Microstructure refinement mechanism of undercooled Cu55Ni45 alloys

• Autorzy: Wang Hongfu , Tang Cheng , An Hongen , Zhao Yuhong

Identyfikatory

DOI

10.2478/msp-2021-0027

• Języki publikacji: EN

Abstrakty

EN

Different undercooling degrees of Cu₅₅Ni₄₅ alloy were obtained by the combination of molten glass purification and cyclic superheating, and the maximum undercooling degree reached 284 K. The microstructure of the alloy was observed by metallographic microscope, and the evolution of microstructure was studied systematically. There are two occasions of grain refinement in the solidification structure of the alloy: one occurs in the case of low undercooling, and the other occurs in the case of high undercooling. Electron backscatter diffraction (EBSD) technology was used to analyze the rapid solidification structure under high undercooling. The features of flat polygonal grain boundary, high proportion of twin boundary, and large proportion of large angle grain boundary indicate recrystallization. The change in microhardness of the alloy under different undercooling degrees was studied by microhardness tester. It was found that the average microhardness decreased sharply at high undercooling degrees, which further confirmed the recrystallization of the solidified structure at high undercooling degrees.

Słowa kluczowe

EN

solidification structure; rapid solidification; grain refinement; recrystallization

• Wydawca: De Gruyter
• Czasopismo: Materials Science Poland
• Rocznik: 2021
• Tom: Vol. 39, No. 3
• Strony: 319--330
• Opis fizyczny: Bibliogr. 28 poz., rys.

Twórcy

autor

Wang Hongfu

• School of Mechanical Engineering, North University of China, Taiyuan, Shanxi 030051, China

autor

Tang Cheng

• School of Mechanical Engineering, North University of China, Taiyuan, Shanxi 030051, China

autor

An Hongen

• Faculty of Engineering, University Malaysia Sabah, Kota Kinabalu 88400, Malaysia

autor

Zhao Yuhong

• College of Materials Science and Engineering, North University of China, Taiyuan, Shanxi 030051, China

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