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Recycling of non-metallic powder from printed circuit board waste as a filler material in a fiber reinforced polymer

Treść / Zawartość
Identyfikatory
Warianty tytułu
Języki publikacji
EN
Abstrakty
EN
Rapid growth in the electricity and electronics industry in Thailand has resulted in numerous problems with electrical waste management. Printed circuit board (PCB) components contain copper in an amount of approximately 10 wt. % and approximately 90 wt. % of non-conductive substrate made from fiberglass resin. In the recycling process, after copper is physically separated from PCB, only nonmetallic powder (NMP) will be left; that needs to be properly disposed of and managed. Therefore, this study is a proposal of suitable choices for NMP management. The results showed that NMP can be disposed in hazardous waste landfill. Furthermore, NMP can be recycled as a component in fiber- -reinforced polymer (FRP) of the following composition: coarse NMP 25%, fine NMP 25%, polyester 38.8%, hardener (Butanox type) 0.6%, catalyst (cobalt type) 0.6%, styrene monomer 10%. This FRP mixed with NMP can be properly processed into an artificial wall tile product in terms of mechanical properties, manufacturing processes and conditions of use.
Rocznik
Strony
151--166
Opis fizyczny
Bibliogr. 27 poz., tab., rys.
Twórcy
  • National Metal and Materials Technology Center, 114 Pathumthani, Thailand
autor
  • National Metal and Materials Technology Center, 114 Pathumthani, Thailand
autor
Bibliografia
  • [1] GOOSEY M., KELLNER R., A Scoping Study End-of-Life Printed Circuit Boards, The Centre for Sustainable Design, UK, 2002.
  • [2] PINYO W., NUSOM Y., SAEHENG P., KANCHANAPIYA P., ANNANON K., The Development of Resource Recovery Process from Industrial Waste, The 4th International Workshop and Conference on Earth Resources Technology, Thailand, 2010.
  • [3] WATSON A., BRIDGEN K., SHINN M., COBBING M., Toxic transformers. A review of the hazards of brominated and chlorinated substances in electrical and electronic equipment, Greenpeace Research Laboratories Technical Note, University of Exeter, UK, 2010.
  • [4] PENG M., DONG X., GUANGHONG D., Products Made from nonmetallic materials reclaimed from waste printed circuit boards, Tsinghua Sci. Technol., 2007, 12 (3), 276.
  • [5] GUO J., RAO Q., XU Z., Application of glass-nonmetals of waste printed circuit boards to produce phenolic moulding compound, J. Hazard. Mater., 2008, 153, 728.
  • [6] JAREEMIT S., KANCHANAPIYA P., SAEHENG P., PINYO W., KWONPONGSAGOON S., The recycling of non- -metallic fraction from printed circuit board waste as reinforcing material in the artificial wall tile, the International Conference on Green and Sustainable Innovation, Thailand, 2012.
  • [7] Thailand Industrial Ministry, The regulation of Industrial Ministry: Waste disposal method, 2005.
  • [8] US EPA, Test methods for evaluating solid waste, physical/chemical methods, SW-846, 1994.
  • [9] US EPA, Method 8270C: Semivolatile organic compounds by gas chromatography/mass spectrometry (GC/MS), 1996.
  • [10] US EPA, Method 3540C: Soxhlet extraction, 1996.
  • [11] The American Society for Testing and Materials, ASTM D638 Standard Test Method for Tensile Properties of Plastics, 2008.
  • [12] The American Society for Testing and Materials, ASTM D790 Standard Test Methods for Flexural Properties of Unreinforced and Reinforced Plastics and Electrical Insulating Materials, 2007.
  • [13] The American Society for Testing and Materials, ASTM D256 Standard Test Methods for Determining the Izod Pendulum Impact Resistance of Plastics, 2006.
  • [14] The American Society for Testing and Materials, ASTM D1525 Standard Test Method for Vicat Soft ening Temperature of Plastics, 2007.
  • [15] The International Organization for Standardization, ISO 10545-8:1994 Ceramic Tiles. Part 8: Determination of Linear Thermal Expansion, 1994.
  • [16] The International Organization for Standardization, ISO 10545-3:1995 Ceramic Tiles. Part 3: Determination of Water Absorption, Apparent Porosity, Apparent Relative Density And Bulk Density, 1995.
  • [17] The International Organization for Standardization, ISO 10545-13:1995 Ceramic Tiles. Part 13: Determination of Chemical Resistance, 1995.
  • [18] Underwriters Laboratories of the USA, UL 94 the Standard for Safety of Flammability of Plastic Materials for Parts in Devices and Appliances Testing, 2013.
  • [19] PRé Consultants, SimaPro LCA software, the Netherlands, 2010.
  • [20] The European Parliament and of the Council, Directive 2011/65/EU: The Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment, 2011.
  • [21] European Chemicals Bureau, Eu Risk Assessment Report: TBBP-A, 2006.
  • [22] The American Society for Testing and Materials, ASTM D 3841-97 Standard Specification for Glass Fiber Reinforced Polyester Plastic Panels, 1997.
  • [23] The American Society for Testing and Materials, ASTM C1185-08 Standard Test Methods for Sampling and Testing Non-Asbestos Fiber-Cement Flat Sheet, Roofing and Siding Shingles, and Clapboards, 2008.
  • [24] The American Society for Testing and Materials, ASTMC 1355/C 1355M-96 Standard Specification for Glass Fiber Reinforced Gypsum Composites, 1996.
  • [25] Thai Industrial Standard, TISI 613-2529 Standard for Glazed Ceramic Tiles for Internal Walls, 1986.
  • [26] The American Society for Testing and Materials, ASTM D570-98(2010)e1 Standard Test Method for Water Absorption of Plastics, 2010.
  • [27] Department of Public Works and Town and Country Planning of Thailand, 8101-51 the Standard for Internal Building Materials, 2008.
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-36681a21-9a3e-44e0-a56f-d2d82372918a
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