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Analysis of positioning error and its impact on high frequency properties of differential signal coupler

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Warianty tytułu
Języki publikacji
EN
Abstrakty
EN
This paper presents the analysis of the effect of differential signal coupler positioning accuracy on its high frequency performance parameters for contact-less high speed chip-to-chip data transmission on PCB application. Our considerations are continuation of the previous works on differential signal coupler concept, design methodology and analysis for high speed data transmission monitoring. The theoretical analysis of possible coupler positioning innaccuracies is extended for representative design cases by simulations carried out using EM simulator. The results reported here confirm that the concept of contactless monitoring of high speed chip-to-chip data transmission in a pair of coupled microstrip lines is of practically usefulness without applying the expensive and precise positioning system.
Rocznik
Strony
549--553
Opis fizyczny
Bibliogr. 22 poz., rys., wykr.
Twórcy
autor
  • Faculty of Electronics, Telecommunications and Informatics, Gdańsk University of Technology, 11/12 Narutowicza St., 80-233 Gdańsk, Poland
  • Faculty of Electronics, Telecommunications and Informatics, Gdańsk University of Technology, 11/12 Narutowicza St., 80-233 Gdańsk, Poland
autor
  • Faculty of Electronics, Telecommunications and Informatics, Gdańsk University of Technology, 11/12 Narutowicza St., 80-233 Gdańsk, Poland
Bibliografia
  • [1] M. Zmuda, S. Szczepański, and S. Kozieł, „The contact-less method of chip-to-chip high speed data transmission monitoring”, XII National Conf. Electronics, KKE 2013 1, CD-ROM (2013).
  • [2] M. Zmuda, “ Analysis and design of coupling structures for high speed chip-to-chip data transmission monitoring”, Doctoral Thesis, Politechnika Gdańska, Gdańsk, 2013.
  • [3] M. Zmuda, S. Szczepański, and S. Kozieł, „Microstrip differential signal coupler. concept, design and application”, XI National Conf. on Electronics, KKE 2012 1, CD-ROM (2012).
  • [4] M. Zmuda, S. Szczepański, and S. Kozieł, “Design of novel microstrip directional coupler for differential signal decoupling”, IET Microwaves, Antennas & Propagation 6, 721-728 (2012).
  • [5] M. Zmuda, S. Szczepański, and S. Kozieł, “A new coupler concept for contactless high-speed data transmission monitoring”, IEEE Trans. Instrumentation and Measurement 62, 328-334 (2013).
  • [6] M. Zmuda, S. Szczepański, and S. Kozieł, “Analysis of positioning error and its impact on high frequency performance parameters of differential signal coupler”, XIII National Conf. Electronics 1, CD-ROM (2014).
  • [7] W. Bandurski, Methods of Analysis and Simulation in Highspeed Digital Circuits, Poznań University of Technology Publishing House, Poznań, 2006
  • [8] E.T. Lewis, “High-density high-impedance hybrid circuit technology for gigahertz logic”, IEEE Trans. Components, Hybrids and Manufacturing Technology CHMT-2, 441-450 (1979).
  • [9] H.L. Parks, “Batch-fabricated three-dimensional planar coaxial interconnections for microelectronic systems”, IEEE Trans Computers C-20, 504-511 (1971).
  • [10] R.C. Swengel, T.A. Lemke, and F.P. Villiard, “A coaxial interconnection system for high speed digital processors”, IEEE Trans. Parts, Hybrids and Packaging PHP-10, 181-187 (1974).
  • [11] O.A. Horna, “Nonlinear termination of transmission lines”, IEEE Trans. Computers C-21, 1011-1015 (1972).
  • [12] S. Rosłoniec, “Design of coupled microstrip lines by optimization methods”, IEEE Trans. Microwave Theory and Techniques MTT-35, 1072-1074 (1987).
  • [13] V. Ricciuti, “Power bus signal integrity improvement and EMI mitigation on multilayer high-speed digital PCBs with embedded capacitance”, IEEE Trans. Mobile Computing 2, 314-321 (2003).
  • [14] A.K. Sinha, J.A. Cooper, and H.J. Levistein, “Speed limitations due to interconnect time constants in VLSI integrated circuits”, IEEE Electron. Device Letters 3, 90-92 (1982).
  • [15] A. Tsuchiya, Y. Gotoh, M. Hashimoto, and H. Onodera, “Performance limitation of on-chip global interconnects for highspeed signaling”, IEEE 2004 Custom Integrated Circuits Conf. 1, 489-492 (2004).
  • [16] K. Yamagishi, T. Ishibashi, H. Ohashi, and S. Saito, “A study on high-speed transmission characteristics of interconnections from PCB to chip”, IEEE 9th VLSI Packaging Workshop of Japan 1, 81-84 (2008).
  • [17] F. Gisin and Z. Pantic-Tanner, “Design advances in PCB/backplane interconnects for the propagation of high speed gb/s digital signals”, 6th Int. Conf. Telecommunications in Modern Satelite, Cable and Broadcasting Service, TELSIKS 2003 1, 184-191 (2003).
  • [18] J. Jing and K. Lingwen , “Study of signal integrity for PCB level”, 11th Int. Conf. Electronic Packaging Technology and High Density Packaging 1, 828-833 (2010).
  • [19] A. Geczy and Z. Illyefalvi-Vitez, “Investigating PCB traces for fine pitch applications”, IEEE 16th Int. Symp. for Design and Technology in Electronic Packaging (SIITIME) 1, 147-152 (2010).
  • [20] D. Bem, M. Nawrocki, T. Wieckowski, and R. Zielinski, “Coexistance EMC aspects of DECT Wireless Local Loops (WLL) and DECT cordless telephones”, Vehicular Technology Conf. 4, 2776-2780 (2001).
  • [21] C. Romero, P. Seungwook, M. Park, and Y. Kweon, “Advanced high density interconnection substrate for mobile platform application”, 6th Int. Microsystems, Packaging, Assembly and Circuits Technology Conf. (IMPACT) 1, 214-217 (2011).
  • [22] C.K. Shi, X.M. Hao, and R.S. Sharma, “A cross market study of mobile data services and devices”, IEEE Int. Conf. Management of Innovation and Technology (ICMIT) 1, 455-461 (2010).
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-3fc2bd8f-f01f-4bda-9f0a-3a0bdf714f8e
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