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In this study, silicon carbide (SiC) reinforced lead-free solder (SAC305) was prepared by the powder metallurgy method. In this method SAC305 powder and SiC powder were milled, compressed and sintered to prepare composite solder. The composite solders were characterized by optical and scanning electron microscopy for the microstructural investigation and mechanical test. Addition of 1.5 wt.% and 2 wt.% ceramic reinforcement to the composite increased compressive strengths and microhardness up to 38% and 68% compared to those of the monolithic sample. In addition, the ceramic particles caused an up to 55% decrease in the wetting angle between the substrate and the composite solder and porosity was always increased with increase of SiC particles.
Słowa kluczowe
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Czasopismo
Rocznik
Tom
Strony
603--606
Opis fizyczny
Bibliogr. 17 poz., fot., rys., tab.
Twórcy
autor
- University of Miskolc, Faculty of Materials Science and Engineering, Institute of Physical Metallurgy, Metal Forming and Nanotechnology, University of Miskolc, Hungary-3515
autor
- University of Miskolc, Faculty of Materials Science and Engineering, Institute of Physical Metallurgy, Metal Forming and Nanotechnology, University of Miskolc, Hungary-3515
autor
- University of Miskolc, Faculty of Materials Science and Engineering, Institute of Physical Metallurgy, Metal Forming and Nanotechnology, University of Miskolc, Hungary-3515
autor
- University of Miskolc, Faculty of Materials Science and Engineering, Institute of Physical Metallurgy, Metal Forming and Nanotechnology, University of Miskolc, Hungary-3515
Bibliografia
- [1] L. C. Tsao, R. W. Wu, T. H. Cheng, K. H. Fan, R. S. Chen, Mater. Des. 50, 774-781, (2013).
- [2] D. Q. Yu, J. Zhao, L. Wang, J. Alloys Compd. 376 (1-2), 170-175, (2004).
- [3] X. Wang, Y. C. Liu, C. Wei, H. X. Gao, P. Jiang, L. M. Yu, J. Alloys Compd. 480 (2), 662-665, (2009).
- [4] P. Liu, P. Yao, J. Liu, J. Electron. Mater. 37 (6), 874-879, (2008).
- [5] A. A. El-Daly, A. Fawzy, S. F. Mansour, M. J. Younis, J. Mater. Sci. Mater. Electron. 24 (8), 2976-2988, (2013).
- [6] A. A. El-Daly, A. Fawzy, S. F. Mansour, M. J. Younis, Mater. Sci. Eng. A578, 62-71, (2013).
- [7] A. A. El-Daly, W. M. Desoky, T. A. Elmosalami, M. G. El-Shaarawy, A. M. Abdraboh, Mater. Des. 65, 1196-1204, (2015).
- [8] K. Xu, G. Chen, F. Wu, W. Xia, H. Liu, 15th International conference on electronics packaging technology, IEEE (2014).
- [9] L. Gao et al., Microelectron. Eng. 87 (11), 2025-2034, (2010).
- [10] P. M. Kumar, G. Gergely, D. K. Horváth, Z. Gácsi, Powder Metallurgy Progress 18 (1), 49-57, (2018).
- [11] Z. Fathian, A. Maleki, B. Niroumand, Ceram. Int. 43 (6), 5302-5310, (2017).
- [12] M. Z. Yahaya, F. C. Ani, Z. Samsudin, S. Sahin, M. Z. Abdullah, A. A. Mohamad, Mater. Sci. Eng. A669, 178-186, (2016).
- [13] S. Chellvarajoo, M. Z. Abdullah, Z. Samsudin, Mater. Des. 67, 197-208, (2015).
- [14] S. M.L. Nai, J. Wei, M. Gupta, Thin Solid Films 504 (1-2), 401-404, (2006).
- [15] O. Mokhtari et al., J. Electron. Mater. 41 (7), 1907-1914, (2012).
- [16] A. A. El-Daly, G. S. Al-Ganainy, A. Fawzy, M. J. Younis, Mater. Des. 55, 837-845, (2014).
- [17] X. L. Zhong, M. Gupta, J. Phys. D. Appl. Phys. 41 (9), 1-7, (2008).
Uwagi
EN
1. The described article was carried out as part of the GINOP-2.3.2-15-2016-00027 "Sustainable operation of the workshop of excellence for the research and development of crystalline and amorphous nanostructured materials” project implemented in the framework of the Szechenyi 2020 program. The realization of this project is supported by the European Union.
PL
2. Opracowanie rekordu w ramach umowy 509/P-DUN/2018 ze środków MNiSW przeznaczonych na działalność upowszechniającą naukę (2019).
Typ dokumentu
Bibliografia
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bwmeta1.element.baztech-3511bb49-d312-4c1e-b92b-484859399e1e