Application of the ASTM D5470 standard test method for thermal conductivity measurements of high thermal conductive materials

• Autorzy: Buliński Z. , Pawlak S. , Krysiński T. , Adamczyk W. , Białecki R.

Identyfikatory

DOI

10.5604/01.3001.0013.7915

• Języki publikacji: EN

Abstrakty

EN

Purpose: The purpose of the present study was to demonstrate the procedure for determining the thermal conductivity of a solid material with relatively high thermal conductivity, using an original self-designed apparatus. Design/methodology/approach: The thermal conductivity measurements have been performed according to the ASTM D5470 standard. The thermal conductivity was calculated from the recorded temperature values in steady-state heat transfer conditions and determined heat flux. Findings: It has been found from the obtained experimental results that the applied standard test method, which was initially introduced for thermal conductivity measurements of thermal interface materials (TIMs), is also suitable for materials with high thermal conductivity, giving reliable results. Research limitations/implications: The ASTM D5470 standard test method for measurement of thermal conductivity usually gives poor results for high conductive materials having thermal conductivity above 100 W/mK, due to problems with measuring heat flux and temperature drop across the investigated sample with reasonably high accuracy. Practical implications: The results obtained for the tested material show that the presented standard test method can also be used for materials with high thermal conductivity, which is of importance either for the industrial or laboratory applications. Originality/value: The thermal conductivity measurements have been carried out using an original self-designed apparatus, which was developed for testing broad range of engineering materials with high accuracy.

Słowa kluczowe

EN

thermal conductivity; thermal resistance; steady-state heat transfer; ASTM D5470 standard

PL

przewodność cieplna; opór cieplny; ustalony przepływ ciepła

• Wydawca: International OCSCO World Press
• Czasopismo: Journal of Achievements in Materials and Manufacturing Engineering
• Rocznik: 2019
• Tom: Vol. 95, nr 2
• Strony: 57--63
• Opis fizyczny: Bibliogr. 6 poz., rys., tab., wykr.

Twórcy

autor

Buliński Z.

• Department of Thermal Engineering, Faculty of Power and Environmental Engineering, Silesian University of Technology, ul. Konarskiego 22, 44-100 Gliwice, Poland

autor

Pawlak S.

• Department of Thermal Engineering, Faculty of Power and Environmental Engineering, Silesian University of Technology, ul. Konarskiego 22, 44-100 Gliwice, Poland

autor

Krysiński T.

• Department of Thermal Engineering, Faculty of Power and Environmental Engineering, Silesian University of Technology, ul. Konarskiego 22, 44-100 Gliwice, Poland

autor

Adamczyk W.

• Department of Thermal Engineering, Faculty of Power and Environmental Engineering, Silesian University of Technology, ul. Konarskiego 22, 44-100 Gliwice, Poland

autor

Białecki R.

• Department of Thermal Engineering, Faculty of Power and Environmental Engineering, Silesian University of Technology, ul. Konarskiego 22, 44-100 Gliwice, Poland

Bibliografia

• [1] ASTM D5470-06, Standard Test Method for Thermal Transmission Properties of Thin Thermally Conductive Solid Electrical Insulation Materials, ASTM International, 2006, DOI: 10.1520/D5470-06.
• [2] C. Liu, Y. He, C. Chen, M. Chen, W. Yu, Synergistic enhancement of heat transfer between irregular shaped particles and boron nitride flakes at low loading, Results in Physics 15 (2019) 102599, DOI: 10.1016/j.rinp.2019.102599.
• [3] J.R. Culham, P. Teertstra, I. Savija, M.M. Yovanovich, Design, assembly and commissioning of a test apparatus for characterizing thermal interface materials, Proceedings of the 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems “ITherm2002”, San Diego, 2002, 128-135, DOI: 10.1109/ITHERM.2002.1012448.
• [4] R. Kempers, P. Kolodner, A. Lyons, A.J. Robinson, A high-precision apparatus for the characterization of thermal interface materials, Review of Scientific Instruments 80/9 (2009) 095111, DOI: 10.1063/1.3193715.
• [5] Z. Buliński, S. Pawlak, R. Białecki, W. Adamczyk, T. Krysiński, Determination of the thermal conductivity of solids based on the ASTM D 5470 standard, Steel, Metals & New Technologies 3-4 (2019) 57-62 (in Polish).
• [6] E. Cuce, P.M. Cuce, T. Guclu, A. Besir, E. Gokce, U. Serencam, A novel method based on thermal conductivity for material identification in scrap industry: An experimental validation, Measurement 127 (2018) 379-389, DOI: 10.1016/j.measurement.2018.06.014.