e-scrap using gravity, electrostatic and magnetic separations.” IOP Conf. Series: Materials Science and Engineering 545(012016), 2019.
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  • [9] J. Drzymała. “Mineral processing.” Ofic. Wyd. PWr, Wrocław, 2007. [10] J. Guo, J. Guo, Z. Xu. “Recycling of non-metallic fractions from waste printed circuit boards: A review.” Journal of Hazardous materials, vol. 168(2-3), pp. 567-590, 2009.
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  • [12] J. LaDou. “Printed circuit board industry” International Journal of Hygiene and Environmental Health, vol.209 (3), pp. 211-219, 2006.
  • [13] J. Li, Q. Zhou, Z. Xu, “Real-time monitoring system for improving corona electrostatic separation in the process of recovering waste printed circuit boards”, Waste Manag Res, vol. 32, no. 12, pp. 1227-1234, 2014.
  • [14] J. Li, Z. Xu, and Y. Zhou, “Application of corona discharge and electrostatic force to separate metals and nonmetals from crushed particles of waste printed circuit boards”, Journal of Electrostatics, vol. 65, no. 4, pp. 233-238, 2007.
  • [15] J. Sohaili, S.K. Muniyandi, S.S. Mohamad. “A review on printed circuit board recycling technology.” Journal of Emerging Trends in Engineering and Applied Sciences, vol. 3(1), pp. 12-18, 2012.
  • [16] J. Wu, J. Li, and Z. Xu, “Electrostatic Separation for Recovering Metals and Nonmetals from Waste Printed Circuit Board: Problems and Improvements”, Environ. Sci. Technol., vol. 42, no. 14, pp. 5272-5276, 2008.
  • [17] J. Wu, J. Li, Z. Xu. “Electrostatic separation for multi-size granule of crushed printed circuit board waste using tworoll separator.” Journal of hazardous materials, vol. 159(2- 3), pp. 230-23, 2008.
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  • [20] M. Tatariants, S. Yousef, R. Sidaraviciute, G. Denafas, R. Bendikiene. “Characterization of waste printed circuit boards recycled using a dissolution approach and ultrasonic treatment at low temperatures.” RSC Adv. 7 , pp. 37729- 37738, 2017.
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  • [22] R. G. Charles, P. Douglas, I. L. Hallin, I. Matthews, G. Liversage. “An investigation of trends in precious metal and copper content of RAM modules in WEEE: Implications for long term recycling potential.” Waste Management vol. 60, pp. 505-520, 2017.
  • [23] A. Elbakian, B. Sentyakov, P. Bozek, I. Kuric, K. Sentyakov. Automated separation of basalt fiber and other earth resources by the means of acoustic vibrations. Acta Montanistica Slovaca. Vol. 23, no. 3, pp. 271-281, 2018.
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  • [26] V. Kumar, J. C. Lee, J. Jeong, M. K. Jha, B.S. Kim, R. Singh. “Recycling of printed circuit boards (PCB) to generate enriched rare metal concentrate.” Journal of Industrial and Engineering Chemistry, vol. 21, pp. 805-813, 2015.
  • [27] W. Bizzo, R. Figueiredo, V. de Andrade. “Characterization of printed circuit boards for metal and energy recovery after milling and mechanical separation.” Materials, vol. 7(6), pp. 4555-4566, 2014.
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  • [30] R. Qiu et al., “Recovering full metallic resources from waste printed circuit boards: A refined review”, Journal of Cleaner Production, vol. 244, p. 118690, 2020.
  • [31] Y. Chen, G. Zhu, Y. Zhou, M. Wang, X. Jia, X. Zhu. “Reflow soldering method with gradient energy band generated by optical system.” Optics express, vol. 26(22), pp. 29103- 29215, 2018.
Uwagi
Opracowanie rekordu ze środków MNiSW, umowa Nr 461252 w ramach programu "Społeczna odpowiedzialność nauki" - moduł: Popularyzacja nauki i promocja sportu (2020).
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-608a63c7-44fb-4ace-bdaa-0c33804be1dd
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