Correlation Between Pin Misalignment and Crack Length in THT Solder Joints

• Autorzy: Molnar A. , Benke M. , Gacsi Z.

Identyfikatory

DOI

10.1515/amm-2017-0154

• Języki publikacji: EN

Abstrakty

EN

In this manuscript, correlations were searched for between pin misalignments relative to PCB bores and crack propagation after cyclic thermal shock tests in THT solder joints produced from lead-free solder alloys. In total, 7 compositions were examined including SAC solders with varying Ag, Cu and Ni contents. The crack propagation was initiated by cyclic thermal shock tests with 40°C / +125°C temperature profiles. Pin misalignments relative to the bores were characterized with three attributes obtained from one section of the examined solder joints. Cracks typically originated at the solder/pin or solder/bore interfaces and propagated within the solder. It was shown that pin misalignments did not have an effect on crack propagation, thus, the solder joints’ lifetime.

Słowa kluczowe

EN

THT solder joint; pin misalignment; crack propagation; thermal shock tests

• Wydawca: Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences
• Czasopismo: Archives of Metallurgy and Materials
• Rocznik: 2017
• Tom: Vol. 62, iss. 2B
• Strony: 1063--1066
• Opis fizyczny: Bibliogr. 8 poz., rys., tab.

Twórcy

autor

Molnar A.

• Institute of Physical Metallurgy, Metal forming and Nanotechnology, University of Miskolc, H-3515 Miskolc-Egyetemvaros, B1/109., Hungary

autor

Benke M.

• Institute of Physical Metallurgy, Metal forming and Nanotechnology, University of Miskolc, H-3515 Miskolc-Egyetemvaros, B1/109., Hungary

autor

Gacsi Z.

• Institute of Physical Metallurgy, Metal forming and Nanotechnology, University of Miskolc, H-3515 Miskolc-Egyetemvaros, B1/109., Hungary

Bibliografia

• [1] K. J. Puttlitz, K. A. Stalter, Handbook of lead-free solder technology for microelectronic assemblies, Marcel Dekker Inc., New York, 2004.
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• [3] K. S. Kim, S. H. Huh, K. Suganuma, J. Alloy Comp., 352 (2003).
• [4] A. A. El-Daly, A. M. El-Taher, Mat. Design 47 (2013).
• [5] A. A. El-Daly, A. M. El-Taher, T.R. Dalloul, J. Alloys Comp. 587 (2014).
• [6] F. Y. Hung, T. S. Lui, L.H. Chen, C.w: Chan, Mat. Trans. 48, 11 3014-3020 (2007).
• [7] S. Terashima, Y. Kariya, T. Hosoi, M. Tanaka, J. Electro Mat. 32, 102 (2003).
• [8] H. J. Albrecht, P. Frühauf, K. Wilke, SMTA International Conference Proceedings (2009).

Uwagi

EN

Opracowanie ze środków MNiSW w ramach umowy 812/P-DUN/2016 na działalność upowszechniającą naukę (zadania 2017)