Quantitative analysis of voids in multi-layer bonded structures based on transmitted laser ultrasonic waves

• Autorzy: Zhang Kuanshuang , Li Shicheng , Zhou Zhenggan

Identyfikatory

DOI

10.1016/j.acme.2018.08.004

• Języki publikacji: EN

Abstrakty

EN

A laser ultrasonic method based on transmission has been investigated to characterize voids in the bonded layer and its corresponding quantitative strategy has been proposed to feed back accurate manufacturing information on multi-layer metal bonded structures. Characteristics of laser ultrasonic waves obtained at epicentre in a bonded joint were analyzed and interaction of laser ultrasound with voids in the bonded layer was explained with aids of simulation results and experimental data. The longitudinal wave amplitude gradually increases and then decreases with the increase of distances off epicentre, while the shear wave amplitude shows a monotonic decline with distances off epicentre rising. Moreover, the relative sensitivity has been proposed to quantitatively measure the sizes of voids and its variation is from −2.48 dB to −2.44 dB with defects of 3 mm to 15 mm in diameter. The laser ultrasonic C-scan result based on shear waves with transmission can find the small void with 3 mm size and other natural defects. The proposed quantitative method is effective for measurement of void sizes. As a result, laser ultrasonic C-scans on basis of transmitted shear waves jointed with the proposed quantitative method have great potential for quantitative characterization of voids in bonded structures.

Słowa kluczowe

EN

bonded structure; laser ultrasound; void; quantitative characterization

PL

struktura spawana; USG; charakterystyka ilościowa

• Wydawca: Springer ; Wrocław University of Science and Technology
• Czasopismo: Archives of Civil and Mechanical Engineering
• Rocznik: 2019
• Tom: Vol. 19, no. 1
• Strony: 79--90
• Opis fizyczny: Bibliogr. 13 poz., rys., tab., wykr.

Twórcy

autor

Zhang Kuanshuang

• Beijing Jinghang Research Institute of Computing and Communication, Beijing 100074, China

autor

Li Shicheng

• Beijing Jinghang Research Institute of Computing and Communication, Beijing 100074, China

autor

Zhou Zhenggan

• School of Mechanical Engineering and Automation, Beihang University, Beijing 100191, China

Bibliografia

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• [10] K. Zhang, Z. Zhou, J. Zhou, et al., Characteristics of laser ultrasound interaction with multi-layered dissimilar metals adhesive interface by numerical simulation, Appl. Surf. Sci. 353 (2015) 284–290.
• [11] H.X. Sun, X.U. Bai-Qiang, X.U. Chen-Guang, et al., Numerical simulation of laser-generated ultrasound by spectral finite element method in transverse isotropic material, Acta Photon. Sinica 38 (5) (2009) 1041–1046.
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Uwagi

PL

Opracowanie rekordu w ramach umowy 509/P-DUN/2018 ze środków MNiSW przeznaczonych na działalność upowszechniającą naukę (2019)