A Short Review on the Influence of Antimony Addition to the Microstructure and Thermal Properties of Lead-Free Solder Alloy

• Autorzy: Zaimi Nur Syahirah Mohamad , Salleh Mohd Arif Anuar Mohd , Abdullah Mohd Mustafa Al Bakri , Ramli Mohd Izrul Izwan

Identyfikatory

DOI

10.24425/amm.2023.145463

• Języki publikacji: EN

Abstrakty

EN

For long time, Sn-Pb solder alloys have been used extensively as the main interconnection materials in the soldering. It is no doubt that Sn-Pb offers many advantages including good electrical conductivity, mechanical properties as well as low melting temperature. However, Pb is very toxic and Pb usage poses risk to human health and environments. Owing to this, the usage of Pb in the electronic industry was banned and restricted by the legislation. These factors accelerate the efforts in finding suitable replacement for solder alloy and thus lead-free solder was introduced. The major problems associated with lead-free solder is the formation of large and brittle intermetallic compound which have given a rise to the reliability issues. Micro alloying with Sb seems to be advantageous in improving the properties of existing lead-free solder alloy. Thus, this paper reviews the influence of Sb addition to the lead-free solder alloy in terms of microstructure formations and thermal properties.

Słowa kluczowe

EN

lead-free solder; antimony; microstructure; melting temperature

• Wydawca: Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences
• Czasopismo: Archives of Metallurgy and Materials
• Rocznik: 2023
• Tom: Vol. 68, iss. 3
• Strony: 981--986
• Opis fizyczny: Bibliogr. 20 poz., fot., rys., tab.

Twórcy

autor

Zaimi Nur Syahirah Mohamad

• Center of Excellence Geopolymer & Green Technology (CeGeoGTech), Faculty of Chemical Engineering Technology, Universiti Malaysia Perlis (UniMAP), Taman Muhibbah, 02600 Jejawi, Arau, Perlis, Malaysia

autor

Salleh Mohd Arif Anuar Mohd

• Center of Excellence Geopolymer & Green Technology (CeGeoGTech), Faculty of Chemical Engineering Technology, Universiti Malaysia Perlis (UniMAP), Taman Muhibbah, 02600 Jejawi, Arau, Perlis, Malaysia

• https://orcid.org/0000-0002-9523-7558

autor

Abdullah Mohd Mustafa Al Bakri

• Center of Excellence Geopolymer & Green Technology (CeGeoGTech), Faculty of Chemical Engineering Technology, Universiti Malaysia Perlis (UniMAP), Taman Muhibbah, 02600 Jejawi, Arau, Perlis, Malaysia

• https://orcid.org/0000-0002-9779-8586

autor

Ramli Mohd Izrul Izwan

• Center of Excellence Geopolymer & Green Technology (CeGeoGTech), Faculty of Chemical Engineering Technology, Universiti Malaysia Perlis (UniMAP), Taman Muhibbah, 02600 Jejawi, Arau, Perlis, Malaysia

