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Effect of Ag on Sn-Cu and Sn-Zn lead free solders

Identyfikatory
Warianty tytułu
Języki publikacji
EN
Abstrakty
EN
Lead and lead-containing compounds are considered as toxic substances due to their detrimental effect on the environment. Sn-based soldering systems, like Sn-Cu and Sn-Zn are considered as the most promising candidates to replace the eutectic Sn-Pb solder compared to other solders because of their low melting temperature and favorable properties. Eutectic Sn-0.7 wt.% Cu and near eutectic composition Sn-8 wt.% Zn solders have been considered here for study. For the Sn-Cu system, besides the eutectic Sn-0.7 wt.% Cu composition, Sn-1Cu and Sn-2Cu were studied. Three compositions containing Ag: Sn-2Ag-0.7Cu, Sn-2.5Ag-0.7Cu and Sn-4.5Ag-0.7Cu were also developed. Ag was added to the eutectic Sn-0.7 wt.% Cu composition in order to reduce the melting temperature of the eutectic alloy and to enhance the mechanical properties. For the Sn-Zn system, besides the Sn-8 wt.% Zn near eutectic composition, Sn-8Zn-0.05Ag, Sn-8Zn-0.1Ag and Sn-8Zn-0.2Ag solder alloys were developed. The structure and morphology of the solder alloys were analyzed using a scanning electron microscope (SEM), filed emission scanning electron microscope (FESEM), electron diffraction X-ray spectroscopy (EDX) and X-ray diffraction (XRD). Thermal analysis of the alloys was also done using a differential scanning calorimeter (DSC). Trace additions of Ag have been found to significantly reduce the melting temperature of the Sn-0.7 wt.% Cu and Sn-8 wt.% Zn alloys.
Słowa kluczowe
Wydawca
Rocznik
Strony
317--330
Opis fizyczny
Bibliogr. 33 poz., rys.
Twórcy
autor
  • Department of Metallurgical and Materials Engineering, National Institute of Technology Rourkela, Orissa, Pin-769008, India
autor
  • Department of Metallurgical and Materials Engineering, National Institute of Technology Rourkela, Orissa, Pin-769008, India
autor
  • Department of Metallurgical and Materials Engineering, National Institute of Technology Rourkela, Orissa, Pin-769008, India
Bibliografia
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Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-4f1c56dc-0b6b-44f0-98b4-e711b79de3a3
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