Effects of Formaldehyde Scavenger on Mechanical, Physical, and Emission Test Results in Multi-Layer Pressed Chipboard Production

• Autorzy: Çamlibel Osman , Peker Hüseyin , Ayata Ümit , Ulay Göksel

Identyfikatory

DOI

10.53502/wood-201948

• Języki publikacji: EN

Abstrakty

EN

This study investigates the effects of different formaldehyde scavenger (FS) ratios on the physical, mechanical, and chemical properties of fiberboard composites. Experimental analyses included measurements of thickness, density, modulus of rupture (MOR), modulus of elasticity (MOE), internal bond strength (IB), shear strength (SS), moisture content, thickness swelling (TS), water absorption (WA), and formaldehyde emission (FE) levels. The results indicate that an increase in the FS ratio leads to a significant decline in mechanical properties. Specifically, MOR, MOE, and IB values decreased by 17.97%, 15.65%, and 16.33%, respectively. Changes in TS and WA were also observed, with TS increasing by up to 22.68% and WA decreasing by as much as 16.90%. In terms of formaldehyde emissions, a significant reduction was observed as the FS ratio increased. At a 15% FS ratio, formaldehyde emissions decreased by 43.24%, which is considered a positive outcome in terms of environmental and health impacts. Overall, the use of FS in specific ratios reduces FE while causing certain reductions in mechanical properties. These findings highlight the importance of optimizing FS usage for the production of low-FE fiberboards.

Słowa kluczowe

EN

particleboard; wood-based panels; formaldehyde scavenger; formaldehyde emissions; modulus of elasticity; bending strength; internal bond strength

• Wydawca: Sieć Badawcza Łukasiewicz - Poznański Instytut Technologiczny
• Czasopismo: Drewno : prace naukowe, doniesienia, komunikaty
• Rocznik: 2025
• Tom: Vol. 68, nr 215
• Strony: Art. no. 201948
• Opis fizyczny: Bibliogr. 45 poz., rys., wykr.

Twórcy

autor

Çamlibel Osman

• Kırıkkale University, Department of Interior Design, Kırıkkale Vocational School, Kırıkkale, Turkey

• https://orcid.org/0000-0002-8766-1316

autor

Peker Hüseyin

• Department of Forest Industrial Engineering, Department of Forest Industrial Engineering, ArtvinÇoruh University, Artvin, Turkey

• https://orcid.org/0000-0002-7771-6993

autor

Ayata Ümit

• Department of Interior Architecture and Environmental Design, Bayburt University, Bayburt, Turkey

• https://orcid.org/0000-0002-6787-7822

autor

Ulay Göksel

• Department of Furniture and Decoration, Van YuzuncuYil University, Van Vocational School, Van, Turkey