Bibliografia

• [1] R. Mahmudi, S. Mahin-Shirazi, Effect of Sb addition on the tensile deformation behavior of lead-free Sn-3.5Ag solder alloy, Mater. Des. 32, 10, 5027-5032 (2011). DOI: https://doi.org/10.1016/j.matdes.2011.05.052
• [2] G. Zeng, S. Xue, L. Zhang, L. Gao, Recent advances on Sn-Cu solders with alloying elements: review, J. Mater. Sci. Mater. Electron. 22, 6, 565-578 (2011). DOI: https://doi.org/10.1007/s10854-011-0291-3
• [3] X. Niu, K.-L. Lin, The microstructure and mechanical properties of Zn-25Sn-XAl (X=0-0.09wt%) high temperature lead free solder, Mater. Sci. Eng. A, 677, Supplement C, 384-392 (2016). DOI: https://doi.org/10.1016/j.msea.2016.09.061
• [4] M. lan Li, L. Zhang, N. Jiang, L. Zhang, S. Juan Zhong, Materials modification of the lead-free solders incorporated with micro/nano-sized particles: A review, Mater. Des. 197, 109224 (2021). DOI: https://doi.org/10.1016/j.matdes.2020.109224.
• [5] Y. Li, W. Lin, X. Li, H. Ouyang, Effects of Zn contents on microstructure, thermodynamic characteristic and mechanical properties of Sn-Bi-based lead-free solder, J. Mater. Sci. Mater. Electron. 33, 4, 1741-1751 (2022). DOI: https://doi.org/10.1007/s10854-021-07153-1
• [6] D. Le Han, Y.-A. Shen, F. Huo, H. Nishikawa, Microstructure Evolution and Shear Strength of Tin-Indium-xCu/Cu Joints, 12, 1, 33 (2022). [Online]. Available: https://www.mdpi.com/2075-4701/12/1/33
• [7] P. Sivakumar, K. O’Donnell, J. Cho, Effects of bismuth and nickel on the microstructure evolution of Sn-Ag-Cu (SAC)-based solders, Mater. Today Commun. 26, 101787 (2021). DOI: https://doi.org/10.1016/j.mtcomm.2020.101787
• [8] S. Chantaramanee, P. Sungkhaphaitoon, Investigation of microstructure, thermal properties, and mechanical performances of Ni-added Sn-5.0Sb-0.5Cu/Cu solder joints, Microelectron. Reliab. 127, September, 114421 (2021). DOI: https://doi.org/10.1016/j.microrel.2021.114421
• [9] Q. Xu, X. Ding, C. Chen, J. Zhou, F. Xue, Q. Chen, Role of erbium in microstructure and mechanical properties of Sn58Bi42 solder alloy, Mater. Lett. 305, August, 130745 (2021). DOI: https://doi.org/10.1016/j.matlet.2021.130745
• [10] P.D. Sonawane, V.K. Bupesh Raja, K. Palanikumar, E. Ananda Kumar, N. Aditya, V. Rohit, Effects of gallium, phosphorus and nickel addition in lead-free solders: A review, Mater. Today Proc. 46, 3578-3581 (2020). DOI: https://doi.org/10.1016/j.matpr.2021.01.335
• [11] S. Chantaramee, P. Sungkhapaitoon, Influence of bismuth on microstructure, thermal properties, mechanical performance, and interfacial behavior of SAC305-xBi/Cu solder joints, Trans. Nonferrous Met. Soc. China (English Ed.) 31, 5, 1397-1410 (2021). DOI: https://doi.org/10.1016/S1003-6326(21)65585-1
• [12] A. Miric, New Developments in High-Temperature, High-Performance Lead-Free Solder Alloys, 2010.
• [13] A.A. El-Daly, A.E. Hammad, A. Fawzy, D.A. Nasrallh, Microstructure, mechanical properties, and deformation behavior of Sn-1.0Ag-0.5Cu solder after Ni and Sb additions, Mater. Des. 43, 40-49 (2013). DOI: https://doi.org/10.1016/j.matdes.2012.06.058
• [14] A. Morozumi, H. Hokazono, Y. Nishimura, E. Mochizuki, Y. Takahashi, Influence of Antimony on Reliability of Solder Joints Using Sn-Sb Binary Alloy for Power Semiconductor Modules, Trans. Japan Inst. Electron. Packag. 8, 1, 8-17 (2015). DOI: https://doi.org/10.5104/jiepeng.8.8
• [15] D. Zhou, A.S.M.A. Haseeb, A. Andriyana, Mechanical Performance of Advanced Multicomponent Lead-Free Solder Alloy Under Thermal Aging, SSRN Electron. J. 33, September, 104430 (2022). DOI: https://doi.org/10.2139/ssrn.4167493
• [16] P. Sungkhaphaitoon, T. Plookphol, The Effects of Antimony Addition on the Microstructural, Mechanical, and Thermal Properties of Sn-3.0Ag-0.5Cu Solder Alloy, Metall. Mater. Trans. A 49, 2, 652-660 (2018). DOI: https://doi.org/10.1007/s11661-017-4439-5
• [17] A.B. El Basaty, A.M. Deghady, E.A. Eid, Influence of small addition of antimony (Sb) on thermal behavior, microstructural and tensile properties of Sn-9.0Zn-0.5Al Pb-free solder alloy, Mater. Sci. Eng. A 701, Supplement C, 245-253 (2017). DOI: https://doi.org/10.1016/j.msea.2017.06.092
• [18] H.-T. Lee, S.-Y. Hu, T.-F. Hong, Y.-F. Chen, The Shear Strength and Fracture Behavior of Sn-Ag-xSb Solder Joints with Au/Ni-P/Cu UBM, J. Electron. Mater. 37, 6, 867-873 (2008). DOI: https://doi.org/10.1007/s11664-008-0396-5
• [19] H.-T. Lee, M.-H. Chen, H.-M. Jao, C.-J. Hsu, Effect of adding Sb on microstructure and adhesive strength of Sn-Ag solder joints, J. Electron. Mater. 33, 9, 1048-1054 (2004). DOI: https://doi.org/10.1007/s11664-004-0034-9
• [20] C. Li, Y. Yan, T. Gao, G. Xu, The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-xSb High-Temperature Lead-Free Solder, Mater. (Basel, Switzerland), 13, (2020). DOI: https://doi.org/10.3390/ma13194443.

Uwagi

The authors gratefully acknowledged the funding entitle the neutron tomography studies of the geopolymer ceramic used for reinforcement materials in a solder alloy for a robust electric/electronic solder joint under reference no: JPT.S (BPKI)2000/016/018/019(29) from the Ministry of Higher Education Malaysia regarding the use of the ISIS Neutron and Muon Source.