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Strength properties of the low-melting-point alloys

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Wybrane pełne teksty z tego czasopisma
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Warianty tytułu
Języki publikacji
EN
Abstrakty
EN
Purpose: The aim of this paper was to determine the strength and elasticity of low melting point alloys. In particular, the laboratory tests were observed to check the shape of the compression curve. This is a result of recrystallization. Design/methodology/approach: The strength and stiffness of the low melting point alloys was found. The unusual shape of the compression curve was observed. In order to determine if it is the result of crystallization, the samples were cooled in the liquid nitrogen. In the next step another attempt will be perform to the compression. Findings: The results of the compression tests and their analysis are presented. Research limitations/implications: Presented research was limited to alloys in the form of small samples. The developed technology of this type of preparation of this type alloys is limited to small volumes because the melts are small and expensive. Practical implications: The low melting point alloys have many possible applications. First of all they are materials with higher thermal conductivity and electrical conductivity. Conducted research programme showed that these materials exhibit also good the mechanical properties. Originality/value: Carrying out of the experiment that explaining of the shape of the compression curve for low-melting-points alloys. This experiment may be have a high educational value for the study. This experiment can have high an educational value for the science.
Rocznik
Strony
26--31
Opis fizyczny
Bibliogr. 18 poz., rys.
Twórcy
  • Departament of Theoretical and Applied Mechanics, Silesian University of Technology, ul. Konarskiego 18a, 44-100 Gliwice, Poland
Bibliografia
  • [1] S. Guruswamy, Engineering Properties and Applications of Lead Alloys, CRC Press, 1999.
  • [2] C. Hornbostel, Construction Materials: Types, Uses and Applications, John Wiley and Sons, 1991.
  • [3] J.P. Kaushish, Manufacturing Processes, PHI Learning Pvt. Ltd., 2010.
  • [4] Q. Ashton Acton, Heavy Metals - Advances in Research and Application, 2013 Edition, Scholarly Editions, 2013.
  • [5] W.B. Jensen, Onion’s Fusible Alloy, Journal of Chemical Education 87 (2010) 1050-1051.
  • [6] J. Zhou, Y. Sun, F. Xue, Properties of low melting point Sn-Zn-Bi solders, Journal of Alloys and Compounds 397/1-2 (2005) 260-264.
  • [7] Y.-S. Kim, K.-S. Kim, C.-W. Hwang, K. Suganuma, Effect of composition and cooling rate on micro-structure and tensile properties of Sn-Zn-Bi alloys, Journal of Alloys and Compounds 352/1-2 (2003) 237-245.
  • [8] R. Kirk-Othmer, Encyclopedia of Chemical Technology, Bismuth and bismuth alloys, Wiley John and Sons, 2007.
  • [9] J. Stabik, Ł. Wierzbicki, Epoxy resins and low melting point alloy composites, Archives of Materials Science and Engineering 48/1 (2011) 5-11.
  • [10] L. Wang, J. Liu, Liquid phase 3D printing for quickly manufacturing conductive metal objects with low melting point alloy ink, Science China Technological Sciences 57/9 (2014) 1721-1728.
  • [11] S. Mudry, I. Shtablavyi, I. Shcherba, Liquid eutectic alloys as a cluster solutions, Archives of Materials Science and Engineering 34/1 (2008) 14-18.
  • [12] B. Kosec, M. Soković, L. Kosec, M. Bizjak, F. Pusavec, Z. Kampus, Introduction of new ecologically safe material for fusible elements of low voltage fuses, Archives of Materials Science and Engineering 28/4 (2007) 211-216.
  • [13] J. Stabik, Ł. Wierzbicki, Influence of low melting point alloy on strength properties of epoxy resin, Archives of Materials Science and Engineering 60/1 (2013) 13-23.
  • [14] Ł. Wierzbicki, A. Pusz, Thermal conductivity of the epoxy resin filled by low melting point alloy, Archives of Materials Science and Engineering 61/1 (2013) 22-29.
  • [15] M. Trojanowska-Tomczak, R. Stellera, J. Ziaja, G. Szafran, P. Szymczyk, Preparation and Properties of Polymer Composites Filled with Low Melting Metal Alloys, Polymer-Plastics Technology and Engineering 53/5 (2014) 481-487.
  • [16] G. Humpston, D.M. Jacobson, Principles of Soldering, ASM International, 2004.
  • [17] T. Brosh, Y. Gaynor, I. Belov, R. Pilo, Analysis of strength properties of light-cured resin composites, Dental Materials 15/3 (1999) 174-179.
  • [18] C.T. Sun, J. Tsai, Dynamic Compressive Strengths of Polymeric Composites: Testing and Modeling, in: Dynamic Failure of Materials and Structures, Springer, 2010, 107-129.
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-3e19bca3-29e2-487c-a26b-86e6915fcf35
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