• https://orcid.org/0000-0003-4080-8816

Bibliografia

• Antov P., Savov V., Neykov N. [2020]: Reduction of formaldehydeemission from engineered wood panels by formaldehydescavengers—A review. In Proceedings of the 13thInternational Scientific Conference Wood EMA 2020 and31st International Scientific Conference ICWST (pp. 7-11).
• Baharoğlu M., Nemli G., Sarı B., Bardak S., Ayrılmış N.[2012]: The influence of moisture content of raw material onthe physical and mechanical properties, surface roughness,wettability, and formaldehyde emission of particleboardcomposite. Composites Part B: Engineering, 43(5), 2448-2451. DOI: 10.1016/j.compositesb.2011.10.020.
• Costa N.A., Ohlmeyer M., Ferra J., Magalhães F.D., Mendes A.,Carvalho L. [2014]: The influence of scavengers on VOCemissions in particleboards made from pine and poplar.European Journal of Wood and Wood Products, 72, 117-121. DOI: 10.1007/s00107-013-0761-9.
• Costa N.A., Pereira J., Ferra J., Cruz P., Martins J.,Magalhães F.D., Mendes A., Carvalho L.H. [2013]:Scavengers for achieving zero formaldehyde emission ofwood-based panels. Wood Science and Technology 47:1261-1272. DOI: 10.1007/s00226-013-0573-4.
• Dinwoodie J. M. [1983]: Wood adhesives chemistry andtechnology (A. Pizzi, Ed., Vol. 1, pp. 1-58). MarcelDekker.
• Dorieh A., Selakjani P.P., Shahavi M.H., Pizzi A., MovahedS.G., Pour M.F., Aghaei R. [2022]: Recent developmentsin the performance of micro/nanoparticlemodifiedurea-formaldehyde resins used as wood-basedcomposite binders: A review. International Journal ofAdhesion and Adhesives, 114, 103106. DOI: 10.1016/j.ijadhadh.2022.103106.
• Eom Y.G., Kim J.S., Kim S., Kim J.A., Kim H.J. [2006]: Reductionof formaldehyde emission from particleboardsby bio-scavengers. Journal of the Korean Wood Scienceand Technology 34(5): 29-41.
• Ghani A., Ashaari Z., Bawon P., Lee S.H. [2018]: Reducingformaldehyde emission of urea formaldehyde-bondedparticleboard by addition of amines as formaldehydescavenger. Building and Environment 142: 188-194.DOI: 10.1016/j.buildenv.2018.06.020.
• Gurtekin A., Oguz M. [2006]: Mobilyavedekorasyongereçbilgisi, meslekivetekniköğretimokulları, MilsanBasınSan A.Ş., Istanbul, Turkey.
• Hassannejad H., Shalbafan A., Rahmaninia M. [2020]:Reduction of formaldehyde emission from medium densityfiberboard by chitosan as scavenger. The Journal ofAdhesion. DOI: 10.1080/00218464.2018.1515631.
• Hemmilä V., Adamopoulos S., Karlsson O., Kumar A.[2017]: Development of sustainable bio-adhesives forengineered wood panels—A review. RSC Advances 7,38604-38630.
• Hojo H., Fukai K., Nanjo F. [2000]: Application of greentea catechins as formaldehyde scavengers. Journal of theJapan Wood Research Society, 46(3), 231-37.
• Kord B., Movahedi F., Adlnasab L., Ayrilmis N. [2022]:Effect of novel scavengers based on phenolic compoundson formaldehyde emission and physical-mechanicalproperties of particleboard. Wood MaterialScience & Engineering, 17(6): 954-964. DOI:10.1080/17480272.2021.1978542.
• Kristak L., Antov P., Bekhta P., Lubis M. A. R., IswantoA.H., Reh R., Sedliacik J., Savov V., Taghiyari H.R.,Papadopoulos A.N., Pizzi A., Hejna A. [2023]: Recentprogress in ultra-low formaldehyde emitting adhesivesystems and formaldehyde scavengers in wood-basedpanels: A review. Wood Material Science & Engineering,18(2), 763-782. DOI: 10.1080/17480272.2022.2056080.
• Lee Y.K., Kim H.J. [2013]: Relationship between curingactivation energy and free formaldehyde contentin urea-formaldehyde resins. Journal of Adhesion Scienceand Technology, 27(5-6), 598-609. DOI: 10.1080/01694243.2012.690620.
• Lum W.C., Lee S.H., H’ng P.S. [2014]: Effects of formaldehydecatcher on some properties of particleboardwith different ratio of surface to core layer. Asian Journalof Applied Sciences 7(1): 22-29. DOI: 10.3923/ajaps.2014.22.29.
• Mantanis G.I., Athanassiadou E.T., Barbu M.C., WijnendaeleK. [2018]: Adhesive systems used in the Europeanparticleboard, MDF and OSB industries. Wood MaterialScience & Engineering, 13(2): 104-116. DOI: 10.1080/17480272.2017.1396622.
• Mantanis G.I., Athanassiadou E.T., Barbu M.C., WijnendaeleK. [2018]: Adhesive systems used in the Europeanparticleboard, MDF and OSB industries. Wood MaterialScience and Engineering 13(2), 104-116. DOI: 10.1080/17480272.2017.1396622.
• Myers G.E. [1984]: How mole ratio of UF resin affects formaldehydeemission and other properties: a literature critique.Forest Products Journal, 34(5), 35-41.
• Nakano K., Ando K., Takigawa M., Hattori N. [2018]: Lifecycle assessment of wood-based boards produced in Japanand impact of formaldehyde emissions during theuse stage. The International Journal of Life Cycle Assessment23: 957-969. DOI: 10.1007/s11367-017-1343-6.
