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The represented paper is aimed at stress calculation in circuit cards with their representation as a type of mechanical oscillatory systems in purpose of their strength assessment especially in resonance conditions. Three types of oscillatory systems are researched: single-mass; multiple mass and oscillatory system with uniformly distributed mass. In all types the cylindrical bending of circuit cards is considered to be a set of beam-strips with rectangular cross-sections so their stress calculation is performed by conventional methods applied in strength of materials and civil engineering. Mathematical model has been developed for maximal dynamic stress and deflection estimation in circuit card assemblies represented by unique oscillatory system as prismatic beam set on two oscillating supports under inertial resonance excitation generated by constant dynamic force. Comparative analysis of mathematical modeling, MatLab simulation and experimental determination of maximal dynamic stress and deflection accomplished for three types of oscillatory systems verified proximity of obtained results. Single-mass oscillatory system is proposed as equivalent to multiple mass or uniformly distributed oscillatory systems on condition of their equal mass, geometric, elastic and dissipation characteristics in resonance frequency correspondent to the main mode of oscillation, so mathematical model designed for single-mass oscillatory system is recommended for strength and stiffness assessment in engineering calculations where possible difference in determination of stress in equivalent systems can used as safety factor.
Słowa kluczowe
Wydawca
Rocznik
Tom
Strony
303--315
Opis fizyczny
Bibliogr. 15 poz., fig., tab.
Twórcy
autor
- Department of Art and Project Graphics, Khmelnytsky National University, 11 Institutska Str., 29016 Khmelnitsky, Ukraine
autor
- Department of Physics and Electrical Engineering, Khmelnytsky National University, 11 Institutska Str., 29016 Khmelnitsky, Ukraine
autor
- Department of Art and Project Graphics, Khmelnytsky National University, 11 Institutska Str., 29016 Khmelnitsky, Ukraine
Bibliografia
- 1. Jones R.M. Buckling of bars, plates and shells. Bull Ridge Publishing; 2006.
- 2. Hamano T., Ueki Y., Nakasuji T., Fujimoto K. Destruction mechanisms resulting from vibration load in PCB-mounted electronics. In: Proc. of 9th Symposium on Microjoining and Assembly Technology in Electronics, Yokohama, Japan 2003.
- 3. Loon K., Kok C., Mohd E., Ooi C. Modeling the Elastic Behavior of an Industrial Printed Circuit Board Under Bending and Shear. IEEE Transactions on Components, Packaging and Manufacturing Technology. 2019; 9 (1): 669–676.
- 4. Allaparthi M., Khan M., Teja B. Three-dimensional finite element dynamic analysis for micro-drilling of multi-layered printed circuit board. In: Materials Today, Proc. 2018; 5(2): 7019–7028.
- 5. Cevdet N., Withers P., Murray C. Stresses in Microelectronic Circuits. Reference Module in Materials Science and Materials Engineering. 2016; 12(1): 156–168.
- 6. Wong E.H., Mai Y.W. Dynamic deformation of a printed circuit board in drop-shock in robust design of microelectronics assemblies against mechanical shock, temperature and moisture. Woodhead Publishing. 2015; 10: 327–378.
- 7. Kim Y., Lee S.M., Hwang D.S., Seohyun J. Analyses on the large size PBGA packaging reliability under random vibrations for space applications. Microelectronics Reliability. 2020; 109.
- 8. Jouneghani K., Hosseini M., Rohanimanesh M., Dehkordi M. Dynamic behavior of steel frames with tuned mass dampers Advances in Science and Technology. Research Journal. 2017; 11(2): 146–158.
- 9. Veeramuthuvel P., Sairajan K., Shankar K. Vibration suppression of printed circuit boards using an external particle damper. Journal of Sound and Vibration. 2016; 366: 98–116.
- 10. Kovtun I., Boiko J., Petrashchuk S., Kałaczyński T. Theory and practice of vibration analysis in electronic packages. In: 17th International Conference Diagnostics of Machines and Vehicles. MATEC Web Conference. 2018; 182.
- 11. Kovtun I., Boiko J., Petrashchuk S., Baurienė G., Pilkauskas K. Effects of the strain transmission from the main board to the installed electronic components. Mechanika. 2016; 22; 6: 494489.
- 12. Pisarenko G.S., Agarev V.A. Strength of materials. Kiev: Technika; 1967.
- 13. Chudnovsky V., Mukherjee A., Wendlandt J., Kennedy D. Modeling flexible bodies in simmechanics. MatLab Digest. 2006; 14: 3.
- 14. Miller S., Soares T., Weddingen Y. Modeling flexible bodies with simscape multibody software. An Overview of Two Methods for Capturing the Effects of Small Elastic Deformations. MathWorks; 2017.
- 15. Darkov A.V., Shpiro G.S. Strength of materials. Moscow: Higher education; 1989.
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-3c519e4f-4f0d-489c-8c4a-d8ced7dfd054