Analytical modeling of ground surface topography in monocrystalline silicon grinding considering the ductile-regime effect

• Autorzy: Li H. N. , Yu T. B. , Zhu L. D. , Wang W. S.

Identyfikatory

DOI

10.1016/j.acme.2017.03.010

• Języki publikacji: EN

Abstrakty

EN

Grinding process of monocrystalline silicon easily leads to fractured surfaces, therefore an analytical model of the ground silicon surface is presented. In the model, the ductile-regime effect is considered by determining grain-workpiece interaction mode (ductile and brittle modes) at each grinding moment. Validation experiments proved that the model can, to a large extent, describe realistic silicon grinding and predict the machined surfaces in terms of (i) brittle and ductile area, (ii) roughness and waviness, and (iii) potential chipping zone sizes. The model therefore is anticipated to be not only meaningful to guide and optimize the industrial silicon grinding process, but also transferable to other kinds of brittle materials.

Słowa kluczowe

EN

silicon; surface topography; grinding; analytical model

PL

krzem; topografia powierzchni; szlifowanie; model analityczny

• Wydawca: Springer ; Wrocław University of Science and Technology
• Czasopismo: Archives of Civil and Mechanical Engineering
• Rocznik: 2017
• Tom: Vol. 17, no. 4
• Strony: 880--893
• Opis fizyczny: Bibliogr. 22 poz., rys., tab., wykr.

Twórcy

autor

Li H. N.

• School of Mechanical Engineering and Automation, Northeastern University, Shenyang post code: 110819, PR China

autor

Yu T. B.

• School of Mechanical Engineering and Automation, Northeastern University, Shenyang post code: 110819, PR China

autor

Zhu L. D.

• School of Mechanical Engineering and Automation, Northeastern University, Shenyang post code: 110819, PR China

autor

Wang W. S.

• School of Mechanical Engineering and Automation, Northeastern University, Shenyang post code: 110819, PR China

Bibliografia

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Uwagi

PL

Opracowanie ze środków MNiSW w ramach umowy 812/P-DUN/2016 na działalność upowszechniającą naukę (zadania 2017)