• Neimsuwan T., Siramon P., Hengniran P., Punsuvon V.[2017]: Effect of tannin addition as a bio-scavenger onformaldehyde content in particleboard. Journal of TropicalForest Research 1(2): 45-56.
• Park B.D., Kang E.C., Park J.Y. [2008]: Thermal curingbehavior of modified urea‐formaldehyde resin adhesiveswith two formaldehyde scavengers and their influenceon adhesion performance. Journal of AppliedPolymer Science, 110(3), 1573-1580. DOI: 10.1002/app.28748.
• Pizzi A. [1983]: Wood adhesives chemistry and technology(A. Pizzi, Ed., Vol. 1, pp. 59-104). Marcel Dekker.
• Pizzi A., Mittal K.L. [2003]: Urea-formaldehyde adhesives.In Handbook of adhesive technology (2nd ed.).Marcel Dekker.
• Puttasukkha J., Khongtong S., Chaowana P. [2015]: Curingbehavior and bonding performance of urea formaldehyderesin admixed with formaldehyde scavenger. WoodResearch, 60(4), 645-654.
• Que Z., Furuno T., Katoh S., Nishino Y. [2007]: Evaluationof three test methods in determination of formaldehydeemission from particleboard bonded with differentmole ratio in the urea-formaldehyde resin. Buildingand Environment, 42(3), 1242-1249. DOI: 10.1016/j.buildenv.2005.11.026.
• Roffael E. [1993]: Formaldehyde release from particleboardand other wood based panels (pp. ix+-281). ISBN.978-983-9592-15-3.
• Sanivar N., Zorlu I. [1980]: AğaçişleriGereçBilgisi TemelDers Kitabı, Meslekive Teknik EğitimÖğretimKitapları[Woodworking Materials Knowledge Basic Textbook,Vocational and Technical Education Teaching Books],Milli EğitimBasımevi, İstanbul, Turkey.
• Selakjani P.P., Dorieh A., Pizzi A., Shahavi M.H.,Hasankhah A., Shekarsaraee S., Ashouri M., MovahedS.G., Abatari M.N. [2021]: Reducing free formaldehydeemission, improvement of thickness swellingand increasing storage stability of novel medium densityfiberboard by urea-formaldehyde adhesive modified byphenol derivatives. International Journal of Adhesionand Adhesives, 111, 102962.
• Silva D.A.L., Lahr F.A.R., Varanda L.D., Christoforo A.L.,Ometto A.R. [2015]: Environmental performance assessmentof the melamine-urea-formaldehyde (MUF)resin manufacture: A case study in Brazil. Journalof Cleaner Production, 96, 299-307. DOI: 10.1016/j.jclepro.2014.03.007.
• Tohmura S.I., Hse C.Y., Higuchi M. [2000]: Formaldehydeemission and high-temperature stability of curedurea-formaldehyde resins. Journal of Wood Science,46, 303-309.
• World Health Organization, [1989]: Formaldehyde/publishedunder the joint sponsorship of the United NationsEnvironment Programme, the International LabourOrganisation, and the World Health Organization.
• Zhang J., Kang H., Gao Q., Li J., Pizzi A., Delmotte L.[2014]: Performances of larch (Larix gmelini) tanninmodified urea–formaldehyde (TUF) resin and plywoodbonded by TUF resin. Journal of Applied PolymerScience, 131(22). DOI: 10.1002/app.41064.
• List of standards
• TS 4894 EN 120:1999 Wood based panels – Determinationof formaldehyde content – Extraction method calledthe perforator method, Turkish Standards Institution,Ankara, Turkey.
• TS 642 ISO 554:1997 Standard atmospheres for conditioningand/or testing; Specifications, Turkish Standards Institution,Ankara, Turkey.
• TS EN 309:1999 Particleboards – Definition and classification,Turkish Standards Institution, Ankara, Turkey.
• TS EN 310:1999 Wood-based panels – Determination of modulusof elasticity in bending and of bending strength, TurkishStandards Institution, Ankara, Turkey.
• TS EN 311:1999 Wood-based panels – Surface soundness – Tesmethod, Turkish Standards Institution, Ankara, Turkey.
• TS EN 312-1:1999 Particle boards – Specification – Part 1:General requirements for all board types, Turkish StandardsInstitution, Ankara, Turkey.
• TS EN 312-2:1999 Particleboards – Specifications – Part 2:Requirements for general purpose boards for use in dryconditions, Turkish Standards Institution, Ankara, Turkey.
• TS EN 312-3:1999 Particleboards – Specifications – Part 3:Requirements for boards for interior fitments (includingfurniture) for use in dry conditions, Turkish StandardsInstitution, Ankara, Turkey.
• TS EN 317:1999 Particleboards and fibreboards – Determinationof swelling in thickness after immersion in water,Turkish Standards Institution, Ankara, Turkey.
• TS EN 319:1999 Particleboards and fibreboards – Determinationof tensile strength perpendicular to the plane of theboard, Turkish Standards Institution, Ankara, Turkey.
• TS EN 323:1999 Wood- Based panels – Determination of density,Turkish Standards Institution, Ankara, Turkey.
• TS EN 325:1999 Wood-based panels – Determination of dimensionsof test pieces, Turkish Standards Institution,Ankara, Turkey.