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The Analysis Of Accuracy Of Selected Methods Of Measuring The Thermal Resistance Of IGBTs

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Warianty tytułu
Języki publikacji
EN
Abstrakty
EN
In the paper selected methods of measuring the thermal resistance of an IGBT (Insulated Gate Bipolar Transistor) are presented and the accuracy of these methods is analysed. The analysis of the measurement error is performed and operating conditions of the considered device, at which each measurement method assures the least measuring error, are pointed out. Theoretical considerations are illustrated with some results of measurements and calculations.
Rocznik
Strony
455--464
Opis fizyczny
Bibliogr. 33 poz., rys., tab., wykr., wzory
Twórcy
autor
  • Gdynia Maritime University, Faculty of Electrical Engineering, Morska 83, 81-225 Gdynia, Poland
autor
  • Gdynia Maritime University, Faculty of Electrical Engineering, Morska 83, 81-225 Gdynia, Poland
Bibliografia
  • [1] Rashid, M.H. (20017). Power Electronic Handbook. Academic Press.
  • [2] Ericson, R., Maksimowic, D. (2001). Fundamentals of Power Electronics. Norwell: Kluwer Academic Publisher.
  • [3] Basso, C. (2001). Switch - Mode Power Supply SPICE Cookbook. New York: McGraw-Hill.
  • [4] Singh, J.(2001). Semiconductor Devices. Basic Principles. John Wiley & Sons.
  • [5] Castellazzi, A., Gerstenmaier, Y.C., Kraus, R., Wachutka, G.K.M. (2006). Reliability analysis and modeling of power MOSFETs in the 42-V-PowerNet. IEEE Transactions on Power Electronics, 21(3), 603-612.
  • [6] Górecki, K., Górecki, P. (2014). Modelling the influence of self-heating on characteristics of IGBTs. Proc. of the 21st International Conference Mixed Design of Integrated Circuits and Systems MIXDES, Lublin, 298-302.
  • [7] Alexakis, P., Alatise, O., Hu, J., Jahdi, S., Ran, L., Mawby, P.A. (2014). Improved electrothermal ruggedness in Sic mosfets compared with silicon IGBTS. IEEE Transactions on Electron Devices, 61(7), 2278-2286.
  • [8] Lidow, A., Knzer, D., Sheridan, G., Tam, D. (2001). The Semiconductor Roadmap for Power Managment in the New Millennium. Proc. of the IEEE, 89(6), 803-812.
  • [9] Zarębski, J., Górecki, K. (2010). The electrothermal large-signal model of power MOS transistors for SPICE. IEEE Transaction on Power Electronics, 25(5-6), 1265-1274.
  • [10] Gould, C.A., Shammas, N.Y.A., Grainger, S., Taylor, I. (2011). Thermoelectric cooling in microelectronic circuits and waste heat electrical power generation in a desktop personal computer. Materials Science and Engineering B, 176(4), 316-325.
  • [11] Garimella, S.V., Singhal, V., Liu, D. (2006). On-chip thermal management with microchannel heat sinks and integrated micropumps. Proc. of the IEEE, 94(8), 1534-1548.
  • [12] Górecki, K., Zarębski, J. (2014). The semiconductor device thermal model taking into account non-linearity and multhipathing of the cooling system. Journal of Physics, Conference Series, 494(012008).
  • [13] Górecki, K., Zarębski, J. (2014). Modeling the influence of selected factors on thermal resistance of semiconductor devices. IEEE Transactions on Components, Packaging and Manufacturing Technology, 4, (3), 421-428.
  • [14] Székely, V., Rencz, M., Courtois, B. Thermal investigations of ICs and Microstructures. Sensors and Actuators; A Physical, A 71(1-2), 1.
  • [15] Blackburn, D.L. (2004). Temperature Measurements of Semiconductor Devices - A Review. 20th IEEE Semicon. Thermal Measur. and Menagement Symp. SEMI-THERM, San Jose, 70-80.
