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This paper reports on the results of optimization of the ohmic contacts for GaAs/AlGaAs quantum cascade lasers (QCLs). Technological parameters during the optimization procedure concerned time and temperature of thermal processing as also the ratio of metallic layers thickness. The main goal of this work was to obtain stable ohmic contacts with low resistance and a smooth surface. Circular transmission line method (CTLM) was applied for the electrical characterization of the Ni/AuGe/Ni/Au and AuGe/Ni/Au metallization systems. Transmission electron microscopy (TEM) method was used for the characterization of microstructures. Elements concentration in layers was determined by the energy dispersive X-ray spectroscopy (EDXS). The best results for the specific contacts resistivity, thermal stability and morphology were obtained when the Ni/AuGe/Ni/Au and the AuGe/Ni/Au systems were processed at 440 °C and 400 °C, respectively.
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5--15
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Bibliogr. 10 poz., rys., tab.
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autor
- Institute of Electron Technology, al. Lotników 32/46, 02-668 Warszawa, Poland
autor
- Institute of Electron Technology, al. Lotników 32/46, 02-668 Warszawa, Poland
- Institute of Electron Technology, al. Lotników 32/46, 02-668 Warszawa, Poland
autor
- Institute of Electron Technology, al. Lotników 32/46, 02-668 Warszawa, Poland
autor
- Institute of Electron Technology, al. Lotników 32/46, 02-668 Warszawa, Poland
autor
- Institute of Electron Technology, al. Lotników 32/46, 02-668 Warszawa, Poland
autor
- Institute of Electron Technology, al. Lotników 32/46, 02-668 Warszawa, Poland
autor
- Institute of Electron Technology, al. Lotników 32/46, 02-668 Warszawa, Poland
autor
- Silesian University of Technology, Faculty of Automatic Control, Electronics and Computer Science, Institute of Electronics, ul. Akademicka 16, 44-100 Gliwice, Poland
Bibliografia
- [1] SIRTORI C., NAGLE J., Quantum cascade laser: the quantum technology for semiconductor lasers in the mid- far-infrared, Comptes Rendus Physique 4(6), 2003, pp. 639–648.
- [2] KOSIEL K., SZERLING A., BUGAJSKI M., KARBOWNIK P., KUBACKA-TRACZYK J., SANKOWSKA I., PRUSZYŃSKA-KARBOWNIK E., TRAJNEROWICZ A., WÓJCIK-JEDLIŃSKA A., WASIAK M., PIERŚCIŃSKA D., PIERŚCIŃSKI K., SHUBHADA ADHI, OCHALSKI T., HUYET G., Development of (λ ~ 9.4 μm) GaAs-based quantum cascade lasers operating at the room temperature, [In] Terahertz and Mid Infrared Radiation: Generation, Detection and Applications, [Eds.] Pereira M.F., Shulika O., NATO Science for Peace and Security Series B: Physics and Biophysics, Springer, 2011, pp. 91–100.
- [3] ABHILASH T.S, GURUSWAMY RAJARAM, AuGe–Ni–Au Based Ohmic Contacts to GaAs Structures: Magnetic, Electrical and Morphological Characterization, LAP Lambert Academic Publishing, 2011.
- [4] MURAKAMI M., Development of refractory ohmic contact materials for gallium arsenide compound semiconductors, Science and Technology of Advanced Materials 3(1), 2002, pp. 1–27.
- [5] HEIBLUM M., NATHAN M.I., CHANG C.A., Characteristics of AuGeNi ohmic contacts to GaAs, Solid-State Electronics 25(3), 1982, pp. 185–195.
- [6] AINA O., KATZ W., BALIGA B.J., ROSE K., Low-temperature sintered AuGe/GsaAs ohmic contact, Journal of Applied Physics 53(1), 1982, pp. 777–780.
- [7] YIH-CHENG SHIH, MURAKAMI M., WILKIE E.L., CALLEGARI A.C., Effects of interfacial microstructure on uniformity and thermal stability of AuNiGe ohmic contact to n-type GaAs, Journal of Applied Physics 62(2), 1987, pp. 582–590
- [8] VIDIMARI F., Improved ohmic properties of Au–Ge contacts to thin n-GaAs layers alloyed with an SiO2 overlayer, Electronics Letters 15(21), 1979, pp. 674–676.
- [9] HUNG-CHENG LIN, SENANAYAKE S., KEH-YUNG CHENG, MINGHWEI HONG, KWO J.R., BIN YANG, MANNAERTS J.P., Optimization of AuGe–Ni–Au ohmic contacts for GaAs MOSFETs, IEEE Transactions on Electron Devices 50(4), 2003, pp. 880–885.
- [10] REEVES G. K., Specific contact resistance using a circular transmission line model, Solid-State Electronics 23(5), 1980, pp. 487–490.
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Bibliografia
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