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This paper demonstrates a non-destructive technique to evaluate the internal microstructure in the Sn-Ag-Cu (SAC) solder joint through synchrotron X-ray radiation tomography. Synchrotron X-ray tomography is increasingly utilized for characterizing the internal microstructure of materials in 3D images. A 3D model is reconstructed from a set of 2D projection images taken from different angles and angular position during the sample rotation, thus it could provide a more comprehensive description of the microstructure of an alloy compared to 2D images. In this paper, it is successfully observed and evaluated the internal microstructure of a 900 μm solder joint sample. The key principles and methods of synchrotron X-ray tomography are briefly described. Examples of quantitative and qualitative assessments on the grain refinement effect of Mg addition to SAC35 solder joint are also presented in this paper.
Słowa kluczowe
Wydawca
Czasopismo
Rocznik
Tom
Strony
661--665
Opis fizyczny
Bibliogr. 24 poz., fot., rys.
Twórcy
autor
- Universiti Malaysia Perlis, Centre of Excellent on Geopolymer and Green Technology (CEGeoGTech), 02600 Perlis, Malaysia
- Universiti Malaysia Perlis, Centre of Excellent on Geopolymer and Green Technology (CEGeoGTech), 02600 Perlis, Malaysia
autor
- Universiti Malaysia Perlis, Centre of Excellent on Geopolymer and Green Technology (CEGeoGTech), 02600 Perlis, Malaysia
autor
- Czestochowa University of Technology, Department of Physics, Faculty of Production Engineering and Materials Technology, 42-200 Czestochowa, Poland
autor
- Lodz University of Technology, Institute of Materials Science and Engineering, 90-924 Lodz, Poland
Bibliografia
- [1] B. Cai, J.Wang, A. Kao, K. Pericleous, A.B. Phillion, R.C. Atwood, P.D. Lee, 4D synchrotron X-ray tomographic quantification of the transition from cellular to dendrite growth during directional solidification. Acta Materialia 117, 160-169(2016). DOI: https://doi.org/10.1016/j.actamat.2016.07.002
- [2] W. Lin, B. Zhou, Y. Liu, X.Guo, T. Zheng, Y. Zhong, Q. Wang, Dendrite morphology in Al-20 wt.% Cu hypoeutectic alloys in 24 tesla high magnetic field quantified by ex-situ X-ray tomography. Journal of Alloys and Compounds, 165679. (2022). DOI: https://doi.org/10.1016/j.jallcom.2022.165679
- [3] Z. Song, O.V. Magdysyuk, T. Sparks, Y.-L. Chiu, B. Cai, Revealing growth mechanisms of faceted Al2Cu intermetallic compounds via high-speed Synchrotron X-ray tomography, Acta Materialia 231, 117903 (2022). DOI: https://doi.org/10.1016/j.actamat.2022.117903
- [4] Z. Zhang, C. Wang, B. Koe, C.M. Schlepütz, S. Irvine, J. Mi, Synchrotron X-ray imaging and ultrafast tomography in situ study of the fragmentation and growth dynamics of dendritic microstructures in solidification under ultrasound, Acta Materialia 209, 116796 (2021). DOI: https://doi.org/10.1016/j.actamat.2021.116796
- [5] H. Yasuda, T. Kawarasaki, Y. Tomiyori, Y. Kato, K. Morishita, Characterization of dendritic growth in Fe-C system using time-resolved X-ray tomography and physics-based filtering. In IOP Conference Series: Materials Science and Engineering 529, 1, 012023 (2019). IOP Publishing. DOI: https://doi.org/10.1088/1757-899X/529/1/012023
- [6] A. Bharti, N. Goyal, Fundamental of Synchrotron Radiations. In Synchrotron Radiation-Useful and Interesting Applications: IntechOpen, (2019). DOI: https://doi.org/10.5772/intechopen.82202
- [7] Z. Ding, N. Zhang, L. Yu, W. Lu, J. Li, Q.D. Hu, Recent Progress in Metallurgical Bonding Mechanisms at the Liquid/Solid Interface of Dissimilar Metals Investigated via in situ X-ray Imaging Technologies. Acta Metallurgica Sinica (English Letters): DOI: https://doi.org/10.1007/s40195-021-01193-6
- [8] Y. Wang, S.C. Garcea, P.J. Withers, 7.6 Computed Tomography of Composites, in Comprehensive Composite Materials II, P.W.R. Beaumont and C.H. Zweben, Eds. Oxford: Elsevier 101-118. (2018). DOI: https://doi.org/10.1016/j.compscitech.2017.10.023
- [9] K. Naresh, K.A. Khan, R. Umer, W.J. Cantwell, The use of X-ray computed tomography for design and process modeling of aerospace composites: A Review. Materials & Design 190, 108553 (2020). DOI: https://doi.org/10.1016/j.matdes.2020.108553
- [10] K.E. Yazzie, J.J. Williams, N.C. Phillips, F. De Carlo, N. Chawla, Multiscale microstructural characterization of Sn-rich alloys by three dimensional (3D) X-ray synchrotron tomography and focused ion beam (FIB) tomography. Materials Characterization 70, 33-41 (2012). DOI: https://doi.org/10.1016/j.matchar.2012.05.004
