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This paper analyses the technological aspects of the interface formation in the copper-silicon carbide composite and its effect on the material’s microstructure and properties. Cu-SiC composites with two different volume content of ceramic reinforcement were fabricated by hot pressing (HP) and spark plasma sintering (SPS) technique. In order to protect SiC surface from its decomposition, the powder was coated with a thin tungsten layer using plasma vapour deposition (PVD) method. Microstructural analyses provided by scanning electron microscopy revealed the significant differences at metal-ceramic interface. Adhesion force and fracture strength of the interface between SiC particles and copper matrix were measured. Thermal conductivity of composites was determined using laser flash method. The obtained results are discussed with reference to changes in the area of metal-ceramic boundary.
Słowa kluczowe
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Czasopismo
Rocznik
Tom
Strony
1315--1318
Opis fizyczny
Bibliogr. 12 poz., rys., tab.
Twórcy
autor
- Institute of Electronic Materials Technology, 133 Wólczyńska Str, 01-919 Warsaw, Poland
autor
- Institute of Electronic Materials Technology, 133 Wólczyńska Str, 01-919 Warsaw, Poland
autor
- Institute of Electronic Materials Technology, 133 Wólczyńska Str, 01-919 Warsaw, Poland
autor
- Institute of Fundamental Technological Research Polish Academy of Sciences, 5b Pawinskiego, 02-106 Warsaw, Poland
autor
- Institute of Fundamental Technological Research Polish Academy of Sciences, 5b Pawinskiego, 02-106 Warsaw, Poland
Bibliografia
- [1] A.M. Abyzov, M.J. Kruszewski, Ł.Ciupiński, M. Mazurkiewicz, A. Michalski, K.J. Kurzydłowski, Mater. Design 76, 97-109 (2015).
- [2] A. Strojny-Nedza, K. Pietrzak, Arch. Metall. Mater. 59 (4), 1301-1306 (2014).
- [3] K.M. Lee, D.K. Oh, W.S. Choi, T. Weissgarber, B. Kieback, J. Alloy. Compd. 434-435, 375-377 (2007).
- [4] K. Hyun-Ki , K. Suk Bong, Mater. Sci. Eng. A 428, 336-345 (2006).
- [5] M.W. Finnis, J. Phys. Condensed Matter. 8, 5811-5836 (1996).
- [6] J. Zimmerman, Z. Lindemann, D. Golański, T. Chmielewski, W. Włosiński, Bull. Pol. Acad. Sci-Te 61 (2), 515-525 (2013).
- [7] D.M. Jarząbek, M. Chmielewski, T. Wojciechowski, Compos. Part A-Appl. S. 76, 124-130 (2015).
- [8] P. Nieroda, R. Zybala, K.T. Wojciechowski, AIP Conf. Proc. 1449, 199-202 (2012).
- [9] K. Suganuma, K. Nogi, J. Jpn. I Met. 59, 1292-1298 (1995).
- [10] H.K. Kang, S.B. Kang, Mat Sci Eng A-Struct 428, 336-345 (2006).
- [11] R.R. Chromik, W.K. Neils, E.J. Cotts, J Appl Phys, 86 (8), 4273-4281 (1999).
- [12] C.D. Qin, B. Derby, Brit Ceram Trans J. 90 (4), 124-125 (1991).
Uwagi
PL
Opracowanie ze środków MNiSW w ramach umowy 812/P-DUN/2016 na działalność upowszechniającą naukę (zadania 2017)
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-2b05ba04-747d-4baa-b51d-b495f24a842d