Transient Liquid Phase Behavior of Sn-Coated Cu Particles and Chip Bonding using Paste Containing the Particles

• Autorzy: Hwang J. H. , Lee J.-H.

Identyfikatory

DOI

10.1515/amm-2017-0167

• Języki publikacji: EN

Abstrakty

EN

Sn-coated Cu particles were prepared as a filler material for transient liquid phase (TLP) bonding. The thickness of Sn coating was controlled by controlling the number of plating cycles. The Sn-coated Cu particles best suited for TLP bonding were fabricated by Sn plating thrice, and the particles showed a pronounced endothermic peak at 232°C. The heating of the particles for just 10 s at 250°C destroyed the initial core-shell structure and encouraged the formation of Cu-Sn intermetallic compounds. Further, die bonding was also successfully performed at 250°C under a slight bonding pressure of around 0.1 MPa using a paste containing the particles. The bonding time of 30 s facilitated the bonding of Sn-coated Cu particles to the Au surface and also increased the probability of network formation between particles.

Słowa kluczowe

EN

Sn-coated Cu; immersion plating; chip bonding; intermetallic compounds (IMC); transient liquid phase (TLP); sintering

• Wydawca: Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences
• Czasopismo: Archives of Metallurgy and Materials
• Rocznik: 2017
• Tom: Vol. 62, iss. 2B
• Strony: 1143--1148
• Opis fizyczny: Bibliogr. 8 poz., rys.

Twórcy

autor

Hwang J. H.

• Department of Materials Science & Engineering, Seoul National University of Science & Technology, Seoul 139-743, Korea (Republic of)

autor

Lee J.-H.

• Department of Materials Science & Engineering, Seoul National University of Science & Technology, Seoul 139-743, Korea (Republic of)

Bibliografia

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• [5] J.F. Li, P.A. Agyakwa, C.M. Johnson, Acta Mater. 59, 1198 (2011).
• [6] M.S. Park, S.L. Gibbons, R. Arróyave, Acta Mater. 60, 6278 (2012).
• [7] W. Gierlotka, S.W. Chen, S.K. Lin, J. Mater. Res. 22, 3158 (2007).
• [8] H. Flandorfer, U. Saeed, C. Luef, A. Sabbar, H. Ipser, Thermochim. Acta 459, 34 (2007).

Uwagi

PL

Opracowanie ze środków MNiSW w ramach umowy 812/P-DUN/2016 na działalność upowszechniającą naukę (zadania 2017)