Surface roughness and residual stress evolution in SiNx/SiO2 multilayer coatings deposited by reactive pulsed magnetron sputtering

• Autorzy: Tien Chuen-Lin , Lee Po-Wei , Lin Shih-Chin , Lin Hong-Yi

Identyfikatory

DOI

10.37190/oa210206

• Języki publikacji: EN

Abstrakty

EN

The surface roughness and residual stress behavior in two types of SiN_x/SiO₂ dielectric quarter-wave stacks was investigated experimentally. A reactive pulsed magnetron sputtering system was used to prepare the SiN_x/SiO₂ multilayer thin films. The results show that SiN_x/SiO₂ quarter-wave stack with a buffer layer of MgF₂ thin film can reduce the residual stress. The effect of aging on the residual stress in two quarter-wave stacks was also studied. We found that the residual stresses in both SiN_x/SiO₂ multilayer coatings are changed from a compressive state to a tensile stress state with increasing the aging time. The root mean square (RMS) surface roughness of MgF₂/(SiN_x/SiO₂)²² and (SiN_x/SiO₂)²² quarter-wave stacks are 2.23 ± 0.22 nm and 2.08 ± 0.20 nm, respectively.

Słowa kluczowe

EN

thin film; residual stress; quarter-wave stack; surface roughness

• Wydawca: Oficyna Wydawnicza Politechniki Wrocławskiej
• Czasopismo: Optica Applicata
• Rocznik: 2021
• Tom: Vol. 51, nr 2
• Strony: 223--233
• Opis fizyczny: Bibliogr. 18 poz., rys.

Twórcy

autor

Tien Chuen-Lin

• Department of Electrical Engineering, Feng Chia University, Taichung, Taiwan
• Ph.D. Program of Electrical and Communications Engineering, Feng Chia University, Taichung, Taiwan

autor

Lee Po-Wei

• Department of Electrical Engineering, Feng Chia University, Taichung, Taiwan

autor

Lin Shih-Chin

• Mechanical and Systems Research Lab, Industrial Technology Research Institute, Hsinchu, Taiwan

autor

Lin Hong-Yi

• Ph.D. Program of Electrical and Communications Engineering, Feng Chia University, Taichung, Taiwan

Bibliografia

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Uwagi

Opracowanie rekordu ze środków MNiSW, umowa Nr 461252 w ramach programu "Społeczna odpowiedzialność nauki" - moduł: Popularyzacja nauki i promocja sportu (2021).