- [11] M. Sona, K.N. Prabhu, Review on microstructure evolution in Sn-Ag-Cu solders and its effect on mechanical integrity of solder joints. Journal of Materials Science: Materials in Electronics 24, 3149-3169 (2013). DOI: https://doi.org/10.1007/s10854-013-1240-0
- [12] S. Zhang, Z. Wang, J. Wang, G. Duan, H. Li, Study on the Influence of Defects on Fracture Mechanical Behavior of Cu/SaC305/Cu Solder Joint. Materials 15 (14), 4756(2022). DOI: https://doi.org/10.3390/ma15144756
- [13] M.A.A. Mohd Salleh, A. Sugiyama, H. Yasuda, S. Mcdonald, K. Nogita, In Situ Soldering Process Technique by Synchrotron X-Ray Imaging. Applied Mechanics and Materials 754-755, 508-512 (2015). DOI: https://doi.org/10.4028/www.scientific.net/AMM.754-755.508
- [14] C.Y. Tan, M.M. Salleh, X.F. Tan, H. Yasuda, N. Saud, M.I.I. Ramli, K. Nogita, Properties of Sn-3 wt% Ag-5 wt% Cu alloys with Cu6Sn5 intermetallics grain refined by Mg. Materials Today Communications 31, 103221 (2022). DOI: https://doi.org/10.1016/j.mtcomm.2022.103221
- [15] S.A. Musa, M.A.A. Mohd Salleh, N. Saud, Zn-Sn Based High Temperature Solder - A Short Review. Advanced Materials Research 795, 518-521 (2013). DOI: https://doi.org/10.4028/www.scientific.net/AMR.795.518
- [16] S. Mcdonald, K. Nogita, J. Read, T. Ventura, T. Nishimura, Influence of composition on the morphology of primary Cu6Sn5 in Sn-4Cu alloys. Journal of Electronic Materials 42 (2), 256-262 (2013). DOI: https://doi.org/10.1007/s11664-012-2222-3
- [17] G. Zeng, S.D. McDonald, D. Mu, Y. Terada, H. Yasuda, Q. Gu, M.M. Salleh, K. Nogita, The influence of ageing on the stabilisation of interfacial (Cu, Ni) 6 (Sn, Zn) 5 and (Cu, Au, Ni) 6Sn5 intermetallics in Pb-free Ball Grid Array (BGA) solder joints. Journal of Alloys and Compounds 685, 471-482. (2016). DOI: https://doi.org/10.1016/j.jallcom.2016.05.263
- [18] F. Somidin, H. Maeno, X.Q. Tran, S.D. McDonald, M.A.A. Mohd Salleh, S. Matsumura, K. Nogita, Imaging the polymorphic transformation in a single Cu6Sn5 grain in a solder joint. Materials 11 (11), 2229 (2018). DOI: https://doi.org/10.3390/ma11112229
- [19] F. Somidin, H. Maeno, M.M. Salleh, X.Q. Tran, S.D. McDonald, S. Matsumura, K. Nogita, Characterising the polymorphic phase transformation at a localised point on a Cu6Sn5 grain. Materials Characterization 138, 113-119 (2018). DOI: https://doi.org/10.1016/j.matchar.2018.02.006
- [20] K. Nogita, M.A.A. Mohd Salleh, E. Tanaka, G. Zeng, S.D. McDonald, S. Matsumura, In situ TEM observations of Cu6Sn5 polymorphic transformations in reaction layers between Sn-0.7Cu solders and Cu substrates. Jom, 68 (11), 2871-2878 (2016). DOI: https://doi.org/10.1007/s11837-016-2020-0
- [21] M.I.I. Ramli, M.M. Salleh, H. Yasuda, J. Chaiprapa, K. Nogita, The effect of bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05 Ni alloys for high strength soldering. Materials & Design 186, 108281 (2020). DOI: https://doi.org/10.1016/j.matdes.2019.108281
- [22] M.M. Salleh, S.D. McDonald, Y. Terada, H. Yasuda, K. Nogita, Development of a microwave sintered TiO2 reinforced Sn-0.7 wt% Cu-0.05 wt% Ni alloy. Materials & Design 82, 136-147(2015). DOI: https://doi.org/10.1016/j.matdes.2015.05.077
- [23] J.W. Xian, M.A.A. Mohd Salleh, S.A. Belyakov, T.C. Su, G. Zeng, K. Nogita, H. Yasuda, C.M. Gourlay. Influence of Ni on the refinement and twinning of primary Cu6Sn5 in Sn-0.7 Cu-0.05 Ni. Intermetallics 102, 34-45 (2018). DOI: https://doi.org/10.1016/j.intermet.2018.08.002
- [24] M.A.A. Mohd Salleh, M.H. Hazizi, Z.A. Ahmad, K. Hussin, K.R. Ahmad, Wettability, Electrical and Mechanical Properties of 99.3Sn-0.7Cu/Si3N4 Novel Lead-Free Nanocomposite Solder. Advanced Materials Research 227, 106-111 (2011). DOI: https://doi.org/10.4028/www.scientific.net/AMR.277.106
Uwagi
The authors would like to gratefully thank the Universiti Malaysia Perlis (UniMAP)-Nihon Superior Ltd Co. collaboration research project and Fundamental Research Grant Scheme (FRGS) by Malaysia’s Ministry of Higher Education for the financial support (Ref: FRGS/1/2020/TK0/UniMAP/02/48). Many thanks to Dr. Kentaro Uesugi, Prof. Hideyuki Yasuda and his research team for technical supports at BL20XU of Spring-8. The contributions of Assoc. Prof. Mohd Arif Anuar Mohd Salleh and Prof. Kazuhiro Nogita to guidance and consultants to this paper are gratefully acknowledged.
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-50bcd1e0-5e59-426c-9fbc-9a684725f4f0
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