Numerical investigation of heat transfer enhancement in heat sinks using multiple rows vortex generators

• Autorzy: Fathi Shayan , Yazdi Mohamad Eftekhari , Adamian Armen

Identyfikatory

DOI

10.15632/jtam-pl/115308

• Języki publikacji: EN

Abstrakty

EN

This study investigates the application of multiple rows vortex generators for heat transfer improvement of heat sinks. At first, five different geometries of heat sinks are investigated. After choosing the optimum heat sink geometry based on the heat transfer performance and pressure drop characteristic, application of multiple rows of vortex generators is investigated for heat transfer improvement. The effect of different parameters including the number of vortex generator rows, distance between them and also their inclination angle on the heat transfer performance of heat sinks are studied as well. Numerical investigations are done based on the finite volume method. The numerical computations have been validated with available experimental data. The results show that the wavy form of geometry of heat sinks has the best heat transfer performance among the considered ones. This geometry showed an 11% increase in the heat transfer rate compared to a conventional plate-fin heat sink. In addition, by using one, two and three rows vortex generators, thermal performance of heat sink has been improved by 10, 14 and 16%, respectively.

Słowa kluczowe

EN

computation fluid dynamics; heat sink; multiple rows vortex generator; heat; transfer

• Wydawca: Polskie Towarzystwo Mechaniki Teoretycznej i Stosowanej
• Czasopismo: Journal of Theoretical and Applied Mechanics
• Rocznik: 2020
• Tom: Vol. 58 nr 1
• Strony: 97--108
• Opis fizyczny: Bibliogr. 21 poz., rys., tab.

Twórcy

autor

Fathi Shayan

• Mechanical Engineering Department, Tehran Central Branch, Islamic Azad University, Tehran

autor

Yazdi Mohamad Eftekhari

• Mechanical Engineering Department, Tehran Central Branch, Islamic Azad University, Tehran

autor

Adamian Armen

• Mechanical Engineering Department, Tehran Central Branch, Islamic Azad University, Tehran

Bibliografia

• 1. Costello S., Demulliez M., 2013, Packaging and environmentally induced failures, Hermeticity Testing of MEMS and Microelectronic Packages, Artech House.
• 2. Culham J.R., Muzychka Y.S., 2001, Optimization of plate fin heat sinks using entropy generation minimization, IEEE Transactions on Components and Packaging Technologies, 24, 2, 159-165.
• 3. Feng S., Shi M., Yan H., Sun S., Li F., Lu T.J., 2018, Natural convection in a cross-fin heat sink, Applied Thermal Engineering, 132, 7, 30-37.
• 4. Fiebig M., 1995, Embedded vortices in internal flow: heat transfer and pressure loss enhancement, International Journal of Heat Fluid Flow, 16, 5, 376-388.
• 5. Goldmann L., Howard R., Jeannotte D., 1997, Package reliability,Microelectronics Packaging Handbook, Springer.
• 6. Habchi C., Russeil S., Bougeard D., Harion J.L., Lemenand T., Della Valle D., Peerhossaini H., 2012, Enhancing heat transfer in vortex generator-typemultifunctional heat exchangers, Applied Thermal Engineering, 38, 18, 14-25.
• 7. Hamadneh N., Khan W.A., Sathasivam S., Ong H.C., 2013, Design optimization of pin fin geometry using particle swarm optimization algorithm, PloS one, 8, 5, 66-80.
• 8. Ibitayo O., 2008, Evaluation of Various Die-Attachment Materials and Processes for Power Electronics Packaging, Howard University.
• 9. Jain P., Zhou P., Kim C.H., Sapatnekar S., 2009, Thermal and power delivery challenges in 3D ICs, [In:] Three Dimensional Integrated Circuit Design: EDA, Design and Microarchitectures, 33-61.
• 10. Joo Y., Kim S.J., 2015, Comparison of thermal performance between plate-fin and pin-fin heat sinks in natural convection, International Journal of Heat Mass Transfer, 83, 23, 345-356.
• 11. Keshavarz Moraveji M., Mohammadi Ardehali R., Ijam A., 2013, CFD investigation of nanofluid effects (cooling performance and pressure drop) in mini-channel heat sink, International Communication in Heat Mass Transfer, 40, 1, 58-66.
• 12 .Khanna P., Bhatnagar S., Gust W., 1999, Analysis of packaging and sealing techniques for microelectronic modules and recent advances, Microelectronics International, 16, 2, 8-12.
• 13. Lee M., Kim H.J., Kim D.K., 2016, Nusselt number correlation for natural convection from vertical cylinders with triangular fins, Applied Thermal Engineering, 93, 18, 1238-1247.
• 14. Loh C.K., Chou D.J., 2004, Comparative analysis of heat sink pressure drop using different methodologies, 20th IEEE Semi-Therm Symposium.
• 15. Micheli L., Reddy K.S., Mallick T.K., 2016, Experimental comparison of micro-scaled plate-fins and pin-fins under natural convection, International Communications in Heat and Mass Transfer, 75, 3, 59-66.
• 16. Poulikakos D., Bejan A., 1982, Fin geometry for minimum entropy generation in forced convection, Journal of Heat Transfer, 104, 4, 616-623.
• 17. Salwe A., Bhagat A.U., Gabhane M.G., 2014, Comparison of forced convective heat transfer coefficient between solid pin fin and perforated pin fin, International Journal of Engineering Research and General Science, 2, 3, 2091-2730.
• 18. Shanmugan S., Mutharasu D., Lee Y., 2014, Surface and electrical properties of plasma processed RF sputtered GaN thin film, European Physical Journal of Applied Physics, 68, 3, 52-56, 30303, DOI: 10.1051/epjap/2014140225.
• 19. Takeda S., Masuko T., 2009, Die attach adhesive and films, [In:] Lu D., Wong C. P. [Ed.], Materials for Advanced Packaging, Springer, Boston, MA, 407-436.
• 20. Torii K., Kwak K.M., Nishino K., 2002, Heat transfer enhancement accompanying pressure-loss reduction with winglet-type vortex generators for fin-tube heat exchangers, International Journal of Heat Mass Transfer, 45, 13, 3795-3801.
• 21. Wong C., Clegg D., Kumar A., Ostsuka K., Ozmat B., 1997, Package sealing and encapsulation, Microelectronics Packaging Handbook, Springer.

Uwagi

Opracowanie rekordu ze środków MNiSW, umowa Nr 461252 w ramach programu "Społeczna odpowiedzialność nauki" - moduł: Popularyzacja nauki i promocja sportu (2020).