Analysis Of Factors Affecting Gravity-Induced Deflection For Large And Thin Wafers In Flatness Measurement Using Three-Point-Support Method

• Autorzy: Liu H. , Dong Z. , Kang R. , Zhou P. , Gao S.

Identyfikatory

DOI

10.1515/mms-2015-0052

• Języki publikacji: EN

Abstrakty

EN

Accurate flatness measurement of silicon wafers is affected greatly by the gravity-induced deflection (GID) of the wafers, especially for large and thin wafers. The three-point-support method is a preferred method for the measurement, in which the GID uniquely determined by the positions of the supports could be calculated and subtracted. The accurate calculation of GID is affected by the initial stress of the wafer and the positioning errors of the supports. In this paper, a finite element model (FEM) including the effect of initial stress was developed to calculate GID. The influence of the initial stress of the wafer on GID calculation was investigated and verified by experiment. A systematic study of the effects of positioning errors of the support ball and the wafer on GID calculation was conducted. The results showed that the effect of the initial stress could not be neglected for ground wafers. The wafer positioning error and the circumferential error of the support were the most influential factors while the effect of the vertical positioning error was negligible in GID calculation.

Słowa kluczowe

EN

flatness measurement; large and thin silicon wafer; GID; three-point-support method; initial stress

• Wydawca: Komitet Metrologii i Aparatury Naukowej PAN
• Czasopismo: Metrology and Measurement Systems
• Rocznik: 2015
• Tom: Vol. 22, nr 4
• Strony: 531--546
• Opis fizyczny: Bibliogr. 26 poz., rys., wykr.

Twórcy

autor

Liu H.

• Dalian University of Technology, Key Laboratory for Precision and Non-Traditional Machining of Ministry of Education, 2 Linggong Road, Dalian 116024, P.R. China

autor

Dong Z.

• Dalian University of Technology, Key Laboratory for Precision and Non-Traditional Machining of Ministry of Education, 2 Linggong Road, Dalian 116024, P.R. China

autor

Kang R.

• Dalian University of Technology, Key Laboratory for Precision and Non-Traditional Machining of Ministry of Education, 2 Linggong Road, Dalian 116024, P.R. China

autor

Zhou P.

• Dalian University of Technology, Key Laboratory for Precision and Non-Traditional Machining of Ministry of Education, 2 Linggong Road, Dalian 116024, P.R. China

autor

Gao S.

• Dalian University of Technology, Key Laboratory for Precision and Non-Traditional Machining of Ministry of Education, 2 Linggong Road, Dalian 116024, P.R. China

Bibliografia

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Uwagi

EN

The authors would like to acknowledge the financial support from the National Natural Science Foundation of China (91323302), Science Fund for Creative Research Groups of NSFC (51321004), the State Key Development Program for Basic Research of China (2011CB013201), the National High Technology Research and Development Program of China (2013AA040104) and National Science and Technology Major Project of China (2014ZX02504001). We are very grateful for the discussion with Professor Bi Zhang.