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Thermo-mechanical stress analysis of dissimilar material joints using FEM

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Warianty tytułu
Języki publikacji
EN
Abstrakty
EN
This article presents numerical investigation of isotropic dissimilar material joints. Dissimilar material joints are broadly used in in various structures, including offshore, nuclear, electronic packaging, IC chip and spacecraft various fields of science and technology. In bi-material joints two different material are bonded with common interface region. High stress concentration occur at the interface of the joint under thermo-mechanical loadings due to the difference in the elastic properties and the thermal expansion coefficients of dissimilar materials.The stresses acting along the interface of dissimilar material joints are very important to determine whether the structure is reliable or not for operation. The main purpose of this research is to provide finite element solutions to predict the stress distribution at the interface of the joint based on the theory of elasticity.
Rocznik
Strony
147--153
Opis fizyczny
Bibliogr. 10 poz., rys., tab., wykr.
Twórcy
  • Faculty of Mechanical Engineering, Department Mechanical Engineering, Khulna University of Engineering & Technology, Bangladesh
Bibliografia
  • 1. Pahoja H.M. (1972) “Stress Analysis of an Adhesive Lap joint Subjected to Tension, Shear Force and Bending Moments”, Ph.D. Thesis, University of Illinois, Urbana-Champaign
  • 2. Koguchi H. (1997) “Stress singularity analysis in three-dimensional bonded structure”, Int. J. Solids Structures, Vol. 34, pp. 461-480
  • 3. Somadder S., Islam S. (2018) “Stress Analysis of a Cylinder Subjected to Thermo-mechanical Loads by Using FEM”, 4th Intl. Conf. on Structure, Processing and Properties of Materials, SPPM 2018
  • 4. Barut A., I. Guven, E. Madenci (2001) “Analysis of singular stress field at joints of multiple dissimilar materials under mechanical and thermal loading”, Int. J. Solids Structures, Vol. 38, pp. 9077-9109
  • 5. Koguchi H., Nakajima M. (2010) “Influence of interlayer thickness on the intensity of singular stress field in 3D three-layered joints under an external load”, Journal of solid mechanics and materials Engineering, Vol. 4, No 7
  • 6. Koguchi H., Tsukada Y., Kurahashi T. (2013) “Analysis of 3D strain singular field near the corner of SI chip using digital image correlation method”, InterPACK2013, Burlingame, CA, USA
  • 7. Luangarpa C., Koguchi H. (2014) “Analysis of a three-dimensional dissimilar material joint with one real singularity using a conservative integral”, International Journal of Solids and Structures
  • 8. Somadder S., Islam S. (2018) ”Stress Analysis of a Thick Walled Orthotropic Bonded Cylinder under Pressure and Temperature by Using FEM” International Journal of Mechatronics and Manufacturing Technology, Vol. 3, Issue 1, pp. 1-28
  • 9. Munz D., Matthais A., Yang Y.Y. (1995) “Thermal stress in ceramic-metal joints with an interlayer”, Journal of the American Ceramic Society, Vol. 77, pp. 285-290.
  • 10. Pengfei H., Ishikawa H., Kohno Y. (1995) “Analysis of order of stress singularity at the corner point of a diamond-shape rigid inclusion or hole in an infinite plate bending by conformal mapping”, Int. J. Engng. Sci, Vol. 33, pp. 1535-1546
Uwagi
PL
Opracowanie rekordu ze środków MNiSW, umowa Nr 461252 w ramach programu "Społeczna odpowiedzialność nauki" - moduł: Popularyzacja nauki i promocja sportu (2020).
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-1d47148b-f1fe-45a1-99e7-dff223e2d74d
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