Automation of selected brazes' dynamic properties in high-temperatures' measurement process

• Autorzy: Sankowski D. , Bakala M , Wojciechowski R.
• Języki publikacji: EN

Abstrakty

EN

The good quality of several manufactured components frequently depends on solidliquid interactions existing during processing. Nowadays, the research in material engineering focuses also on modern, automatic measurement methods of joining process properties, i.a. wetting force and surface tension, which allows for quantitative determination of above mentioned parameters. In the paper, the brazes’ dynamic properties in high-temperatures’ measurement methodology and the stand for automatic determination of braze’s properties, constructed and implmented within the research grant nr KBN N N519 441 839 - An integrated platform for automatic measurement of wettability and surface tension of solders at high temperatures, are widely described.

Słowa kluczowe

EN

high-temperature; ADSA model; image analysis

• Wydawca: Instytut Telekomunikacji i Informatyki Uniwersytetu Technologiczno-Przyrodniczego w Bydgoszczy
• Czasopismo: Image Processing & Communications
• Rocznik: 2013
• Tom: Vol. 18, no. 2-3
• Strony: 33--41
• Opis fizyczny: Bibliogr. 11 poz., rys.

Twórcy

autor

Sankowski D.

• Institute of Applied Computer Science, Lodz University of Technology

autor

Bakala M

• [e-mail]
• Institute of Applied Computer Science, Lodz University of Technology

autor

Wojciechowski R.

• Institute of Applied Computer Science, Lodz University of Technology

Bibliografia

• [1] Adobe Flex, http://www.adobe.com 2013
• [2] H.Y. Chang, S.W. Chen, D.S.H. Wong, H.F. Hsu, Determination of reactive wetting properties of Sn, Sn-Cu, Sn-Ag, and Sn-Pb alloys using a wetting balance technique, J. Mater. Res., vol. 18, pp. 1420-1428, 2003
• [3] N. Eustanthopoulos, M.G. Nicholas, B. Drevet, Wettability at High Temperatures, Pergamon Press 1999
• [4] S. Hartland: Surface and Interfacial Tension, Measurement, Theory, and Applications, CRC Press 2004
• [5] Hibernate, http://www.hibernate.org 2013
• [6] International Electrotechnical Commision, IEC 61131-3, PLC’s programming languages 2013
• [7] JAX-WS, http://jax-ws.java.net 2013
• [8] J.Y. Park, C.S. Kang, J.P. Jung, The analysis of the withdrawal force curve of the wetting curve using 63Sn-37Pb and 96.5Sn-3. 5Ag eutectic solders, J.Electron. Mater., vol. 28, pp. 1256-1262, 1999
• [9] D. Sankowski, M. Bakala, A. Albrecht, R. Wojciechowski, Methodology of surface tension determination using maximum bubble pressure method, Metrologia dzis i jutro, pp. 407-414, 2010
• [10] Spring, http://www.springsource.org 2013
• [11] WAGO Innovative Connections, http://wago.com2013