  • [16] Oettinger, F.F., Blackburn, D.L. (1990). Semiconductor Measurement Technology: Thermal Resistance Measurements. U. S. Department of Commerce, NIST/SP-400/86.
  • [17] Zarębski, J., Górecki, K. (2008). A Method of the Thermal Resistance Measurements of Semiconductor Devices with P-N Junction. Measurement, 41(3), 259-265.
  • [18] Zarębski, J., Górecki, K. (2007). A New Method for the Measurement of the Thermal Resistance of the Monolithic Switched Regulator LT1073. IEEE Transaction on Instrumentation and Measurement, 56(5), 2101-2104.
  • [19] Frankiewicz, M., Gołda, A., Kos, A. (2014). Investigation of heat transfer in integrated circuits. Metrol. Meas. Syst., 21(1), 111-120.
  • [20] Zarębski, J., Dąbrowski, J., Bisewski, D. (2011). Measurements of thermal parameters of silicon carbide semiconductor devices. Przegląd Elektrotechniczny, 87(10), 29-32.
  • [21] Kuball, M., Pomeroy, J.W., Simms, R., Riedel, G.J., Ji, H.F., Sarua, A., Uren, M.J., Martin, T. (2007). Thermal properties and reliability of GaN microelectronics: Sub-micron spatial and nanosecond time resolution thermography. 4th IEEE Compound Semiconductor Integrated Circuit Symposium, Portland, 135-138.
  • [22] Zarębski, J., Górecki, K. (2007). A New Measuring Method of the Thermal Resistance of Silicon P-N Diodes. IEEE Transaction on Instrumentation and Measurement, 56(6), 2788-2794.
  • [23] Krac, E., Górecki, K. (2014). Measurements of Thermal Resistance of Solar Cells. Zeszyty Naukowe AMG, 84, 56-65.
  • [24] Górecki, K., Górecki, P. (2014). The analysis of accuracy of the selected methods of measuring of thermal resistance of IGBTs. Proc. of 38th International Conference IMAPS-CPMT Poland 2014, Rzeszów-Czarna, 111.
  • [25] Emissivity Coefficients of some common Materials. http://www.engineeringtoolbox.com/emissivity-coefficients-d_447.html
  • [26] Górecki, K., Zarębski, J.(2000). The pulse methods of the thermal parameters measurement in the Darlington Power transistor. Metrol. Meas. Syst., 7(3), 287-302.
  • [27] Górecki, K., Górecki, P.(2013). The DC measurement method of thermal resistance of IGBTs. Proc. of the 20th Int. Conf. Mixed Design of Integrated Circuits and Systems MIXDES 2013, Gdynia, 333-337.
  • [28] Górecki, K., Zarębski, J., Górecki, P. (2013). The manner and the circuit to measure thermal resistance of the isolated gate bipolar transistor. Patent registration No. P403813.
  • [29] Górecki, K., Zarębski, J. (2012). DC measurements method of the thermal resistance of power MOSFETs. Proc. of the 19th Internationa Conference Mixed Design of Integrated Circuits and Systems MIXDES 2012, Warszawa, 304-308.
  • [30] Castrup, H.T., Eicke, W.G., Hayes, J.L., Mark, A., Martin, R.E., Taylor, J.L. (1994). Metrology - Calibration and Measurement Processes Guidelines. NASA Reference Publication XXXX.
  • [31] Szekely, V. (1997). A New Evaluation Method of Thermal Transient Measurement Results. Microelectronic Journal, 28(3), 277-292.
  • [32] Górecki, K., Zarębski, J. (2010). Nonlinear compact thermal model of power semiconductor devices. IEEE Transactions on Components and Packaging Technologies, 33(3), 643-647.
  • [33] PT-3S Miniatur-Infrarot-Thermometer. Technical data and users manual, ASM, http://www.asm-sensor.com/asm/pdf/pro/pt3s_de.pdf
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-5d4f36fe-e1d0-4254-a8f4-9f87b611e3e7
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