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Whisker Formation On Galvanic Tin Surface Layer

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Warianty tytułu
PL
Tworzenie whiskerów na powierzchniowej warstwie cyny wytworzonej galwanicznie
Języki publikacji
EN
Abstrakty
EN
The present work reports the effect of substrate composition, thickness of the tin electroplate and its morphology on pressure-induced tin whisker formation. Pure tin deposits of different thickness were obtained on a copper and brass substrates using methane sulfonic industrial bath. The deposits were compressed by a steel bearing ball forming imprint on the surface. The microstructure of tin whiskers obtained at the boundary of each imprint, their length and number were studied using both light and scanning electron microscopy. It was shown that the most intensive formation and growth of whiskers was observed in the first two hours. In general, brass substrate was shown to be more prone to whisker formation than copper independently of the tin coating thickness. The results have been compared with industrial bright tin finish on control unit socket leads and proposals have been made as to modification of the production process in order to minimize the risk of whiskering.
Twórcy
  • Institute of Physical Metallurgy, Metal Forming and Nanotechnology, University of Miskolc, Miskolc, Hungary
autor
  • MTA-ME Materials Science Research Group, Hungarian Academy of Sciences, Miskolc, Hungary
autor
  • Institute of Physical Metallurgy, Metal Forming and Nanotechnology, University of Miskolc, Miskolc, Hungary
Bibliografia
  • [1] E. R. Crandall, Factors Governing Tin Whisker Growth, Switzerland 2013.
  • [2] A. Vicenzo, Tin Whiskers, in: G. Grossmann, C. Zardini (Ed.), The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects, Springer-Verlag (2011).
  • [3] G. T. Galyon, A History of Tin Whisker Theory: 1946 to 2004, in: STMA International Conference, Chicago (2004).
  • [4] http://www.calce.umd.edu/tin-whiskers/TINWHISKERFAILURES.pdf.
  • [5] S. M. Miller, U. Sahaym, G. Norton, Metall. Mater. Trans. A 41A, 3386 (2010).
  • [6] B. Jiang, A.-P. Xian, Microelectron. Reliab. 48, 105. (2008).
  • [7] Ch.-F. Yu, Ch.-M. Chan, K.-Ch. Hsieh, Microelectron. Reliab. 50, 1146 (2010).
  • [8] R. F. Champaign, R. R. Ogden, J. Fail. Anal. Prev. 10, 444 (2010).
  • [9] T. Shibutani, Q. Yu, M. Shiratori, M.G. Pecht, Microelectron. Reliab. 48, 1033 (2008).
  • [10] A. Czerwinski, A. Skwarek, M. Plushka, J. Ratajczak, K. Witek, Arch. Metall. Mater. 58, 415 (2013).
  • [11] E. Chason, N. Jadhav, F. Pei, E. Buchovecky, A. Bower, Prog. Surf. Sci. 88, 103 (2013).
  • [12] B.-Z. Lee, D. N. Lee, Acta Mater. 46, 3701 (1998).
  • [13] B. Horváth, B. Illés, T. Shinohara, G. Harsányi, Thin Solid Films 520, 384 (2011).
  • [14] E. Chason, N. Jadhav, F. Pei, JOM 63, 62 (2011).
  • [15] D. Koncz-Horváth, Z. Gácsi, Mater. Sci. Forum 752, 37 (2013).
  • [16] A. Sycheva, A. Radanyi, Z. Gacsi, Mater. Sci. Forum 790-791, 271 (2014).
  • [17] B. Horváth, B. Illés, T. Shinohara, G. Harsányi, Thin Solid Films 520, 5733 (2012).
  • [18] T. Fang, M. Osterman, M. Pecht, Microelectron. Reliab. 46, 846 (2006).
Uwagi
PL
Opracowanie ze środków MNiSW w ramach umowy 812/P-DUN/2016 na działalność upowszechniającą naukę.
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-31b7041d-2d3f-4bea-a47f-349f2a619711
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