Thermal investigations of PCM enhanced electronics cooling

• Autorzy: Felczak Mariusz , Więcek Bogusław
• Języki publikacji: EN

Abstrakty

EN

The paper presents experimental results of PCM (Phase Change Material) enhanced cooling system. The investigations were focused on obtaining the best results of the cooling system during its start-up. The latent heat of phase change material was used to decrease temperature of the cooled electronic device. Comparison of a standard heat sink available on the market and the same heat sink filled with PCM applications was done. Temperature was monitored and registered during device start-up until its thermal steady state. It was done using contact and IR temperature measurement methods. PCMs usage enabled to absorb heat during electronic device start-up. The paper proves that using PCMs it is possible to delay temperature rise during electronic devices heating.

Słowa kluczowe

EN

heat exchange; phase change materials; thermal impedance; cooling of electronic systems

• Wydawca: Wydawnictwo PAK
• Czasopismo: Measurement Automation Monitoring
• Rocznik: 2019
• Tom: Vol. 65, No. 2
• Strony: 44--47
• Opis fizyczny: Bibliogr. 12 poz., rys., wykr., wzory

Twórcy

autor

Felczak Mariusz

• Lodz University of Technology, 90-924 Lodz, 211/215 Wolczanska St., Poland

autor

Więcek Bogusław

• Lodz University of Technology, 90-924 Lodz, 211/215 Wolczanska St., Poland

Bibliografia

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• [3] Kałuża K., Felczak M., and Więcek B.: Thermal analysis and measurements of spiral inductors using built-in and IR sensors. QIRT Conference, 2014.
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• [5] Pourakabara A., Rabienataj Darzib A. A.: Enhancement of phase change rate of PCM in cylindrical thermal energy storage. Applied Thermal Engineering, 150 (2019), pp. 132–142.
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• [7] Santos T., Kolokotroni M., Hopper. N, Yearley K.: Experimental study on the performance of an new encapsulation panel form PCM’s to be used in the PCM-Air heat exchanger. 2nd International Conference on Sustainable Energy and Resource Use in Food Chains, ICSEF 2018, 17-19 October 2019, Paphos, Cyprus, Energy Procedia, 161 (2019) 352-359.
• [8] Kawka P., De Mey G., Vermeersch B.: Thermal characterization of electronic packages using the Nyquist plot of the thermal impedance, IEEE Transaction on Components and Packaging Technologies, 2007, vol. 30, pp. 660-665.
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• [12] https://www.rubitherm.eu/en/productCategories.html

Uwagi

PL

Opracowanie rekordu w ramach umowy 509/P-DUN/2018 ze środków MNiSW przeznaczonych na działalność upowszechniającą naukę (2019).